US5723903A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin type semiconductor device, module structure using the device and method of mounting the device on board
Assignee: Renesas Electronics Corp
•
Filing: 1995-06-07
•
Granted: 1998-03-03
•
Expires: 2015-06-07
Abstract
Abstract Ends of inner leads are disposed in the vicinity of a peripheral end of a semiconductor chip and a portion of an insulating film tape is affixed to a main surface of the semiconductor chip by an adhesive while other portions of the insulating film tape are affixed to portions of the inner leads by an adhesive. Electrode pads provided in the main surface of the semiconductor chip are electrically connected to the ends of the corresponding inner leads by bonding wires, and the semiconductor chip, the inner leads, the electrode pads, the insulating film tape and the bonding wares are sealed by a resin molding. The thickness of the insulating film tape is smaller than a height from the main surface of the semiconductor chip to an apex of the bonding wire. Surfaces of the ends of the inner leads connected to the bonding wires are positioned lower than the main surface of the semiconductor chip and the inner leads are positioned between the main surface and an opposite surface of the semiconductor chip.
Inventors
- 👤 Masachika Masuda
- 👤 Tamaki Wada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 19:13
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/413; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W70/456; H10W70/457; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H05K1/00; H05K1/02; H05K1/14; H05K1/145; H05K1/18; H05K1/181; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/075; H10W72/30; H10W72/321; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W90/20; H10W90/701; H10W90/721; H10W90/722; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
281 words
A semiconductor device comprising: a semiconductor chip having a rectangular plate shape, said semiconductor chip including an integrated circuit and external terminals formed in a main surface thereof; a plurality of leads disposed in the vicinity of a periphery of said semiconductor chip, each of said plurality of leads having an inner lead portion and an outer lead portion; means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads; and a resin molding for sealing said semiconductor chip and said inner lead portion of each of said plurality of leads, said resin molding having an upper flat surface and a lower flat surface facing to said upper flat surface, wherein said outer lead portion of each of said plurality of leads includes a first portion protruding outwardly from a substantially central position of said resin molding in a thickness direction of said resin molding and extending in a direction substantially parallel with said upper and lower flat surfaces, a second portion bent from said first portion toward said upper flat surface, a third portion extending outwardly from said second portion and in said direction substantially parallel with said upper and lower flat surfaces, a fourth portion bent from said third portion toward said lower flat surface and a fifth portion extending inwardly from said fourth portion and in said direction substantially parallel with said upper and lower flat surfaces, wherein said third portion of said outer lead portion extends to the substantially same level as said upper flat surface, and wherein said fifth portion of said outer lead portion extends in a lower level than said lower flat surface.
Claim 2
Dependent Claim
281 words
A semiconductor device comprising: a semiconductor chip having a rectangular plate shape, said semiconductor chip including an integrated circuit and external terminals formed in a main surface thereof; a plurality of leads disposed in the vicinity of a periphery of said semiconductor chip, each of said plurality of leads having an inner lead portion and an outer lead portion; means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads; and a resin molding for sealing said semiconductor chip and said inner lead portion of each of said plurality of leads, said resin molding having an upper flat surface and a lower flat surface facing to said upper flat surface, wherein said outer lead portion of each of said plurality of leads includes a first portion protruding outwardly from a substantially central position of said resin molding in a thickness direction of said resin molding and extending in a direction substantially parallel with said upper and lower flat surfaces, a second portion bent from said first portion toward said upper flat surface, a third portion extending outwardly from said second portion and in said direction substantially parallel with said upper and lower flat surfaces, a fourth portion bent from said third portion toward said lower flat surface and a fifth portion extending inwardly from said fourth portion and in said direction substantially parallel with said upper and lower flat surfaces, wherein said third portion of said outer lead portion extends to the substantially same level as said upper flat surface, and wherein said fifth portion of said outer lead portion extends in a lower level than said lower flat surface.
Claim 3
Dependent Claim
32 words
A semiconductor device according to claim 1, wherein a width of said outer lead portion in said thickness direction of said resin molding is larger than a thickness of said resin molding.
Claim 4
Dependent Claim
18 words
A semiconductor device according to claim 2, wherein said thickness of said resin molding is approximately 0.5 mm.
Claim 5
Dependent Claim
35 words
A semiconductor device according to claim 1, wherein said means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads is a bonding wire.
Claim 6
Dependent Claim
19 words
A semiconductor device according to claim 1, wherein said integrated circuit of said semiconductor chip includes a memory circuit.
