Semiconductor device

Claim 2

A semiconductor device comprising: (a) a plurality of leads, each lead having an inner portion and an outer portion, the inner portions of said leads extending substantially on one plane; (b) a semiconductor pellet having first and second major surfaces being arranged opposed from each other, at least one electronic device being formed on said first major surface, inner portions of a first group of the plurality of leads extending along said second major surface and arranged so that tips of said inner portions of said first group of leads protrude from a side of the pellet to provide bonding points. (c) a set of bonding pads disposed on said first major surface along opposite sides of said pellet; (d) an insulating sheet inserted between and bonded to the inner portions of the first group of leads and the second major surface for providing electrical insulation; (e) a plurality of bonding wires electrically connected between tips of said inner portions of the plurality of leads and said bonding pads; (f) a resin sealing body sealing the pellet; the bonding pads, the insulating sheet, the bonding wires and the inner portions of the plurality of leads; wherein the plurality of leads further includes a second group of leads, said inner portions of the first group of leads being bent to support said pellet thereon, each inner portion of said first group of leads extending from a non-bonding pad-forming side to a bonding pad-forming side of said pellet and inner portions of said second group of leads being disposed along an end of the pellet without supporting the pellet thereon; and wherein the pellet is supported only by said inner portions of said first group of leads.

Claim 3

A semiconductor device according to claim 1, wherein the insulating sheet is made of silicon rubber.

Claim 4

A semiconductor device according to claim 1, wherein the insulating sheet is made of a polyimide film.

Claim 5

A semiconductor device according to claim 1, wherein the insulating sheet is made of an organic material.

Claim 6

A semiconductor device according to claim 1, wherein the insulating sheet is made of an organic material other than the material forming the insulating resin body.

Claim 7

A semiconductor device according to claim 1, wherein the resin sealing body has a substantially box-like shape and outer lead portions of the leads protrude from at least one of the sides of the body.

Claim 8

A semiconductor device according to claim 1, wherein the insulating sheet has sufficient thickness to prevent α-particles from causing malfunction in a circuit including said at least one electronic element formed on one of the major surfaces of the pellet.

Claim 9

A semiconductor device comprising: (a) a plurality of leads, each lead having an inner portion and an outer portion, the inner portions of said leads extending substantially on one plane; (b) a semiconductor pellet having first and second major surfaces being arranged opposed from each other, at least one electronic device being formed on said first major surface, inner portions of a first group of the plurality of leads extending along said first major surface; (c) a set of bonding pads disposed on said first major surface along opposite sides of said pellet; (d) an insulating sheet inserted between and bonded to the inner portions of the first group of leads and the first major surface for providing electrical insulation; (e) a plurality of bonding wires electrically connected between tips of said inner portions of the plurality of leads and said bonding pads; (f) a resin sealing body sealing the pellet, the bonding pads, the insulating sheet, the bonding wires and the inner portions of said plurality of leads; wherein said plurality of leads further includes a second group of leads, said inner portions of said first group of leads being bent to support said pellet thereunder, each inner portion of said first group of leads extending from a non-bonding pad-forming side to a bonding pad-forming side of said pellet and inner portions of said second group of leads being disposed along an end of the pellet without supporting the pellet thereunder; and wherein the pellet is supported only by said inner portions of the first group of leads.

Claim 10

A semiconductor device comprising: (a) a plurality of leads, each lead having an inner portion and an outer portion, the inner portions of said leads extending substantially on one plane; (b) a semiconductor pellet having first and second major surfaces being arranged opposed from each other, at least one electronic device being formed on said first major surface, inner portions of a first group of the plurality of leads extending along said first major surface; (c) a set of bonding pads disposed on said first major surface along opposite sides of said pellet; (d) an insulating sheet inserted between and bonded to the inner portions of the first group of leads and the first major surface for providing electrical insulation; (e) a plurality of bonding wires electrically connected between tips of said inner portions of the plurality of leads and said bonding pads; (f) a resin sealing body sealing the pellet, the bonding pads, the insulating sheet, the bonding wires and the inner portions of said plurality of leads; wherein said plurality of leads further includes a second group of leads, said inner portions of said first group of leads being bent to support said pellet thereunder, each inner portion of said first group of leads extending from a non-bonding pad-forming side to a bonding pad-forming side of said pellet and inner portions of said second group of leads being disposed along an end of the pellet without supporting the pellet thereunder; and wherein the pellet is supported only by said inner portions of the first group of leads.

Claim 11

A semiconductor device according to claim 8, wherein the insulating sheet is made of silicon rubber.

Claim 12

A semiconductor device according to claim 8, wherein the insulating sheet is made of a polyimide film.

Claim 13

A semiconductor device according to claim 8, wherein the insulating sheet is made of an organic material.

Claim 14

A semiconductor device according to claim 8, wherein the insulating sheet is made of an organic material other than the material forming the insulating resin body.

Claim 15

A semiconductor device according to claim 8, wherein the resin body has a substantially box-like shape and outer lead portions of the leads protrude from at least one of the sides of the body.

Claim 16

A semiconductor device according to claim 8, wherein the insulating sheet has sufficient thickness to prevent α-particles from causing malfunction in a circuit including said at least one electronic element formed on one of the major surfaces of the pellet.

