EP0499079A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic packaging with varying height connectors
Assignee: International Business Machines Corp
•
Filing: 1992-01-27
•
Granted: —
•
Expires: 2012-01-27
Abstract
Abstract In joining conductors (15, 17, 19) at different levels on a carrier to contact locations (2, 3, 4) on a planar substrate, mound shaped connections (5, 6, 7) are employed, with the height of each mound shaped connection extending to the level of the particular conductor to which it is bonded. The mound shaped connections (5, 6, 7) are formed using planar processes of controlled volume deposition, surface tension shaping on reflow, and physical deformation. The height of the mound shaped connections (5, 6, 7) are calculated empirically from the volume deposited bounded by the substrate pad after surface tension limits the slump on reflowing.
Inventors
- 👤 Thomas Mario Cipolla
- 👤 Paul William Coteus
- 👤 Robert Henry Katyl
- 👤 Robert Joseph Kelleher
- 👤 Paul Andrew Moskowitz
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 08:44
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W72/071; H10W72/077; H10W72/20; H10W72/072; H10W72/07231; H10W72/07236; H10W72/241; H10W72/247; H10W72/248; H10W72/251; H10W72/252
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
121 words
An electronic packaging, at an interface between a carrier (11) that is supporting conductors (15, 17, 19) at more than one level, and a substrate (1) with contact locations (2, 3, 4) in a planar surface (1), comprising: a mound shaped connection member (5, 6, 7) positioned on and fused to each of said contact locations (2, 3, 4), each said mound shaped member (5, 6, 7) extending to and bonded with at least one of said conductors, each said mound shaped member (5, 6, 7) having a different height dimension (8, 9, 10) from said planar surface to the conductor (15, 17, 19) to which it is bonded, said dimension being the distance from said planar surface to said conductor.
Claim 2
Dependent Claim
57 words
The packaging of claim 1 wherein: said carrier (11) is a single lamination of dielectric material having conductors (15, 17, 19) on both surfaces thereof, said conductors extending cantilevered from an edge of said lamination, and each conductor (15, 17, 19) being bonded to a contact location in the plane of the conductor on the lamination surface.
Claim 3
Dependent Claim
65 words
The packaging of claim 1 or 2 wherein: said carrier (11) is a single lamination of dielectric material having conductors (15, 17, 19) on both surfaces thereof, said conductors extend unsupported across an aperture (34) in said lamination, said conductors (15, 17, 19) being each bonded to an appropriate thickness contact location (2, 3, 4) in the place of the conductor on the lamination surface.
Claim 4
Dependent Claim
58 words
A process of fabricating electrical connections of different thicknesses (8, 9, 10) above a planar substrate surface (1) at electrical connection locations in said planar substrate surface (1) comprising the steps of: depositing a different controlled volume of low temperature fusible connecting material at each said different thickness requiring location, and reflowing said deposited volumes of fusible material.
Claim 5
Dependent Claim
35 words
The process of claim 4 wherein each said controlled volume is produced through the step of depositing on a particular said electrical contact location in said planar substrate surface (1) through different mask hole sizes.
Claim 6
Dependent Claim
53 words
The process of claim 4 or 5 wherein the thickness of a particular electrical connection is established by the height of said controlled volume after a slump limited by surface tension of said fusible material and the boundary of the particular connection location in said planar substrate surface (1) during said reflowing step.
Claim 7
Dependent Claim
30 words
The process of claim 4, 5 or 6 including the additional step of flattening to a conductor contacting size a portion of said deposited and reflowed volumes of connecting material.
Claim 8
Dependent Claim
26 words
The process of claim 4, 5, 6 or 7 wherein said deposition of said connecting material is conducted on a designed current carrying area of metallurgy.
Claim 9
Dependent Claim
32 words
The process of claim 4, 5, 6, 7 or 8 including the additional step of flattening to a conductor contacting size a portion of said deposited and reflowed volumes of connecting material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.