US4238527A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of providing metal bumps on an apertured substrate
Assignee: US Philips Corp
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Filing: 1978-09-11
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Granted: 1980-12-09
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Expires: 1998-09-11
Abstract
Abstract Method of providing metal bumps on an apertured substrate and substrate having metal bumps.
Inventors
- 👤 Michel J. C. Monnier
- 👤 Marc A. Monneraye
- 👤 Claude Foucher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 03:21
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/40; H05K3/4007; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09827; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K2203/00; H05K2203/03; H05K2203/0338; H05K2203/04; H05K2203/043; H05K2203/07; H05K2203/0756; H05K2203/0769
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
138 words
A method of providing meltable metal bumps on the surface of an insulating substrate which is provided with metal conductors, said substrate comprising metallized holes, the metallization of the holes being connected to the conductors and at least said metallization being covered with a meltable soldering material, characterized in that a resin is provided on a surface of the substrate at least at the area of the holes, the viscosity of said resin being such that it cannot flow into the holes and that the resin is heated at the area of the holes, due to which on the side of the resin facing the holes a spherical surface is formed adjoining the holes and remote therefrom, while soldering material melted as a result of the heating flows past said spherical surfaces and, after cooling, forms metal bumps.
Claim 2
Independent Claim
138 words
A method of providing meltable metal bumps on the surface of an insulating substrate which is provided with metal conductors, said substrate comprising metallized holes, the metallization of the holes being connected to the conductors and at least said metallization being covered with a meltable soldering material, characterized in that a resin is provided on a surface of the substrate at least at the area of the holes, the viscosity of said resin being such that it cannot flow into the holes and that the resin is heated at the area of the holes, due to which on the side of the resin facing the holes a spherical surface is formed adjoining the holes and remote therefrom, while soldering material melted as a result of the heating flows past said spherical surfaces and, after cooling, forms metal bumps.
Claim 3
Dependent Claim
19 words
A method as claimed in claim 1, characterized in that the resin is heated by means of infrared radiation.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-12-09 | 1984-06-09 | 1984-12-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-12-09 | 1988-06-09 | 1988-12-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-12-09 | 1992-06-09 | 1992-12-09 | $7700.00 | Window Closed / Lapsed |