Claim 7
Dependent Claim
363 words
A module structure comprising: a wiring board; and a first and a second semiconductor device mounted on said wiring board, said second semiconductor device being stacked on said first semiconductor device, each of said first and second semiconductor devices comprising: a semiconductor chip having a rectangular plate shape, said semiconductor chip including an integrated circuit and external terminals formed in a main surface thereof; a plurality of leads disposed in the vicinity of a periphery of said semiconductor chip, each of said plurality of leads having an inner lead portion and an outer lead portion; means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads; and a resin molding for sealing said semiconductor chip and said inner lead portion of each of said plurality of leads, said resin molding having an upper flat surface and a lower flat surface facing said upper flat surface, wherein said outer lead portion of each of said plurality of leads includes a first portion protruding outwardly from a substantially central position of said resin molding in a thickness direction of said resin molding and extending in a direction substantially parallel with said upper and lower flat surfaces, a second portion bent from said first portion toward said upper flat surface, a third portion extending outwardly from said second portion and in said direction substantially parallel with said upper and lower flat surfaces, a fourth portion bent from said third portion toward said lower flat surface and a fifth portion extending inwardly from said fourth portion and in said direction substantially parallel with said upper and lower flat surfaces, wherein said third portion of said outer lead portion extends to the substantially same level as said upper flat surface, wherein said fifth portion of said outer lead portion extends in a lower level than said lower flat surface, wherein said fifth portion of said outer lead of said first semiconductor device is soldered to said wiring board, and wherein said fifth portion of said outer lead of said second semiconductor device is soldered to said third portion of said outer lead of said first semiconductor device.
Claim 8
Dependent Claim
363 words
A module structure comprising: a wiring board; and a first and a second semiconductor device mounted on said wiring board, said second semiconductor device being stacked on said first semiconductor device, each of said first and second semiconductor devices comprising: a semiconductor chip having a rectangular plate shape, said semiconductor chip including an integrated circuit and external terminals formed in a main surface thereof; a plurality of leads disposed in the vicinity of a periphery of said semiconductor chip, each of said plurality of leads having an inner lead portion and an outer lead portion; means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads; and a resin molding for sealing said semiconductor chip and said inner lead portion of each of said plurality of leads, said resin molding having an upper flat surface and a lower flat surface facing said upper flat surface, wherein said outer lead portion of each of said plurality of leads includes a first portion protruding outwardly from a substantially central position of said resin molding in a thickness direction of said resin molding and extending in a direction substantially parallel with said upper and lower flat surfaces, a second portion bent from said first portion toward said upper flat surface, a third portion extending outwardly from said second portion and in said direction substantially parallel with said upper and lower flat surfaces, a fourth portion bent from said third portion toward said lower flat surface and a fifth portion extending inwardly from said fourth portion and in said direction substantially parallel with said upper and lower flat surfaces, wherein said third portion of said outer lead portion extends to the substantially same level as said upper flat surface, wherein said fifth portion of said outer lead portion extends in a lower level than said lower flat surface, wherein said fifth portion of said outer lead of said first semiconductor device is soldered to said wiring board, and wherein said fifth portion of said outer lead of said second semiconductor device is soldered to said third portion of said outer lead of said first semiconductor device.
Claim 9
Dependent Claim
57 words
A module structure according to claim 6, wherein said lower flat surface of said resin molding of said first semiconductor device is spaced from said wiring board, and wherein said lower surface of said resin molding of said second semiconductor device is spaced from said upper flat surface of said resin molding of said first semiconductor device.
Claim 10
Dependent Claim
41 words
A module structure according to claim 6, wherein a width of said outer lead portion of each of said first and second semiconductor devices in said thickness direction of said resin molding is larger than a thickness of said resin molding.
Claim 11
Dependent Claim
18 words
A semiconductor device according to claim 8, wherein said thickness of said resin molding is approximately 0.5 mm.
Claim 12
Dependent Claim
44 words
A semiconductor device according to claim 6, wherein said means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads in each of said first and second semiconductor devices is a bonding wire.
Claim 13
Dependent Claim
28 words
A semiconductor device according to claim 6, wherein said integrated circuit of said semiconductor chip in each of said first and second semiconductor devices includes a memory circuit.
Claim 14
Dependent Claim
212 words
A semiconductor device comprising: a semiconductor chip having a rectangular plate shape, said semiconductor chip including an integrated circuit and external terminals formed in a main surface thereof; a plurality of leads disposed in the vicinity of a periphery of said semiconductor chip, each of said plurality of leads having an inner lead portion and an outer lead portion; means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads; and a body for sealing said semiconductor chip and said inner lead portion of each of said plurality of leads, said body having a first surface, a second surface facing said first surface and a third surface between said first and second surfaces, wherein said outer lead portion of each of said plurality of leads protrudes outwardly from said third surface of said body and includes a first portion and a second portion, wherein said first portion of said outer lead portion extends in a direction substantially parallel with said first surface and to the substantially same level as said first surface, and wherein said second portion of said outer lead portion extends in a direction substantially parallel with said second surface and in a lower level than said second surface.
