US5092035A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making printed circuit board assembly
Assignee: Motorola Solutions Inc
•
Filing: 1990-09-10
•
Granted: 1992-03-03
•
Expires: 2010-09-10
Abstract
Abstract A first set of plated-through holes in the printed circuit board (PCB) are covered by a protective solder mask on the solder side of the PCB while a second set of plated-through holes are exposed. Electrical components are disposed on the component side with leads inserted in the second set of holes. Solder is prevented from flowing into the first set of holes during wave soldering by the mask covering. Conductive pins designed for press fitting into the first set of holes are inserted therethrough to define connecting pins on each side of the PCB following wave soldering. This permits both a wave soldering and press fit operation to be accommodated.
Inventors
- 👤 T. Blane McMichen
- 👤 Kerry J. McMullen
- 👤 John A. Sudanowicz, III
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 20:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/306; H05K3/308; H05K3/0094; H05K3/3452; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10295; H05K2201/10303; H05K2201/10431; H05K2201/1059; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/1081; H05K2203/00; H05K2203/11; H05K2203/1189; H05K2203/13; H05K2203/1377; H05K2203/1394; H05K3/3447; H05K3/3465; H05K3/3468; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149; Y10T29/49151; Y10T29/49153
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
155 words
A method for manufacturing a printed circuit board (PCB) assembly comprising the steps of: forming conductors on at least one surface of the PCB, said PCB having a component side and a solder side; forming a first and second set of plated-through holes in said PCB; depositing a mask layer on said solder side of the PCB such that said first set of holes are covered and said second set of holes are exposed; inserting components onto said component side of said PCB using said second set of holes; passing said solder side of the PCB over a solder wave thereby soldering said second set of holes and components therein; inserting conductive pins into said first set of holes so that said pins project outward from both said component and solder sides of the PCB, said pins dimensioned to make a press fit into said first set of holes so that electrical contacts are formed.
Claim 2
Independent Claim
155 words
A method for manufacturing a printed circuit board (PCB) assembly comprising the steps of: forming conductors on at least one surface of the PCB, said PCB having a component side and a solder side; forming a first and second set of plated-through holes in said PCB; depositing a mask layer on said solder side of the PCB such that said first set of holes are covered and said second set of holes are exposed; inserting components onto said component side of said PCB using said second set of holes; passing said solder side of the PCB over a solder wave thereby soldering said second set of holes and components therein; inserting conductive pins into said first set of holes so that said pins project outward from both said component and solder sides of the PCB, said pins dimensioned to make a press fit into said first set of holes so that electrical contacts are formed.
Claim 3
Dependent Claim
62 words
The method according to claim 1 wherein said pin inserting step further comprises the step of inserting said pins from said component side of the PCB so that the ends of said pins engaged and break the mask layer covering the respective holes in said first set of holes causing such mask layer to be broken outwardly and away from the holes.
Claim 4
Dependent Claim
32 words
The method according to claim 1 wherein said pin inserting step comprises the step of pressing a connector assembly comprising a plurality of pins substantially simultaneously into said first set of holes.
Claim 5
Dependent Claim
34 words
The method according to claim 1 further comprising the step of placing said solder side of the PCB on a holding fixture prior to said pins being pressed into said first set of holes.
Claim 6
Dependent Claim
31 words
The method according to claim 1 further comprising the step of making said mask layer which covers said first set of holes more brittle by heating same with said solder wave.
References Cited (Backward Citations)
US3535769A
Cited
US3834015A
Cited
US3932934A
Cited
DE2807874A1
Cited
US4216576A
Cited
DE2840890A1
Cited
DE2938254A1
Cited
US4551914A
Cited
US4641426A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-03 | 1995-09-02 | 1996-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-03 | 1999-09-02 | 2000-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-03 | 2003-09-02 | 2004-03-03 | $7700.00 | Window Closed / Lapsed |