Patent US1784360A successfully refreshed from Google Patents.
US4289846A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming low-reactance interconnections on semiconductors
Assignee: General Electric Co
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Filing: 1979-12-28
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Granted: 1981-09-15
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Expires: 1999-12-28
Abstract
Abstract Several methods are disclosed for forming an air gap between crossing thin film conductors utilized to interconnect electronic components on a substrate. Each of the methods involves the use of photolithographic techniques to form overpassing conductors on a support material covering the overpassed conductors, followed by removal of the support material. Both deposition and plating techniques are described for forming the overpassing conductors.
Inventors
- 👤 Earl L. Parks
- 👤 Simon A. Zaidel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 20:41
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/072; H10W20/40; H10W20/45; H10W20/46
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
187 words
A method of forming a conductive bridge connecting selected ones of a plurality of thin film conductors located on a substrate comprising: A. applying a layer of photosensitive material to the conductors and the substrate, said layer being of a thickness equal to the desired height of the bridges; B. selectively exposing and developing the photosensitive material to effect uncovering of a contact region of each of the selected conductors with which the bridge is to come in contact; C. depositing a layer of conductive material onto the photosensitive material and the contact regions, said layer being of sufficient thickness to form an electroplating electrode; D. applying a layer of photosensitive material onto the layer of conductive material, said layer being of sufficient thickness to prevent electroplating therethrough; E. selectively exposing and developing the last applied layer of photosensitive material to effect uncovering of the conductive material spanning the contact regions; F. utilizing the conductive material as an electrode and electroplating the uncovered surface areas thereof to the desired bridge thickness to form the bridge; and G. removing the remaining photosensitive material and the unplated conductive material.
Claim 2
Independent Claim
187 words
A method of forming a conductive bridge connecting selected ones of a plurality of thin film conductors located on a substrate comprising: A. applying a layer of photosensitive material to the conductors and the substrate, said layer being of a thickness equal to the desired height of the bridges; B. selectively exposing and developing the photosensitive material to effect uncovering of a contact region of each of the selected conductors with which the bridge is to come in contact; C. depositing a layer of conductive material onto the photosensitive material and the contact regions, said layer being of sufficient thickness to form an electroplating electrode; D. applying a layer of photosensitive material onto the layer of conductive material, said layer being of sufficient thickness to prevent electroplating therethrough; E. selectively exposing and developing the last applied layer of photosensitive material to effect uncovering of the conductive material spanning the contact regions; F. utilizing the conductive material as an electrode and electroplating the uncovered surface areas thereof to the desired bridge thickness to form the bridge; and G. removing the remaining photosensitive material and the unplated conductive material.
Claim 3
Dependent Claim
111 words
A method as in claim 1 where said remaining photosensitive material and said unplated bridge material is removed by the steps of: A. applying a solvent to the remainder of the last applied layer of photosensitive material to effect removal thereof; B. applying a layer of photosensitive material onto the bridge, said layer being of sufficient thickness to prevent etching of the bridge; C. selectively exposing and developing the last applied layer of photosensitive material to effect uncovering of the unplated conductive material; D. applying an etching agent to the unplated conductive material to effect removal thereof; and E. applying a solvent to the remaining photosensitive material to effect removal thereof.
Claim 4
Dependent Claim
61 words
A method as in claim 1 where said remaining photosensitive material and said unplated conductive material is removed by: A. applying a solvent to the remainder of the last applied layer of photosensitive material to effect removal thereof; B. ultrasonically vibrating the unplated conductive material to effect removal thereof; C. applying solvent to the remaining photosensitive material to effect removal thereof.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-09-14 | 1985-03-16 | 1985-09-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-09-14 | 1989-03-16 | 1989-09-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-09-14 | 1993-03-16 | 1993-09-15 | $7700.00 | Window Closed / Lapsed |