Claim 15
Dependent Claim
212 words
A semiconductor device comprising: a semiconductor chip having a rectangular plate shape, said semiconductor chip including an integrated circuit and external terminals formed in a main surface thereof; a plurality of leads disposed in the vicinity of a periphery of said semiconductor chip, each of said plurality of leads having an inner lead portion and an outer lead portion; means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads; and a body for sealing said semiconductor chip and said inner lead portion of each of said plurality of leads, said body having a first surface, a second surface facing said first surface and a third surface between said first and second surfaces, wherein said outer lead portion of each of said plurality of leads protrudes outwardly from said third surface of said body and includes a first portion and a second portion, wherein said first portion of said outer lead portion extends in a direction substantially parallel with said first surface and to the substantially same level as said first surface, and wherein said second portion of said outer lead portion extends in a direction substantially parallel with said second surface and in a lower level than said second surface.
Claim 16
Dependent Claim
29 words
A semiconductor device according to claim 12, wherein a distance between said first and second portions of said outer lead portion is larger than a thickness of said body.
Claim 17
Dependent Claim
18 words
A semiconductor device according to claim 13, wherein said thickness of said resin molding is approximately 0.5 mm.
Claim 18
Dependent Claim
35 words
A semiconductor device according to claim 12, wherein said means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads is a bonding wire.
Claim 19
Dependent Claim
19 words
A semiconductor device according to claim 12, wherein said integrated circuit of said semiconductor chip includes a memory circuit.
Claim 20
Dependent Claim
15 words
A semiconductor device according to claim 12, wherein said body is made of a resin.
Claim 21
Dependent Claim
265 words
A module structure comprising: a wiring board; and first and second semiconductor devices mounted on said wiring board, said second semiconductor device being stacked on said first semiconductor device, each of said first and second semiconductor devices comprising: a semiconductor chip having a rectangular plate shape, said semiconductor chip including an integrated circuit and external terminals formed in a main surface thereof; a plurality of leads disposed in the vicinity of a periphery of said semiconductor chip, each of said plurality of leads having an inner lead portion and an outer lead portion; means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads; and a body for sealing said semiconductor chip and said inner lead portion of each of said plurality of leads, said body having a first surface, a second surface facing said first surface and a third surface between said first and second surfaces, wherein said outer lead portion of each of said plurality of leads protrudes outwardly from said third surface of said body and includes a first portion and a second portion, wherein said first portion of said outer lead portion extends in a direction substantially parallel with said first surface and substantially at the same level as said first surface, wherein said second portion of said outer lead of said first semiconductor device is soldered to said wiring board, and wherein said second portion of said outer lead of said second semiconductor device is soldered to said first portion of said outer lead of said first semiconductor device.
Claim 22
Dependent Claim
265 words
A module structure comprising: a wiring board; and first and second semiconductor devices mounted on said wiring board, said second semiconductor device being stacked on said first semiconductor device, each of said first and second semiconductor devices comprising: a semiconductor chip having a rectangular plate shape, said semiconductor chip including an integrated circuit and external terminals formed in a main surface thereof; a plurality of leads disposed in the vicinity of a periphery of said semiconductor chip, each of said plurality of leads having an inner lead portion and an outer lead portion; means for electrically connecting said external terminals of said semiconductor chip with the corresponding inner lead portions of said plurality of leads; and a body for sealing said semiconductor chip and said inner lead portion of each of said plurality of leads, said body having a first surface, a second surface facing said first surface and a third surface between said first and second surfaces, wherein said outer lead portion of each of said plurality of leads protrudes outwardly from said third surface of said body and includes a first portion and a second portion, wherein said first portion of said outer lead portion extends in a direction substantially parallel with said first surface and substantially at the same level as said first surface, wherein said second portion of said outer lead of said first semiconductor device is soldered to said wiring board, and wherein said second portion of said outer lead of said second semiconductor device is soldered to said first portion of said outer lead of said first semiconductor device.
References Cited (Backward Citations)
US5245215A
Cited
US4698660A
Cited
US4649415A
Cited
US4943843A
Cited
US5184208A
Cited
JPH01286342A
Cited
US5018003A
Cited
US4996587A
Cited
US5072280A
Cited
JPH03261153A
Cited
US5055912A
Cited
JPH0423460A
Cited
JPH04106941A
Cited
JPH04129261A
Cited
JPH04162762A
Cited
US5394010A
Cited
JPH04343257A
Cited
US5252853A
Cited
JPH05144996A
Cited
JPH05315520A
Cited
US5446313A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-02 | 2001-09-01 | 2002-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-02 | 2005-09-01 | 2006-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-02 | 2009-09-01 | 2010-03-03 | $7700.00 | Window Closed / Lapsed |