EP0380906A2
Expired / Lapsed
EP
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Tape bonded semiconductor device
Assignee: International Business Machines Corp
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Filing: 1990-01-02
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Granted: —
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Expires: 2010-01-02
Abstract
Abstract Multiple, single conductor, tape automated bonding (TAB) tapes (36, 37, 38) are sequentially applied to a semiconductor device (31) by the bonding of a first, etched, single layer TAB tape to an outer row of bonding pads (32, 33, 34) on a semiconductor chip and to selected contacts on a lead frame followed by the laying down of at least one additional etched, single layer TAB tape which is then bonded to an inner row of bonding pads on the semiconductor chip and to different selected lead frame contacts. If desired the subsequent TAB tape may be adhered to the preceding TAB tape to increase the mechanical strength of all the tapes and improve the electrical characteristics of the tapes. The application of one or more ground planes to the assembly is also shown.
Inventors
- 👤 James Andrew Bilowith
- 👤 Edward John Dombroski
- 👤 William Hewlett Guthrie
- 👤 Richard William Noth
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 13:28
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/451; H10W70/453
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
265 words
A semiconductor chip assembly comprising: a semiconductor chip (31) having a plurality of rows (32, 33, 34) of bonding pads on a face thereof, the bonding pads in each row lying on the same longitudinal axis as a respective pad in an adjacent row, a first lead carrying tape (36) comprising an insulating layer having a plurality of conductive leads (36a), said leads having inner and outer end portions, the inner end portions of the conductive leads extending beyond said insulating layer, each inner end portion of each lead, extending beyond the layer on said first tape, lying on a respective longitudinal axis, inner end portions of selected ones of said leads on said first tape secured directly to respective bonding pads in a first selected row of said bonding pads, a second tape comprising an insulating layer having a conductive layer thereon overlying said first lead carrying tape, said conductive layer on said second tape including a plurality of conductive leads (37a, 38a), having inner and outer end portions, said inner end portions extending beyond the insulator of said second tape and lying on a respective longitudinal axis, and inner end portions of selected ones of said leads of said second tape secured directly to respective pads in a second selected row of said pads, each respective inner end portion of said selected leads of said second tape aligned to and overlying the longitudinal axis of a respective inner end portion of a selected lead on the insulating layer of said first tape and overlying the respective inner end portion of said first tape.
Claim 2
Dependent Claim
265 words
A semiconductor chip assembly comprising: a semiconductor chip (31) having a plurality of rows (32, 33, 34) of bonding pads on a face thereof, the bonding pads in each row lying on the same longitudinal axis as a respective pad in an adjacent row, a first lead carrying tape (36) comprising an insulating layer having a plurality of conductive leads (36a), said leads having inner and outer end portions, the inner end portions of the conductive leads extending beyond said insulating layer, each inner end portion of each lead, extending beyond the layer on said first tape, lying on a respective longitudinal axis, inner end portions of selected ones of said leads on said first tape secured directly to respective bonding pads in a first selected row of said bonding pads, a second tape comprising an insulating layer having a conductive layer thereon overlying said first lead carrying tape, said conductive layer on said second tape including a plurality of conductive leads (37a, 38a), having inner and outer end portions, said inner end portions extending beyond the insulator of said second tape and lying on a respective longitudinal axis, and inner end portions of selected ones of said leads of said second tape secured directly to respective pads in a second selected row of said pads, each respective inner end portion of said selected leads of said second tape aligned to and overlying the longitudinal axis of a respective inner end portion of a selected lead on the insulating layer of said first tape and overlying the respective inner end portion of said first tape.
Claim 3
Dependent Claim
27 words
The chip assembly of claim 1 wherein said further tape is secured to said previous first tape, preferably with an adhesive or with a heat flowable polymeric.
Claim 4
Dependent Claim
17 words
The chip assembly of claim 1 or 2 wherein an insulator is disposed over said further tape.
Claim 5
Dependent Claim
22 words
The chip assembly of any one of the preceding claims wherein a polymer is disposed over the conductive leads of further tape.
Claim 6
Dependent Claim
28 words
The chip assembly of any one of the preceding claims wherein there is further provided a continuous cover sheet extending over said leads, preferably having a uniform thickness.
Claim 7
Dependent Claim
37 words
The semiconductor chip assembly of any one of the preceding claims wherein the leads of the first and third tapes are coupled to ground and selected leads of said second tape are coupled to signal carrying pads.
Claim 8
Dependent Claim
30 words
The semiconductor chip assembly of claim 6 wherein each lead of said second tape, immediately adjacent to said selected leads coupled to said signal carrying pads, is coupled to ground.
Claim 9
Independent Claim
158 words
A method of tape automated bonding comprising the steps of: positioning the tips of the leads of a first insulated metallic lead carrying tape over a first row of bonding pads on a semiconductor device so that the tips of the leads are aligned for bonding to the bonding pads of the first row, each lead of said first tape lying on a respective longitudinal axis, bonding the tips of some of said leads of said first tape to respective pads in the first row, positioning the tips of the leads of additional insulated metallic lead carrying tapes over additional rows of bonding pads on the semiconductor device so that the tips of the leads of the additional tapes are aligned for bonding to the pads of respective additional rows, and bonding the additional tape to the preceding tape, bonding the tips of some of said leads of said additional tapes to respective pads in said respective rows.
Claim 10
Independent Claim
158 words
A method of tape automated bonding comprising the steps of: positioning the tips of the leads of a first insulated metallic lead carrying tape over a first row of bonding pads on a semiconductor device so that the tips of the leads are aligned for bonding to the bonding pads of the first row, each lead of said first tape lying on a respective longitudinal axis, bonding the tips of some of said leads of said first tape to respective pads in the first row, positioning the tips of the leads of additional insulated metallic lead carrying tapes over additional rows of bonding pads on the semiconductor device so that the tips of the leads of the additional tapes are aligned for bonding to the pads of respective additional rows, and bonding the additional tape to the preceding tape, bonding the tips of some of said leads of said additional tapes to respective pads in said respective rows.
Claim 11
Dependent Claim
24 words
The method of claim 8 wherein there is provided the further step of placing an insulated cover sheet over the uppermost lead carrying tape.
Claim 12
Dependent Claim
23 words
The method of claim 8 or 9 wherein there is provided the further step of providing a metallic layer beneath said first tape.
References Cited (Backward Citations)
No citation records indexed.
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