Patent US5656862A successfully refreshed from Google Patents.
US5656862A
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US
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Solder interconnection structure
Assignee: International Business Machines Corp
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Filing: 1993-05-06
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Granted: 1997-08-12
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Expires: 2013-05-06
Abstract
Abstract Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.
Inventors
- 👤 Kostas I. Papathomas
- 👤 David Wei Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:30
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W74/40; H10W74/47; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H05K3/285; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31547
Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
169 words
A solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate comprising a plurality of solder connections that extend from the carrier substrate to electrodes on said semiconductor device to form a gap between said carrier substrate and the semiconductor device, wherein said gap is filled with a composition obtained from curing a composition containing: A. a binder selected from the group of cycloaliphatic polyepoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 5,000 centipoise; B. filler chosen from the group consisting of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, beryllium oxide, boron nitride, and diamond powder, said filler having a maximum particle size of 31 microns; wherein the amount of A is about 60 to about 25% by weight of the total of A and B and correspondingly, the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B.
Claim 2
Dependent Claim
169 words
A solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate comprising a plurality of solder connections that extend from the carrier substrate to electrodes on said semiconductor device to form a gap between said carrier substrate and the semiconductor device, wherein said gap is filled with a composition obtained from curing a composition containing: A. a binder selected from the group of cycloaliphatic polyepoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 5,000 centipoise; B. filler chosen from the group consisting of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, beryllium oxide, boron nitride, and diamond powder, said filler having a maximum particle size of 31 microns; wherein the amount of A is about 60 to about 25% by weight of the total of A and B and correspondingly, the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B.
Claim 3
Dependent Claim
12 words
The solder interconnection of claim 1 wherein the filler is aluminum nitride.
Claim 4
Dependent Claim
17 words
The solder interconnection of claim 1 wherein said gap is about 15 to about 160 microns wide.
Claim 5
Dependent Claim
23 words
The solder interconnection of claim 1 wherein said binder is a polyepoxide selected from the group of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate and vinyl cyclohexane diepoxide.
Claim 6
Dependent Claim
16 words
The solder interconnection of claim 1 wherein said binder is a polyepoxide that includes 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate.
Claim 7
Dependent Claim
19 words
The solder interconnection of claim 1 wherein said filler has particle sizes of about 0.5 to about 31 micrometers.
Claim 8
Dependent Claim
29 words
The solder interconnection of claim 1 wherein said amount of said binder is about 25-60% by weight and said amount of said filler is correspondingly about 45-75% by weight.
Claim 9
Dependent Claim
19 words
The solder interconnection of claim 1 wherein said composition also includes an anhydride of an organic carboxylic acid hardener.
Claim 10
Dependent Claim
19 words
The solder interconnection of claim 8 wherein said hardener includes hexahydrophthalic anhydride or methyl hexahydrophthalic anhydride or mixtures thereof.
Claim 11
Dependent Claim
19 words
The solder interconnection of claim 8 wherein the amount of the hardener is about 89 to about 110 phr.
Claim 12
Dependent Claim
22 words
The solder interconnection of claim 1 wherein the viscosity at 25° C. of said composition is about 1,500 to about 30,000 centipoise.
Claim 13
Dependent Claim
13 words
The solder interconnection of claim 1 wherein said composition also includes a catalyst.
Claim 14
Dependent Claim
19 words
The solder interconnection of claim 12 wherein the catalyst is chosen from the group consisting of benzyldimethylamine and imidazoles.
Claim 15
Dependent Claim
23 words
The solder interconnection of claim 1 wherein said composition also includes ethylene glycol in an amount of about 0.5 to about 2 phr.
Claim 16
Dependent Claim
15 words
The solder interconnection of claim 1 wherein said composition is free of unreactive organic solvents.
Claim 17
Dependent Claim
14 words
The solder interconnection of claim 1 wherein said composition also includes an adhesion promoter.
Claim 18
Dependent Claim
13 words
The solder interconnection of claim 1 wherein the composition contains a coupling agent.
Claim 19
Dependent Claim
29 words
The solder interconnection of claim 17 wherein the coupling agent is selected from the group consisting of γ-amino propyl triethoxy silane, β-(3,4,-epoxy cyclohexyl) ethyltrimethoxy silane, and γ-glycidoxy propyltrimethoxy silane.
Claim 20
Dependent Claim
29 words
The solder interconnection of claim 17 wherein the coupling agent is present in an amount which is about 0.25% by weight to about 2% by weight of the binder.
Claim 21
Dependent Claim
17 words
The solder interconnection of claim 1 wherein said substrate is an organic, inorganic or a composite material.
Claim 22
Dependent Claim
13 words
The solder interconnection of claim 20 wherein the substrate is an organic substrate.
Claim 23
Dependent Claim
35 words
The solder interconnection of claim 21 wherein the organic substrate comprises a material chosen from the group consisting of FR-4 epoxy, polyimides, cyanates (triazines), fluoropolymers, benzocyclobutenes, polyphenylenesulfide, polysulfones, polyetherimides, polyetherketones, polyphenylquinoxalines, polybenzoxazoles, and polyphenyl benzobisthiazoles.
