Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
195 words
A method of producing a thin film transistor, comprising the steps of: providing a substrate having insulating properties and providing a gate on a surface of the substrate; forming an insulating film, including in sequence a silicon nitride film and a gate insulating film which is comprised of a silicon oxide film over the substrate and gate, and then forming a polycrystalline silicon film on an upper surface of said insulating film; depositing a silicon oxide film on said polycrystalline silicon film, and then patterning said silicon oxide film to form a silicon oxide film pattern on said polycrystalline silicon film directly above said gate; successively forming a hydrogen-containing amorphous silicon film, a conductive silicon film, and a metal film on said polycrystalline silicon film so as to cover said silicon oxide film pattern; introducing hydrogen from said amorphous silicon film into said polycrystalline silicon film, and also activating conductive impurities in said conductive silicon film by heat treatment; and patterning said metal film, said conductive silicon film, and said amorphous silicon film to form source/drain regions extending from over edges of said silicon oxide film pattern laterally outwardly from said silicon oxide film pattern.
Claim 2
Independent Claim
195 words
A method of producing a thin film transistor, comprising the steps of: providing a substrate having insulating properties and providing a gate on a surface of the substrate; forming an insulating film, including in sequence a silicon nitride film and a gate insulating film which is comprised of a silicon oxide film over the substrate and gate, and then forming a polycrystalline silicon film on an upper surface of said insulating film; depositing a silicon oxide film on said polycrystalline silicon film, and then patterning said silicon oxide film to form a silicon oxide film pattern on said polycrystalline silicon film directly above said gate; successively forming a hydrogen-containing amorphous silicon film, a conductive silicon film, and a metal film on said polycrystalline silicon film so as to cover said silicon oxide film pattern; introducing hydrogen from said amorphous silicon film into said polycrystalline silicon film, and also activating conductive impurities in said conductive silicon film by heat treatment; and patterning said metal film, said conductive silicon film, and said amorphous silicon film to form source/drain regions extending from over edges of said silicon oxide film pattern laterally outwardly from said silicon oxide film pattern.
Claim 3
Dependent Claim
43 words
A method of producing a thin film transistor according to claim 1, including the step of providing an oxide film on a surface of the gate which lies beneath said silicon nitride film when said silicon nitride film is formed over the gate.
Claim 4
Dependent Claim
34 words
The method of producing a thin film transistor according to claim 2 including the step of providing said oxide film on the surface of the gate by anodizing a surface layer of the gate.
Claim 5
Dependent Claim
29 words
The method of producing a thin film transistor according to claim 2 including the step of providing said oxide film on the surface of the gate by plasma oxidation.
Claim 6
Dependent Claim
35 words
The method of producing a thin film transistor according to claim 1, wherein said gate is composed of at least one element selected from the group consisting of molybdenum, tantalum, chromium, copper, titanium, and aluminum.