EP0218438A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Apparatus for mounting a semiconductor chip and making electrical connections thereto
Assignee: MCNC Research and Development Institute
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Filing: 1986-09-29
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Granted: —
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Expires: 2006-09-29
Abstract
Abstract Apparatus for mounting a semiconductor device chip and making electrical connections thereto is disclosed. Hence, a semiconductor device chip (3) has its backside connected to the surface of a substrate (1), and its upper surface includes a plurality of electrical pads (4) across the entire surface thereof. A translator chip (5) has a plurality of first electrical contacts (21) disposed generally across the interior portion thereof which are in electrical contact with the semiconductor device chip electrical pads (4), and a plurality of second electrical contacts (22) disposed generally around the perimeter of the translator chip which are electrically connected with the electrical terminals (2) in the substrate to which the chip is attached. Heat may be removed from the semiconductor device chip (3) through its backside via cooling channels (10) in the substrate (1).
Inventors
- 👤 Arnold Reisman
- 👤 Carlton M. Osburn
- 👤 Lih-Tyng Hwang
- 👤 Jagdish Narayan
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 19:09
CPC Classifications
H; H10; H10W; H10W99/00; G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; H10W40/00; H10W40/40; H10W40/47; H10W70/00; H10W70/60
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
189 words
Apparatus for mounting a semiconductor device chip and making electrical connections thereto, said apparatus having a substrate (1,51) having a surface including electrical terminals (2) thereon, a semiconductor device chip (3,53) and means (5,61) for electrically connecting the substrate electrical terminals to the semiconductor device chip, the apparatus being characterised in that: the semiconductor device chip having a first surface (12,55) in contact with the surface (lA,52A) of the substrate and a second surface (14) having a plurality of electrical pads (4,54) disposed across substantially the entire surface thereof; and the means for electrically connecting the substrate electrical terminals (2,56) and the semiconductor device chip electrical pads (4,54) being an integrated circuit (5,61), said integrated circuit means having a plurality of first electrical contacts (21,63) disposed generally across the interior portion thereof and being in electrical contact with the semiconductor device chip electrical pads (4,54), and a plurality of second electrical contacts (22,64) disposed generally around the perimeter of the surface and being in electrical contact with the substrate electrical terminals (2,56), the first and second electrical contacts of the means (5,61) being electrically connected in a predetermined circuit.
Claim 2
Dependent Claim
189 words
Apparatus for mounting a semiconductor device chip and making electrical connections thereto, said apparatus having a substrate (1,51) having a surface including electrical terminals (2) thereon, a semiconductor device chip (3,53) and means (5,61) for electrically connecting the substrate electrical terminals to the semiconductor device chip, the apparatus being characterised in that: the semiconductor device chip having a first surface (12,55) in contact with the surface (lA,52A) of the substrate and a second surface (14) having a plurality of electrical pads (4,54) disposed across substantially the entire surface thereof; and the means for electrically connecting the substrate electrical terminals (2,56) and the semiconductor device chip electrical pads (4,54) being an integrated circuit (5,61), said integrated circuit means having a plurality of first electrical contacts (21,63) disposed generally across the interior portion thereof and being in electrical contact with the semiconductor device chip electrical pads (4,54), and a plurality of second electrical contacts (22,64) disposed generally around the perimeter of the surface and being in electrical contact with the substrate electrical terminals (2,56), the first and second electrical contacts of the means (5,61) being electrically connected in a predetermined circuit.
Claim 3
Dependent Claim
15 words
The apparatus of claim 1, wherein the semiconductor device chip is a flip chip structure.
Claim 4
Dependent Claim
29 words
The apparatus of claim 1 or 2, wherein the substrate comprises a material having thermal conductive capability and the semiconductor device chip is in a thermally conducting relation therewith.
Claim 5
Dependent Claim
31 words
The apparatus of claim 3, wherein the substrate includes means (10) for removing heat therefrom so that the substrate is a heat sink for removing heat from the semiconductor device chip.
Claim 6
Dependent Claim
38 words
The apparatus of claim 1, 2, 3 or 4, wherein the substrate surface defines a well (52) for receiving a semiconductor device chip (53), and wherein the electrical terminals (56) are disposed around the periphery of the well.
Claim 7
Dependent Claim
36 words
The apparatus of claim 5, wherein the well has a depth such that the contact pads (54) of the semiconductor device chip disposed in the well are substantially coplanar with the surface of the substrate (51).
Claim 8
Dependent Claim
27 words
The apparatus of claim 1, 2, 3 or 4, wherein the substrate comprises electrical terminals (2,56) disposed immediately outside the perimeter of the semiconductor device chip (2,53).
Claim 9
Dependent Claim
28 words
The apparatus of claim 7, wherein the means for electrically connecting comprises a plurality of rows of second electrical contacts (22,64) around the perimeter of the first surface.
Claim 10
Independent Claim
24 words
The apparatus of any preceding claim, wherein predetermined ones of the first electrical contacts (21,63) of the means for electrically connecting are electrically connected.
Claim 11
Independent Claim
40 words
The apparatus of any preceding claim, wherein the means for electrically connecting further comprises semiconductor device chips fabricated therein that are electrically connected to selected ones of the first and second electrical contacts of said means in a predetermined circuit.
Claim 12
Independent Claim
20 words
The apparatus of any preceding claim, wherein the first and second electrical contacts include means for making solder joint connections.
References Cited (Backward Citations)
No citation records indexed.
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