Claim 24
Dependent Claim
13 words
The solder interconnection of claim 1 wherein said binder comprises a cyanate ester.
Claim 25
Dependent Claim
30 words
The solder interconnection of claim 23 wherein said cyanate ester is chosen from the group consisting of 4,4'-ethylidene bisphenol dicyanate, bisphenol-M dicyanate, bisphenol-P dicyanate, hexafluorobisphenol A dicyanate, and mixtures thereof.
Claim 26
Dependent Claim
116 words
A thermally conductive composite composition comprising: A. a binder selected from the group of cycloaliphatic polyepoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 5,000 centipoise; B. filler chosen from the group consisting of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, beryllium oxide, boron nitride, and diamond powder, said filler having a maximum particle size of 31 microns; wherein the amount of A is about 60 to about 25% by weight of the total of A and B and correspondingly, the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B.
Claim 27
Dependent Claim
116 words
A thermally conductive composite composition comprising: A. a binder selected from the group of cycloaliphatic polyepoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 5,000 centipoise; B. filler chosen from the group consisting of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, beryllium oxide, boron nitride, and diamond powder, said filler having a maximum particle size of 31 microns; wherein the amount of A is about 60 to about 25% by weight of the total of A and B and correspondingly, the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B.
Claim 28
Dependent Claim
14 words
The thermally conductive composite composition of claim 25 wherein the filler is aluminum nitride.
Claim 29
Dependent Claim
25 words
The thermally conductive composite composition of claim 25 wherein said binder is a polyepoxide selected from the group of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate and vinyl cyclohexane diepoxide.
Claim 30
Dependent Claim
18 words
The thermally conductive composite composition of claim 25 wherein said binder is a polyepoxide that includes 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate.
Claim 31
Dependent Claim
21 words
The thermally conductive composite composition of claim 25 wherein said filler has particle sizes of about 0.5 to about 31 micrometers.
Claim 32
Dependent Claim
31 words
The thermally conductive composite composition of claim 25 wherein said amount of said binder is about 25-60% by weight and said amount of said filler is correspondingly about 40-75% by weight.
Claim 33
Dependent Claim
21 words
The thermally conductive composite composition of claim 25 wherein said composition also includes an anhydride of an organic carboxylic acid hardener.
Claim 34
Dependent Claim
19 words
The solder interconnection of claim 8 wherein said hardener includes hexahydrophthalic anhydride or methyl hexahydrophthalic anhydride or mixtures thereof.
Claim 35
Dependent Claim
21 words
The thermally conductive composite composition of claim 25 wherein the amount of the hardener is about 89 to about 110 phr.
Claim 36
Dependent Claim
24 words
The thermally conductive composite composition of claim 25 wherein the viscosity at 25° C. of said composition is about 1,500 to about 30,000 centipoise.
Claim 37
Dependent Claim
15 words
The thermally conductive composite composition of claim 25 wherein said composition also includes a catalyst.
Claim 38
Dependent Claim
21 words
The thermally conductive composite composition of claim 35 wherein the catalyst is chosen from the group consisting of benzyldimethylamine and imidazoles.
Claim 39
Dependent Claim
25 words
The thermally conductive composite composition of claim 25 wherein said composition also includes ethylene glycol in an amount of about 0.5 to about 2 phr.
Claim 40
Dependent Claim
15 words
The thermally conductive composite composition of claim 25 wherein the composition contains a coupling agent.
Claim 41
Dependent Claim
31 words
The thermally conductive composite composition of claim 38 wherein the coupling agent is selected from the group consisting of γ-amino propyl triethoxy silane, β-(3,4,-epoxy cyclohexyl) ethyltrimethoxy silane, and γ-glycidoxy propyltrimethoxy silane.
Claim 42
Dependent Claim
31 words
The thermally conductive composite composition of claim 38 wherein the coupling agent is present in an amount which is about 0.25% by weight to about 2% by weight of the binder.
Claim 43
Dependent Claim
19 words
The thermally conductive composite composition of claim 25 wherein said substrate is an organic, inorganic or a composite material.
Claim 44
Dependent Claim
15 words
The thermally conductive composite composition of claim 25 wherein the substrate is an organic substrate.
Claim 45
Dependent Claim
37 words
The thermally conductive composite composition of claim 25 wherein the organic substrate comprises a material chosen from the group consisting of FR-4 epoxy, polyimides, cyanates (triazines), fluoropolymers, benzocyclobutenes, polyphenylenesulfide, polysulfones, polyetherimides, polyetherketones, polyphenylquinoxalines, polybenzoxazoles, and polyphenyl benzobisthiazoles.
Claim 46
Dependent Claim
15 words
The thermally conductive composite composition of claim 25 wherein said binder comprises a cyanate ester.
Claim 47
Dependent Claim
32 words
The thermally conductive composite composition of claim 44 wherein said cyanate ester is chosen from the group consisting of 4,4'-ethylidene bisphenol dicyanate, bisphenol-M dicyanate, bisphenol-P dicyanate, hexafluorobisphenol A dicyanate, and mixtures thereof.
References Cited (Backward Citations)
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