US5399441A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of applying opaque coatings
Assignee: Dow Silicones Corp
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Filing: 1994-04-12
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Granted: 1995-03-21
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Expires: 2014-04-12
Abstract
Abstract Disclosed is a method of forming opaque coatings on integrated circuits. The method comprises selectively applying a coating of a silica precursor resin and a filler onto the integrated circuit and heating the coated circuit at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
Inventors
- 👤 Clayton R. Bearinger
- 👤 Robert C. Camilletti
- 👤 Loren A. Haluska
- 👤 Keith W. Michael
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 02:39
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6326; H10P14/6342; C; C04; C04B; C04B41/00; C04B41/45; C04B41/50; C04B41/5025; C04B41/5035; H10P14/65; H10P14/6516; H10P14/6529; H10P14/6532; H10P14/66; H10P14/668; H10P14/6681; H10P14/6684; H10P14/6686; H10P14/69; H10P14/692; H10P14/6921; H10P14/6928; H10W; H10W42/00; H10W42/20; H10W42/40; C04B2111/00; C04B2111/00241; C04B2111/00258; C04B2111/00474; C04B2111/00844; C04B2111/80
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
81 words
A method of forming a radiopaque coating on an integrated circuit comprising: applying a coating composition comprising a silica precursor resin and a filler comprising an insoluble salt of a heavy metal onto the surface of an integrated circuit, wherein the coating composition is selectively applied such that the bond pads to be used for interconnection and the streets are not coated; and heating the coated integrated circuit to a temperature sufficient to convert the coating composition into a ceramic coating.
Claim 2
Independent Claim
81 words
A method of forming a radiopaque coating on an integrated circuit comprising: applying a coating composition comprising a silica precursor resin and a filler comprising an insoluble salt of a heavy metal onto the surface of an integrated circuit, wherein the coating composition is selectively applied such that the bond pads to be used for interconnection and the streets are not coated; and heating the coated integrated circuit to a temperature sufficient to convert the coating composition into a ceramic coating.
Claim 3
Dependent Claim
47 words
The method of claim 1 wherein the silica precursor resin is selected from the group consisting of hydrogen silsesquioxane resin and hydrolyzed or partially hydrolyzed R n Si(OR) 4-n , wherein R is an aliphatic, alicyclic or aromatic substituent of 1-20 carbon atoms and n is 0-3.
Claim 4
Dependent Claim
58 words
The method of claim 1 wherein the coated integrated circuit is heated to a temperature in the range of between about 50° C. and about 800° C. for less than about 3 hours in an environment selected from the group consisting of air, O 2 , oxygen plasma, an inert gas, ammonia, amines, moisture, and N 2 O.
Claim 5
Dependent Claim
28 words
The method of claim 1 wherein the coating composition also contains a material selected from the group consisting of filler surface modifiers, abrasion resistant agents and suspending agents.
Claim 6
Dependent Claim
22 words
The method of claim 1 wherein the filler is in a form selected from the group consisting of powders, particles and flakes.
Claim 7
Dependent Claim
33 words
The method of claim 1 wherein the filler is selected from the group consisting of the carbonates, sulfates and oxides of barium, lead, silver, gold, cadmium, antimony, tin, palladium, strontium, tungsten and bismuth.
Claim 8
Dependent Claim
28 words
The method of claim 1 wherein the filler is present in the coating composition in an amount in the range of about 5 to about 80 weight percent.
Claim 9
Dependent Claim
10 words
The integrated circuit coated by the method of claim 1.
Claim 10
Independent Claim
73 words
A method of forming an optically opaque coating on an integrated circuit comprising: applying a coating composition comprising a silica precursor resin and an optically opaque filler onto an integrated circuit, wherein the coating composition is selectively applied such that the bond pads to be used for interconnection and the streets are not coated; and heating the coated electronic substrate at a temperature sufficient to convert the coating composition into a ceramic coating.
Claim 11
Independent Claim
73 words
A method of forming an optically opaque coating on an integrated circuit comprising: applying a coating composition comprising a silica precursor resin and an optically opaque filler onto an integrated circuit, wherein the coating composition is selectively applied such that the bond pads to be used for interconnection and the streets are not coated; and heating the coated electronic substrate at a temperature sufficient to convert the coating composition into a ceramic coating.
Claim 12
Dependent Claim
47 words
The method of claim 9 wherein the silica precursor resin is selected from the group consisting of hydrogen silsesquioxane resin and hydrolyzed or partially hydrolyzed R n Si(OR) 4-n , wherein R is an aliphatic, alicyclic or aromatic substituent of 1-20 carbon atoms and n is 0-3.
Claim 13
Dependent Claim
58 words
The method of claim 9 wherein the coated integrated circuit is heated at a temperature in the range of between about 50° C. and about 800° C. for less than about 3 hours in an environment selected from the group consisting of air, O 2 , oxygen plasma, an inert gas, ammonia, amines, moisture, and N 2 O.
Claim 14
Dependent Claim
28 words
The method of claim 9 wherein the coating composition also contains a material selected from the group consisting of filler surface modifiers, suspending agents and abrasion resistant agents.
Claim 15
Dependent Claim
23 words
The method of claim 9 wherein the filler is in a form selected from the group consisting of powders, particles, flakes and microballoons.
Claim 16
Dependent Claim
27 words
The method of claim 9 wherein the filler is selected from the group consisting of oxides, nitrides, and carbides of silicon or alumina, metals and inorganic pigments.
Claim 17
Dependent Claim
28 words
The method of claim 9 wherein the filler is present in the coating composition in an amount in the range of about 5 to about 80 weight percent.
Claim 18
Dependent Claim
10 words
The integrated circuit coated by the method of claim 9.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-20 | 1998-09-19 | 1999-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-20 | 2002-09-19 | 2003-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-20 | 2006-09-19 | 2007-03-21 | $7700.00 | Window Closed / Lapsed |