Claim 17

A semiconductor device comprising: (a) a rectangular semiconductor pellet having a first and a second major surfaces being arranged opposed to each other, at least one electronic device being formed on said first major surface, and said pellet comprising first, second, third and fourth sides; (b) a plurality of bonding pads arranged on said first major surface in the vicinity of said third and fourth sides being arranged opposed to each other; (c) a plurality of leads, each lead having an inner portion, an end portion and an outer portion, the inner portions extending substantially on one plane and including first, second, third and fourth sets each of which has a plurality of inner portions; (d) an insulating sheet inserted between and bonded to the inner portions of said leads and the second major surface of said pellet; (e) a plurality of bonding wires each electrically connected between each of the end portions of said inner portions and each of said bonding pads; and (f) a resin sealing means sealing the pellet, the bonding pads, the insulating sheet, the bonding wires and the inner portions of said plurality of leads; wherein said first set of inner portions intersect the first and the third sides of said pellet, and said end portions of said first set of inner portions protrude from the third side of said pellet; said second set of inner portions intersect the first and the fourth sides of said pellet, and said end portions of said second set of inner portions protrude from the fourth side of said pellet; said third set of inner portions intersect the second and the third sides of said pellet, and said end portions of said third set of inner portions protrude from the third side of said pellet; and said fourth set of inner portions intersect the second and the fourth sides of said pellet, and said end portions of said fourth set of inner portions protrude from the fourth side of said pellet.

Claim 18

A semiconductor device comprising: (a) a rectangular semiconductor pellet having a first and a second major surfaces being arranged opposed to each other, at least one electronic device being formed on said first major surface, and said pellet comprising first, second, third and fourth sides; (b) a plurality of bonding pads arranged on said first major surface in the vicinity of said third and fourth sides being arranged opposed to each other; (c) a plurality of leads, each lead having an inner portion, an end portion and an outer portion, the inner portions extending substantially on one plane and including first, second, third and fourth sets each of which has a plurality of inner portions; (d) an insulating sheet inserted between and bonded to the inner portions of said leads and the second major surface of said pellet; (e) a plurality of bonding wires each electrically connected between each of the end portions of said inner portions and each of said bonding pads; and (f) a resin sealing means sealing the pellet, the bonding pads, the insulating sheet, the bonding wires and the inner portions of said plurality of leads; wherein said first set of inner portions intersect the first and the third sides of said pellet, and said end portions of said first set of inner portions protrude from the third side of said pellet; said second set of inner portions intersect the first and the fourth sides of said pellet, and said end portions of said second set of inner portions protrude from the fourth side of said pellet; said third set of inner portions intersect the second and the third sides of said pellet, and said end portions of said third set of inner portions protrude from the third side of said pellet; and said fourth set of inner portions intersect the second and the fourth sides of said pellet, and said end portions of said fourth set of inner portions protrude from the fourth side of said pellet.

Claim 19

A semiconductor device according to claim 15, wherein said pellet is supported only by said inner portions.

Claim 20

A semiconductor device according to claim 15, wherein the insulating sheet is made of silicone rubber.

Claim 21

A semiconductor device according to claim 15, wherein the insulating sheet is made of a polyimide film.

Claim 22

A semiconductor device according to claim 15, wherein the insulating sheet is made of an organic material.

Claim 23

A semiconductor device according to claim 15, wherein the insulating sheet is made of an organic material other than the material forming the insulating resin body.

Claim 24

A semiconductor device according to claim 15, wherein the resin sealing body has a substantially box-like shape and outer lead portions of the leads protrude from at least one of the sides of the body.

Claim 25

A semiconductor device according to claim 41, further comprising: (g) another set of inner portions of said leads arranged along said third and fourth sides of said pellet without supporting the pellet thereon.

Claim 26

A semiconductor device comprising: (a) a rectangular semiconductor pellet having a first and a second major surfaces being arranged opposed to each other, at least one electronic device being formed on said first major surface, and said pellet comprising first, second, third and fourth sides; (b) a plurality of bonding pads arranged on said first major surface in the vicinity of said third and fourth sides being arranged opposed to each other; (c) a plurality of leads, each lead having an inner portion, an end portion and an outer portion, the inner portions extending substantially on one plane and including first, second, third and fourth sets each of which has a plurality of inner portions; (d) an insulating sheet inserted between and bonded to the inner portions of said leads and the first major surface of said pellet; (e) a plurality of bonding wires each electrically connected between each of said end portions of said inner portions and each of said bonding pads; and (f) a resin sealing means sealing the pellet, the bonding pads, the insulating sheet, the bonding wires and the inner portions of said plurality of leads; wherein said first set of inner portions intersect the first side of said pellet, and said end portions of said first set of inner portions extend to the bonding pads which are arranged in the vicinity of said third side of said pellet; said second set of inner portions intersect the first side of said pellet, and said end portions of said second set of inner portions extend to the bonding pads which are arranged in the vicinity of said fourth side of said pellet; said third set of inner portions intersect the second side of said pellet, and said end portions of said third set of inner portions extend to the bonding pads which are arranged in the vicinity of said third side of said pellet; and said fourth set of inner portions intersect the second side of said pellet, and said end portions of said fourth set of inner portions extend to the bonding pads which are arranged in the vicinity of said fourth side of said pellet.

