US5536765A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of sealing a soldered joint between a semiconductor device and a substrate
Assignee: International Business Machines Corp
•
Filing: 1995-06-06
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Granted: 1996-07-16
•
Expires: 2015-06-06
Abstract
Abstract Triazine polymers obtained by reacting (a) monocyanate; and (b) dicyanate and/or prepolymers thereof are used in forming interconnection structures for bonding an integrated semiconductor device to a carrier substrate.
Inventors
- 👤 Konstantinos I. Papathomas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 17:49
CPC Classifications
C; C08; C08G; C08G73/00; C08G73/06; C08G73/0622; C08G73/0638; C08G73/065; C08G73/0655; C08L; C08L79/00; C08L79/04; H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/00; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
167 words
A method of sealing a soldered joint between a semiconductor device and a substrate comprising the steps of: a) injecting a thermosetting composition containing as binder (1) a monomeric dicyanate and (2) a monomeric monocyanate into a gap located between the integrated circuit chip and the substrate, wherein the amount of (2) is about 5 to about 50% by weight of the total of (1) and (2), and correspondingly, the amount of (1) is about 50% to about 95% by weight based upon the amount of (1) and (2); and wherein said composition further comprises filler having a maximum particle size of about 49 microns and being substantially free of alpha particle emissions; wherein the amount of the binder is about 30% to about 50% by weight of the total of binder and filler and correspondingly, the amount of filler is about 50% to about 70% by weight based upon the weight of polymer and filler; and b) curing the dicyanate and monocyanate to form a triazine.
Claim 2
Independent Claim
167 words
A method of sealing a soldered joint between a semiconductor device and a substrate comprising the steps of: a) injecting a thermosetting composition containing as binder (1) a monomeric dicyanate and (2) a monomeric monocyanate into a gap located between the integrated circuit chip and the substrate, wherein the amount of (2) is about 5 to about 50% by weight of the total of (1) and (2), and correspondingly, the amount of (1) is about 50% to about 95% by weight based upon the amount of (1) and (2); and wherein said composition further comprises filler having a maximum particle size of about 49 microns and being substantially free of alpha particle emissions; wherein the amount of the binder is about 30% to about 50% by weight of the total of binder and filler and correspondingly, the amount of filler is about 50% to about 70% by weight based upon the weight of polymer and filler; and b) curing the dicyanate and monocyanate to form a triazine.
Claim 3
Dependent Claim
26 words
The method of claim 1 wherein said monocyanate is selected from the group consisting of nonylphenyl cyanate; dinonyl phenyl cyanate, cumyl phenyl cyanate and mixtures thereof.
Claim 4
Dependent Claim
12 words
The method of claim 2 wherein said dicyanate is 4,4'-ethylidene bisphenol dicyanate.
Claim 5
Dependent Claim
20 words
The method of claim 1 wherein said composition further contains about 0.5% to about 3% by weight of a surfactant.
Claim 6
Dependent Claim
12 words
The method of claim 4 wherein said composition further includes a catalyst.
Claim 7
Dependent Claim
16 words
The method of claim 1 wherein said gap is about 2 to about 6.0 mils wide.
Claim 8
Dependent Claim
41 words
The method of claim 1 wherein said composition exhibits a viscosity of 25° C. (Brookfield cone and plate spindle 51, 20 RPM or equivalent) of about 2000 to about 3000 centipoise and that is curable at about 200° C. or less.
Claim 9
Dependent Claim
20 words
The method of claim 1 wherein said composition further includes about 1% to about 1.4% by weight of a surfactant.
Claim 10
Dependent Claim
15 words
The method of claim 1 wherein the amount of filler is about 55% by weight.
Claim 11
Dependent Claim
21 words
The method of claim 1 wherein said composition has a viscosity at 25° C. is about 2000 to about 20,000 centipoise.
Claim 12
Dependent Claim
26 words
The method of claim 1 wherein said filler is an inorganic filler selected from the group of silica, quartz and fused silica coated with coupling agents.
Claim 13
Dependent Claim
19 words
The method of claim 1 wherein said filler has emission rate of less than 0.005 alpha particles/cm 2 -hr.
Claim 14
Dependent Claim
18 words
The method of claim 1 wherein said filler has particle sizes of about 0.5 to about 49 micrometers.
Claim 15
Dependent Claim
14 words
The method of claim 1 wherein said composition is free of unreactive organic solvents.
Claim 16
Dependent Claim
12 words
The method of claim 1 wherein said composition further includes a catalyst.
Claim 17
Dependent Claim
21 words
The method of claim 4 wherein said surfactant is selected from the group consisting of silanes and non-ionic surface active agents.
Claim 18
Dependent Claim
14 words
The method of claim 4 wherein said surfactant is a non-ionic alkylphenyl polyether alcohol.
Claim 19
Dependent Claim
12 words
The method of claim 1 wherein said substrate carrier is a ceramic.
Claim 20
Dependent Claim
13 words
The method of claim 1 wherein said substrate carrier is an FR-4 epoxy.
Claim 21
Dependent Claim
14 words
The method of claim 1 wherein said substrate carrier is an epoxy-glass reinforced substrate.
Claim 22
Dependent Claim
13 words
The method of claim 1 wherein said substrate is a polyimide flexible substrate.
Claim 23
Dependent Claim
12 words
The method of claim 1 wherein said substrate is a thermoplastic substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-16 | 2000-01-15 | 2000-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-16 | 2004-01-15 | 2004-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-16 | 2008-01-15 | 2008-07-16 | $7700.00 | Window Closed / Lapsed |