Patent US5711987A successfully refreshed from Google Patents.
US5711987A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic coatings
Assignee: Dow Silicones Corp
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Filing: 1996-10-04
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Granted: 1998-01-27
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Expires: 2016-10-04
Abstract
Abstract The instant invention pertains to a multi-layer tamper proof electronic coating wherein the first layer is a protecting layer produced from preceramic silicon containing material and at least one filler. The second layer is a resin sealer coat produced from a sealer resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides and parylenes. An optional third layer is a cap coating layer selected from SiO 2 coating, SiO 2 /ceramic oxide coating, silicon containing coatings, silicon carbon containing coatings, silicon nitrogen containing coatings, silicon oxygen nitrogen coatings, silicon nitrogen carbon containing coatings and/or diamond like coatings. An optional fourth layer is a resin overcoat produced from an overcoat resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides, parylenes, photoresist polymers, siloxane room temperature vulcanizable compositions, or other organic polymer. The use of the multi-layer coating on the electronic device results in an electronic device that is resistant to analytical techniques such as ozone, UV-ozone, gaseous free radicals and ions, vapor or liquid borne reactive species, plasma, abrasion, radiation, light, wet etching and others; moisture; chemicals and other environmental contaminants; shock and erosion, delamination and/or separation.
Inventors
- 👤 Clayton R. Bearinger
- 👤 Robert C. Camilletti
- 👤 Loren A. Haluska
- 👤 Keith W. Michael
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 05:35
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/40; H10W74/00; H10W74/10; H10W74/131; H10W74/147; H10W74/40; H10W74/47; H10W74/476; Y; Y10; Y10S; Y10S257/00; Y10S257/922
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
116 words
A method for forming a tamperproof coating on an electronic device comprising: (A) forming a protection layer on the electronic device by applying on the electronic device a composition comprising a preceramic silicon-containing material and a filler to a surface of the electronic device and thereafter heating the composition to a temperature sufficient to convert the preceramic silicon-containing material into a silica-containing ceramic having filler dispersed therein; and (B) forming a resin sealer coat over the protection layer by applying a sealer resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, a polyimide polymers, a siloxane polyimides and parylenes and thereafter curing the sealer resin to produce the resin sealer coat.
Claim 2
Independent Claim
116 words
A method for forming a tamperproof coating on an electronic device comprising: (A) forming a protection layer on the electronic device by applying on the electronic device a composition comprising a preceramic silicon-containing material and a filler to a surface of the electronic device and thereafter heating the composition to a temperature sufficient to convert the preceramic silicon-containing material into a silica-containing ceramic having filler dispersed therein; and (B) forming a resin sealer coat over the protection layer by applying a sealer resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, a polyimide polymers, a siloxane polyimides and parylenes and thereafter curing the sealer resin to produce the resin sealer coat.
Claim 3
Dependent Claim
42 words
The method as claimed in claim 1 wherein a cap coating layer is formed over the resin sealer coat by depositing onto the resin sealer coat a material selected from the group consisting of an amorphous SiC:H, diamond, silicon nitride and parylene.
Claim 4
Dependent Claim
24 words
The method as claimed in claim 2 wherein the cap coating layer is formed by the plasma enhanced chemical vapor deposition of amorphous SiC:H.
Claim 5
Dependent Claim
24 words
The method as claimed in claim 2 wherein the cap coating layer is formed by the plasma enhanced chemical vapor deposition of silicon nitride.
Claim 6
Dependent Claim
21 words
The method as claimed in claim 2 wherein the cap coating layer has a thickness of from 0.1 to 100 micrometers.
Claim 7
Dependent Claim
64 words
The method as claimed in claim 2 wherein a resin overcoat layer is formed over the cap coating layer by applying an overcoat resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides, parylenes, photoresist polymers, siloxane room temperature vulcanizable compositions, and organic polymers and thereafter curing the overcoat resin to produce the resin overcoat layer.
Claim 8
Dependent Claim
17 words
The method as claimed in claim 6 wherein the overcoat resin is a colloidal inorganic-based siloxane resin.
Claim 9
Dependent Claim
25 words
The method as claimed in claim 6 wherein the overcoat resin is cured by heating the resin at a temperature 60° C. to 400° C.
Claim 10
Dependent Claim
20 words
The method as claimed in claim 6 wherein the resin overcoat layer has a thickness of 0.1 to 8 micrometers.
Claim 11
Dependent Claim
27 words
The method as claimed in claim 1 wherein the preceramic silicon containing material is selected from the group consisting of silicon oxide precursors and silicon carbonitride precursors.
Claim 12
Dependent Claim
18 words
The method as claimed in claim 10 wherein the preceramic silicon containing material is a silicon oxide precursor.
Claim 13
Independent Claim
75 words
The method as claimed in 11 wherein the silicon oxide precursor is selected from the group consisting of hydrogen silsesquioxane resin, hydrolyzed or partially hydrolyzed compounds or mixtures of compounds having the formula R 1 n Si(OR 1 ) 4-n wherein each R 1 is independently selected from the group consisting of aliphatic, alicyclic and aromatic substituents having from 1 to 20 carbon atoms and n has a value of 0, 1, 2 or 3.
Claim 14
Dependent Claim
17 words
The method as claimed in claim 12 wherein the silicon oxide precursor is a hydrogen silsesquioxane resin.
Claim 15
Dependent Claim
18 words
The method as claimed in claim 10 wherein the preceramic silicon containing material is a silicon carbonitride precursor.
Claim 16
Dependent Claim
26 words
The method as claimed in claim 14 wherein the silicon carbonitride precursor is selected from the group consisting of hydridopolysilazane resins, methylpolydisilazane resins and polyborosilazane resins.
Claim 17
Dependent Claim
37 words
The method as claimed in claim 1 wherein the filler is selected from the group consisting of optically opaque fillers, radiopaque fillers, luminescent fillers, oxidation resistant filler, abrasion resistant fillers, magnetic fillers, conductive fillers and mixtures thereof.
Claim 18
Dependent Claim
23 words
The method as claimed in claim 1 wherein the filler is a mixture of tungsten carbide, tungsten metal, diamond dust and phosphorous pentoxide.
Claim 19
Dependent Claim
28 words
The method as claimed in claim 1 wherein the composition comprising the preceramic silicon-containing material and filler is heated to a temperature of 50° C. to 450° C.
Claim 20
Dependent Claim
25 words
The method as claimed in claim 1 wherein the composition comprising the preceramic silicon containing material and filler contains 50 to 99 wt % solvent.
Claim 21
Dependent Claim
12 words
The method as claimed in claim 19 wherein the solvent in nonane.
Claim 22
Dependent Claim
19 words
The method as claimed in claim 1 wherein the protection layer has a thickness of 0.5 to 500 micrometers.
Claim 23
Dependent Claim
19 words
The method as claimed in claim 1 wherein the sealer resin of (B) is a colloidal inorganic-based siloxane resin.
Claim 24
Dependent Claim
25 words
The method as claimed in claim 1 wherein the sealer resin is cured by heating the resin at a temperature 60° C. to 400° C.
Claim 25
Dependent Claim
20 words
The method as claimed in claim 1 wherein the resin sealer coat has a thickness of 0.1 to 8 micrometers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-01-26 | 2001-07-28 | 2002-01-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-01-26 | 2005-07-28 | 2006-01-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-01-26 | 2009-07-28 | 2010-01-27 | $7700.00 | Window Closed / Lapsed |