Foldable electronic assembly module

Claim 1

An electronic assembly which comprises: a flexible, insulating substrate having a network of conductive leads and connecting stations applied thereto; at least two substantially quadrangular circuit boards; each of said boards laminarly split into substantially symmetric half-sections; each of said half-sections having pads on a first face for mounting electronic components; each of said half-sections having an opposite second face bonded to said substrate; said half-sections laminated together on either side of a portion of the substrate sandwiched therebetween; said boards bonded in a side-by-side, parallely spaced-apart configuration; a first of said boards having a comb of connecting terminals integral with said first board along a first edge; said comb sized and dimensioned to engage a connecting port on a supporting structure; a plurality of feed-through connections on each of said boards interconnecting a plurality of said pads and terminals with said connecting stations; wherein any gap between two parallely spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; said gap being wide enough to allow for an air space between any opposite facing components attached to separate boards; and, said gap having no components attached thereto.