Patent US5724729A successfully refreshed from Google Patents.
US5724729A
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Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials
Assignee: GlobalFoundries Inc
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Filing: 1996-04-15
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Granted: 1998-03-10
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Expires: 2016-04-15
Abstract
Abstract The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
Inventors
- 👤 Raed A. Sherif
- 👤 Mark Gerard Courtney
- 👤 David Linn Edwards
- 👤 Albert Joseph Fahey
- 👤 Gregory Scott Hopper
- 👤 Sushumna Iruvanti
- 👤 Charles Frederick Jones
- 👤 Gaetano Paolo Messina
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:34
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H10W40/70; H10W44/00; H10W44/601; H10W90/00; H10W72/00; H10W72/01; H10W72/013; H10W72/01308; H10W72/071; H10W72/073; H10W72/07311; H10W72/851; H10W72/874; H10W72/877; H10W72/879; H10W72/90; H10W72/931; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/736; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
111 words
A method to provide a customized thermally conductive path between a plurality of chips and a thermal cap, comprising the steps of: (a) securing said chips to a substrate, (b) placing at least one first thermally conductive material on a first chip, and at least one second thermally conductive material on a second chip, wherein the thermal conductivity of said first thermally conductive material is different than the thermal conductivity of said second thermally conductive material, and wherein said at least one first thermally conductive material is selected from a group consisting of thermal oil, thermal paste, thermal grease and thermal compound, and (c) securing said thermal cap to said substrate.
Claim 2
Independent Claim
111 words
A method to provide a customized thermally conductive path between a plurality of chips and a thermal cap, comprising the steps of: (a) securing said chips to a substrate, (b) placing at least one first thermally conductive material on a first chip, and at least one second thermally conductive material on a second chip, wherein the thermal conductivity of said first thermally conductive material is different than the thermal conductivity of said second thermally conductive material, and wherein said at least one first thermally conductive material is selected from a group consisting of thermal oil, thermal paste, thermal grease and thermal compound, and (c) securing said thermal cap to said substrate.
Claim 3
Dependent Claim
21 words
The method of claim 1, wherein the heat generation of said first chip is different than that of said second chip.
Claim 4
Dependent Claim
30 words
The method of claim 1, wherein said at least one second thermally conductive material is selected from a group consisting of thermal oil, thermal paste, thermal grease and thermal compound.
Claim 5
Dependent Claim
29 words
The method of claim 1, wherein at least a portion of at least one of said chips is secured to a substrate using at least one first electrical connection.
Claim 6
Dependent Claim
32 words
The method of claim 4, wherein said at least one first electrical connection is selected from a group consisting of C4, solder ball, solder column, low-melting point solder or high-melting point solder.
Claim 7
Dependent Claim
17 words
The method of claim 1, wherein said substrate has at least one additional electronic device secured thereto.
Claim 8
Dependent Claim
17 words
The method of claim 6, wherein said at least one additional electronic device is a decoupling capacitor.
Claim 9
Dependent Claim
29 words
The method of claim 1, wherein said at least one first thermally conductive material fills at least a portion of the area between said thermal cap and said substrate.
Claim 10
Dependent Claim
55 words
The method of claim 1, wherein said at least one first thermally conductive material fills at least a portion of the area between said thermal cap and said substrate, and wherein said at least one first thermally conductive material is selected from a group consisting of thermal oil, thermal paste, thermal grease and thermal compound.
Claim 11
Dependent Claim
20 words
The method of claim 1, wherein at least a portion of said thermal cap is directly secured to said substrate.
Claim 12
Dependent Claim
44 words
The method of claim 1, wherein at least a portion of said thermal cap is secured to said substrate by at least one means, and wherein said at least one means is selected from a group consisting of solder, screws, adhesive and mechanical clamps.
Claim 13
Dependent Claim
30 words
The method of claim 1, wherein said thermal cap has at least one blind hole to accommodate at least a portion of said at least one first thermally conductive material.
Claim 14
Dependent Claim
32 words
The method of claim 12, wherein the cross-section of said at least one blind hole is selected from a group consisting of square shape, circular shape, triangular shape or a polygonal shape.
Claim 15
Dependent Claim
40 words
The method of claim 1, wherein said thermal cap has at least one blind hole facing said substrate, and wherein said at least one first thermally conductive material fills at least a portion of said at least one blind hole.
Claim 16
Dependent Claim
40 words
The method of claim 1, wherein said thermal cap has at least one blind hole facing said substrate, and wherein said at least one second thermally conductive material fills at least a portion of said at least one blind hole.
Claim 17
Dependent Claim
34 words
The method of claim 1, wherein said at least one first thermally conductive material is selected from the group consisting of high thermally conductive material, low thermally conductive material or intermediate thermally conductive material.
Claim 18
Dependent Claim
34 words
The method of claim 1, wherein said at least one second thermally conductive material is selected from the group consisting of high thermally conductive material, low thermally conductive material or intermediate thermally conductive material.
Claim 19
Dependent Claim
33 words
The method of claim 1, wherein said thermal cap has at least two blind holes facing said substrate, and wherein said first blind hole has a different cross-section than said second blind hole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-09 | 2001-09-08 | 2002-03-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-09 | 2005-09-08 | 2006-03-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-09 | 2009-09-08 | 2010-03-10 | $7700.00 | Window Closed / Lapsed |