US5712192A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for connecting an electrical device to a circuit substrate
Assignee: International Business Machines Corp
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Filing: 1994-04-26
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Granted: 1998-01-27
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Expires: 2014-04-26
Abstract
Abstract A process for manufacturing circuitized substrate for use in an electronic package wherein the substrate, e.g., ceramic, includes more than one conductive layer, e.g., copper, thereon separated by a suitable dielectric material, e.g., polyimide. Each layer includes its own conductive location(s) which are designed for being directly electrically connected, e.g., using solder, to respective contact sites on a semiconductor chip positioned on the substrate to form part of the final package. A method for making such a package is also provided. Significantly, the resulting package does not include interconnections between the conductive layers at the desired contact locations, these locations, as mentioned, instead being directly connected to the chip.
Inventors
- 👤 Robert Lee Lewis
- 👤 Robert David Sebesta
- 👤 Daniel Martin Waits
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 10:58
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H10W70/60; H10W70/611; H10W90/00; H10W90/401; H10W90/701; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/40; H05K3/4007; H05K3/46; H05K3/4644; H10W72/00; H10W72/20; H10W72/221; H10W72/227; H10W72/241; H10W72/247; H10W72/29; H10W72/90; H10W72/941; H10W72/9415; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
222 words
A method of making a circuitized substrate adapted for being electrically connected to an electronic device, said method comprising: providing a substrate having a first surface; providing a first circuit pattern on said first surface of said substrate, said pattern including at least one contact location; substantially covering said first circuit pattern, including said contact location, with a layer of dielectric material; providing a second circuit pattern on said layer of dielectric material, said second circuit pattern including at least one contact location; removing at least a portion of said layer of dielectric material to expose said contact location of said first circuit pattern, said contact locations of said first and second circuit patterns being exposed and located at different levels relative to said first surface of said substrate, said contact locations adapted for being separately directly electrically connected to said electronic device, said removing of said at least said portion of said layer of said dielectric material occurring after said providing of said second circuit pattern on said layer of said dielectric material; and electrically connecting said electronic device to said exposed contact locations of said first and second circuit patterns using a soldering operation wherein a plurality of substantially equal size solder elements are applied onto said electronic device and thereafter connected to respective ones of said exposed contact locations.
Claim 2
Independent Claim
222 words
A method of making a circuitized substrate adapted for being electrically connected to an electronic device, said method comprising: providing a substrate having a first surface; providing a first circuit pattern on said first surface of said substrate, said pattern including at least one contact location; substantially covering said first circuit pattern, including said contact location, with a layer of dielectric material; providing a second circuit pattern on said layer of dielectric material, said second circuit pattern including at least one contact location; removing at least a portion of said layer of dielectric material to expose said contact location of said first circuit pattern, said contact locations of said first and second circuit patterns being exposed and located at different levels relative to said first surface of said substrate, said contact locations adapted for being separately directly electrically connected to said electronic device, said removing of said at least said portion of said layer of said dielectric material occurring after said providing of said second circuit pattern on said layer of said dielectric material; and electrically connecting said electronic device to said exposed contact locations of said first and second circuit patterns using a soldering operation wherein a plurality of substantially equal size solder elements are applied onto said electronic device and thereafter connected to respective ones of said exposed contact locations.
Claim 3
Dependent Claim
26 words
The method of claim 1 wherein said first circuit pattern is formed by depositing at least one metal layer on said first surface of said substrate.
Claim 4
Dependent Claim
42 words
The method of claim 2 wherein said first circuit pattern is formed utilizing photolithographic processing, said processing including depositing a layer of photoresist on said metal layer and thereafter exposing and developing areas of said photoresist to define said first circuit pattern.
Claim 5
Dependent Claim
19 words
The method of claim 1 wherein said layer of dielectric material is blanket coated over said first circuit pattern.
Claim 6
Dependent Claim
26 words
The method of claim 4 wherein said layer of dielectric material is a polymer, said polymer being cured following said depositing on said first circuit pattern.
Claim 7
Dependent Claim
25 words
The method of claim 1 wherein said second circuit pattern is formed by depositing at least one metal layer on said layer of dielectric material.
Claim 8
Dependent Claim
25 words
The method of claim 6 wherein said depositing of said at least one metal layer on said layer of dielectric material is accomplished using sputtering.
Claim 9
Dependent Claim
43 words
The method of claim 6 wherein said second circuit pattern is formed utilizing photolithographic processing, said processing including depositing a layer of photoresist material on said metal layer and thereafter exposing and developing areas of said photoresist to define said second circuit pattern.
Claim 10
Dependent Claim
19 words
The method of claim 1 wherein said portion of said layer of dielectric material is removed using laser ablation.
Claim 11
Dependent Claim
38 words
The method of claim 1 wherein said first circuit pattern on said first surface of said substrate includes a protective layer thereon during said removing of said at least said portion of said layer of said dielectric material.
Claim 12
Dependent Claim
39 words
The method of claim 10 wherein said second circuit pattern on said layer of said dielectric material also includes a protective layer thereon during said removing of said at least said portion of said layer of said dielectric material.
Claim 13
Dependent Claim
28 words
The method of claim 1 wherein said second circuit pattern is provided on said layer of said dielectric material without subjecting said dielectric material to wet chemical processes.
Claim 14
Dependent Claim
16 words
The method of claim 12 wherein said second circuit pattern is provided using a sputtering operation.
Claim 15
Dependent Claim
14 words
The method of claim 13 wherein said layer of said dielectric material is polyimide.
Claim 16
Dependent Claim
24 words
The method of claim 1 wherein said first and second circuit patterns are provided on said substrate without a metal-to-metal interface between said patterns.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-01-26 | 2001-07-28 | 2002-01-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-01-26 | 2005-07-28 | 2006-01-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-01-26 | 2009-07-28 | 2010-01-27 | $7700.00 | Window Closed / Lapsed |