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JPH03225890A Expired / Lapsed JP ⏱️ 0.0 years remaining

Printed wiring board

Assignee: NEC Corp
•
Filing: 1990-01-30
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Granted: —
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Expires: 2010-01-30
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Abstract

Abstract PURPOSE:To mount lead-equipped parts with high accuracy keeping electrical connection between the surface and the rear surface completely by providing a through-hole through which leads of the parts are inserted for soldering and a through-hole exclusive for connection between upper and lower wirings, both through-holes being connected to the same wiring. CONSTITUTION:Through-holes 2, 2a are provided on a ceramic board 1 in an adjacent manner, and a metallized layer 3 is provided on the inner walls of the through-holes. Then, there are provided upper and lower surfaces of the ceramic board 1, which are electrically connected via the through-holes 2, 2a. Further, a protective film 6 is provided on the surface including the through-hole 2a and the wirings 4, 5 other than a terminal region to construct a printed wiring board. Upon parts packaging, a lead 8 of parts 7 is inserted into the through-hole 2a and joined with the same by a solder 9. Hereby, high reliability is assured for electrical connection between the surface and the back surface.

Inventors

  • 👤 Toshiaki Nishikawa
  • 👤 敏明 西川

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-01 15:45
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0094; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K3/3452

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