US5731633A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin multichip module
Assignee: Individual
•
Filing: 1993-10-18
•
Granted: 1998-03-24
•
Expires: 2013-10-18
Abstract
Abstract An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the subassembly(s), comprising a cover plate with the composite substrate attached thereto, is permanently attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. In other embodiments, the subassembly(s) are removably attached to a module frame socket. The composite substrate employed in the present invention offers the advantages of allowing the components to be pre-assembled, tested and repaired prior to final attachment into the molded frame, and aids in the transfer of heat away from the semiconductor devices operating thereon. The module frame provides a protective enclosure for the multichip semiconductor devices and can be molded for compatible mating with existing SIMM sockets. Other high density contact means provide a greater interconnect capability.
Inventors
- 👤 James E. Clayton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 18:07
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H01; H01R; H01R12/00; H01R12/70; H01R12/71; H01R12/72; H01R12/721; H01R12/77; H01R12/79; H10W42/00; H10W70/00; H10W70/40; H10W70/479; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/688; H10W78/00; H10W90/00; H10W90/401; H10W90/701; H01R4/00; H01R4/04; H10W70/682; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W74/15; H10W90/20; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49126; Y10T29/4913
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
124 words
A thin multichip module, comprising, in combination: a frame defining an interior portion; a plurality of electrical contacts disposed on said frame; a composite substrate comprising a cover plate portion having heat dissipation capabilities, a thin laminate circuit and means affixing said cover plate to said thin laminate circuit; semiconductor devices mounted on said composite substrate to form a substrate subassembly, wherein said semiconductor devices are in electrical connection with said laminate circuit and in thermal proximity to said cover plate; and means to mount said substrate subassembly to said frame whereby at least a portion of said substrate assembly is maintained within said interior portion of the frame and the substrate subassembly is in electrical communication with said electrical contacts on said frame.
Claim 2
Dependent Claim
124 words
A thin multichip module, comprising, in combination: a frame defining an interior portion; a plurality of electrical contacts disposed on said frame; a composite substrate comprising a cover plate portion having heat dissipation capabilities, a thin laminate circuit and means affixing said cover plate to said thin laminate circuit; semiconductor devices mounted on said composite substrate to form a substrate subassembly, wherein said semiconductor devices are in electrical connection with said laminate circuit and in thermal proximity to said cover plate; and means to mount said substrate subassembly to said frame whereby at least a portion of said substrate assembly is maintained within said interior portion of the frame and the substrate subassembly is in electrical communication with said electrical contacts on said frame.
Claim 3
Dependent Claim
18 words
The module of claim 1, wherein said cover plate includes a battery to selectively power said semiconductor devices.
Claim 4
Dependent Claim
29 words
The module of claim 2, wherein one of said semiconductor devices comprises a sensing device coupled to said battery which enables said battery when a power change is detected.
Claim 5
Dependent Claim
24 words
The module of claim 1, wherein said cover plate establishes an electrical ground potential across said cover plate to function as an electromagnetic shield.
Claim 6
Dependent Claim
19 words
The module of claim 1, wherein said cover plate includes a display means for displaying text or graphical information.
Claim 7
Dependent Claim
41 words
The module of claim 1, wherein said means affixing said cover plate to said thin laminate circuit comprises a film adhesive positioned between said cover plate and said thin laminate circuit which bonds said thin laminate circuit to said cover plate.
Claim 8
Dependent Claim
24 words
The module of claim 1, wherein said thin laminate circuit includes windows to enhance thermal conduction from said semiconductor devices to said cover plate.
Claim 9
Dependent Claim
60 words
The module of claim 7, wherein said means affixing said cover plate to said thin laminate circuit comprises a film adhesive positioned between said cover plate and said thin laminate circuit which bonds said thin laminate circuit to said cover plate; and wherein said film adhesive includes windows to enhance thermal conduction from said semiconductor devices to said cover plate.
Claim 10
Dependent Claim
24 words
The module of claim 1, wherein said laminate circuit includes thermal vias to enhance thermal conduction from said semiconductor devices to said cover plate.
Claim 11
Dependent Claim
39 words
The module of claim 1, wherein said frame includes a stepped ledge in said interior portion; and wherein said means to mount said substrate subassembly to said frame mounts said substrate subassembly to said stepped ledge of said frame.
Claim 12
Dependent Claim
35 words
The module of claim 10, wherein said means to mount said substrate subassembly to said frame comprises a rectangular ring formed from an anisotropic, electrically conducting material which affixes said composite substrate to said frame.
Claim 13
Dependent Claim
15 words
The module of claim 11, wherein said rectangular ring is positioned on said stepped ledge.
Claim 14
Dependent Claim
25 words
The module of claim 1, wherein said semiconductor devices include one or more stacks of semiconductor devices mounted at various locations on said composite substrate.
Claim 15
Dependent Claim
15 words
The module of claim 1, wherein said interior portion of said frame includes a floor.
Claim 16
Dependent Claim
33 words
The module of claim 14, further comprising: a second thin laminate circuit integrated onto said floor of said frame; and a second plurality of semiconductor devices mounted to said second thin laminate circuit.
Claim 17
Dependent Claim
24 words
The module of claim 1, wherein one of said semiconductor devices comprises a security device which emits detection signals in response to a scanner.