Claim 27

A semiconductor device comprising: (a) a rectangular semiconductor pellet having a first and a second major surfaces being arranged opposed to each other, at least one electronic device being formed on said first major surface, and said pellet comprising first, second, third and fourth sides; (b) a plurality of bonding pads arranged on said first major surface in the vicinity of said third and fourth sides being arranged opposed to each other; (c) a plurality of leads, each lead having an inner portion, an end portion and an outer portion, the inner portions extending substantially on one plane and including first, second, third and fourth sets each of which has a plurality of inner portions; (d) an insulating sheet inserted between and bonded to the inner portions of said leads and the first major surface of said pellet; (e) a plurality of bonding wires each electrically connected between each of said end portions of said inner portions and each of said bonding pads; and (f) a resin sealing means sealing the pellet, the bonding pads, the insulating sheet, the bonding wires and the inner portions of said plurality of leads; wherein said first set of inner portions intersect the first side of said pellet, and said end portions of said first set of inner portions extend to the bonding pads which are arranged in the vicinity of said third side of said pellet; said second set of inner portions intersect the first side of said pellet, and said end portions of said second set of inner portions extend to the bonding pads which are arranged in the vicinity of said fourth side of said pellet; said third set of inner portions intersect the second side of said pellet, and said end portions of said third set of inner portions extend to the bonding pads which are arranged in the vicinity of said third side of said pellet; and said fourth set of inner portions intersect the second side of said pellet, and said end portions of said fourth set of inner portions extend to the bonding pads which are arranged in the vicinity of said fourth side of said pellet.

Claim 28

A semiconductor device according to claim 23, wherein said pellet is supported only by said inner portions.

Claim 29

A semiconductor device according to claim 23, wherein the insulating sheet is made of silicone rubber.

Claim 30

A semiconductor device according to claim 23, wherein the insulating sheet is made of a polyimide film.

Claim 31

A semiconductor device according to claim 23, wherein the insulating sheet is made of an organic material.

Claim 32

A semiconductor device of according to claim 23, wherein the insulating sheet is made of an organic material other than the material forming the insulating resin body.

Claim 33

A semiconductor device according to claim 23, wherein the resin sealing body has a substantially box-like shape and outer lead portions of the leads protrude from at least one of the sides of the body.

Claim 34

A semiconductor device according to claim 23, further comprising: (g) another set of inner portions of said leads arranged along said third and fourth sides of said pellet without supporting the pellet thereunder.

Claim 35

A semiconductor device comprising: (a) an oblong semiconductor pellet having a first and a second major surfaces being arranged opposed to each other, at least one electronic device being formed on said first major surface; (b) a plurality of bonding pads arranged on said first major surface; (c) a plurality of leads each lead having an inner portion, an outer portion and an end portion, the inner portions extending substantially on one plane, said inner portions entering from a longer side of said pellet, the end portions of said inner portions extending to said bonding pads; (d) an insulating sheet inserted between and bonded to the inner portions of said leads and the second major surface of said pellet; (e) a plurality of bonding wires each electrically connected between each of the end portions of said inner portions and said bonding pads; and (f) a resin sealing means sealing the pellet, the bonding pads, the insulating sheet, the bonding wires and the inner portions of said plurality of leads.

Claim 36

A semiconductor device comprising: (a) an oblong semiconductor pellet having a first and a second major surfaces being arranged opposed to each other, at least one electronic device being formed on said first major surface; (b) a plurality of bonding pads arranged on said first major surface; (c) a plurality of leads each lead having an inner portion, an outer portion and an end portion, the inner portions extending substantially on one plane, said inner portions entering from a longer side of said pellet, the end portions of said inner portions extending to said bonding pads; (d) an insulating sheet inserted between and bonded to the inner portions of said leads and the second major surface of said pellet; (e) a plurality of bonding wires each electrically connected between each of the end portions of said inner portions and said bonding pads; and (f) a resin sealing means sealing the pellet, the bonding pads, the insulating sheet, the bonding wires and the inner portions of said plurality of leads.

Claim 37

A semiconductor device according to claim 31, wherein said pellet is supported only by said inner portions.

Claim 38

A semiconductor device according to claim 31, wherein the insulating sheet is made of silicone rubber.

Claim 39

A semiconductor device according to claim 31, wherein the insulating sheet is made of a polyimide film.

Claim 40

A semiconductor device according to claim 31, wherein the insulating sheet is made of an organic material.

Claim 41

A semiconductor device according to claim 31, wherein the insulating sheet is made of an organic material other than the material forming the insulating resin body.

Claim 42

A semiconductor device according to claim 31, wherein the resin sealing body has a substantially box-like shape and outer lead portions of the leads protrude from at least one of the sides of the body.

Claim 43

A semiconductor device according to claim 31, further comprising: (g) another set of inner portions of said leads arranged along said third and fourth sides of said pellet without supporting the pellet thereon.