Resin-sealed type semiconductor device

Abstract

Abstract PURPOSE:To prevent the generation of resin crack and enhance moisture resistance by partially bonding the diffusion side of a semiconductor device with a device holder member and fixedly bonding a part of the device holder member with an inner lead laid out around the semiconductor device. CONSTITUTION:A device holder member 2 comprises a thin type head resistant material molded from polyimide and fixedly bonded with a part of a diffusion side of a semiconductor device 1 and a part of an inner lead 3. The sealing resin used here is an epoxy group resin where its thermal expansion coefficient is 7.1X10<-5>(1/ deg.C). As for the polyimide which forms the holder member 2, sealing resin with excellent bonding properties is selected where the thermal expansion coefficient is 6.8X10<-5>(1/ deg.C) and a substance near the sealing resin is adopted. Since no device mount section is provided in this structure, the generation of crack is hard to occur. Furthermore, the package thickness can be reduced as well humidity resistance can be enhanced by eliminating a hanging pin exposed outside.

Inventors

• 👤 Atsushi Takahashi
• 👤 敦 高橋

Bibliographic Details