Claim 18
Dependent Claim
27 words
The module of claim 1, wherein one of said semiconductor devices comprises a security device which requires an access code before allowing said module to become operational.
Claim 19
Dependent Claim
29 words
The module of claim 1, wherein said frame and said plurality of electrical contacts disposed on said frame are adapted for mating with a single in-line memory module socket.
Claim 20
Dependent Claim
18 words
The module of claim 1, wherein said substrate subassembly has a thickness ranging between 0.010 and 0.040 inches.
Claim 21
Dependent Claim
16 words
The module of claim 1, wherein said multichip module has a thickness of approximately 0.050 inches.
Claim 22
Dependent Claim
26 words
The module of claim 1, wherein said frame and said plurality of electrical contacts disposed on said frame are adapted for mating with a PCMCIA socket.
Claim 23
Dependent Claim
112 words
A thin multichip module, comprising, in combination: a frame defining an interior portion; a plurality of electrical contacts disposed on said frame; a composite substrate comprising a cover plate portion having heat dissipation capabilities and a thin laminate circuit attached to said cover plate portion, wherein said composite substrate is attached to said frame, and wherein the laminate circuit is in electrical communication with said electrical contacts on said frame; semiconductor devices mounted on said composite substrate, wherein said semiconductor devices are in electrical connection with said laminate circuit and in thermal proximity to said cover plate, whereby portions of said semiconductor devices are maintained within said interior portion of the frame.
Claim 24
Dependent Claim
112 words
A thin multichip module, comprising, in combination: a frame defining an interior portion; a plurality of electrical contacts disposed on said frame; a composite substrate comprising a cover plate portion having heat dissipation capabilities and a thin laminate circuit attached to said cover plate portion, wherein said composite substrate is attached to said frame, and wherein the laminate circuit is in electrical communication with said electrical contacts on said frame; semiconductor devices mounted on said composite substrate, wherein said semiconductor devices are in electrical connection with said laminate circuit and in thermal proximity to said cover plate, whereby portions of said semiconductor devices are maintained within said interior portion of the frame.
Claim 25
Dependent Claim
189 words
A thin multichip module, comprising, in combination: a frame having a floor defining first and second interior portions; a plurality of electrical contacts disposed on said frame; first and second composite substrates each comprising a cover plate portion having heat dissipation capabilities, a thin laminate circuit and means affixing said cover plate to said thin laminate circuit; semiconductor devices mounted on said first and second composite substrates to form first and second substrate subassemblies, wherein said semiconductor devices are in electrical connection with said laminate circuit and in thermal proximity to said cover plate; first attaching means to attach said first substrate subassembly to said frame whereby at least a portion of said first substrate assembly is maintained within said first interior portion of the frame and the substrate subassembly is in electrical communication with said electrical contacts on said frame; and second attaching means to attach said second substrate subassembly to said frame whereby at least a portion of said second substrate assembly is maintained within said second interior portion of the frame and the substrate subassembly is in electrical communication with said electrical contacts on said frame.
Claim 26
Dependent Claim
189 words
A thin multichip module, comprising, in combination: a frame having a floor defining first and second interior portions; a plurality of electrical contacts disposed on said frame; first and second composite substrates each comprising a cover plate portion having heat dissipation capabilities, a thin laminate circuit and means affixing said cover plate to said thin laminate circuit; semiconductor devices mounted on said first and second composite substrates to form first and second substrate subassemblies, wherein said semiconductor devices are in electrical connection with said laminate circuit and in thermal proximity to said cover plate; first attaching means to attach said first substrate subassembly to said frame whereby at least a portion of said first substrate assembly is maintained within said first interior portion of the frame and the substrate subassembly is in electrical communication with said electrical contacts on said frame; and second attaching means to attach said second substrate subassembly to said frame whereby at least a portion of said second substrate assembly is maintained within said second interior portion of the frame and the substrate subassembly is in electrical communication with said electrical contacts on said frame.
Claim 27
Dependent Claim
30 words
The module of claim 23, further comprising: means for electrically connecting said thin laminate circuit in said first composite substrate to said thin laminate circuit in said second composite substrate.
Claim 28
Dependent Claim
25 words
The module of claim 23, wherein said frame and said plurality of electrical contacts are adapted for mating with a single in-line memory module socket.
Claim 29
Dependent Claim
22 words
The module of claim 23, wherein said frame and said plurality of electrical contacts are adapted for mating with a PCMCIA socket.
Claim 30
Dependent Claim
55 words
The module of claim 23, wherein said floor includes first and second surfaces comprised in said first and second interior portions, respectively, the module further comprising: third and fourth thin laminate circuits integrated onto said first and second surfaces of said floor, respectively; and semiconductor devices mounted to said third and fourth thin laminate circuits.
Claim 31
Dependent Claim
25 words
The module of claim 27, wherein said frame and said plurality of electrical contacts are adapted for mating with a single in-line memory module socket.
Claim 32
Dependent Claim
22 words
The module of claim 27, wherein said frame and said plurality of electrical contacts are adapted for mating with a PCMCIA socket.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-23 | 2001-09-22 | 2002-03-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-23 | 2005-09-22 | 2006-03-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-23 | 2009-09-22 | 2010-03-24 | $7700.00 | Window Closed / Lapsed |