US5015719A
Expired / Lapsed
US
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Aromatic dicyanate/aromatic diepoxy compositions, cured products and methods
Assignee: International Business Machines Corp
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Filing: 1989-07-14
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Granted: 1991-05-14
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Expires: 2009-07-14
Abstract
Abstract Dicyanato diphenyl fluorinated alkane resin precursor compositions are modified by the addition of minor predetermined amounts of aromatic diepoxides having high epoxide equivalent weights in order to reduce the curing temperature of prepregs and laminates, such as circuit boards, while retaining low dielectric constants, heat stability and high flame retardance.
Inventors
- 👤 Kostas I. Papathomas
- 👤 William J. Summa
- 👤 David W. Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 18:07
CPC Classifications
C; C08; C08L; C08L63/00; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/034; Y; Y10; Y10T; Y10T428/00; Y10T428/30; Y10T428/31504; Y10T428/31551
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
90 words
Resin composition which is heat-curable at temperatures between about 190° and 270° C., has a dielectric constant between about 2.8 and 3.1, a glass transition temperature between about 215° and 270° C., flame retardance and substantial heat stability evidenced by a degradation temperature between about 400° and 430° C., said composition containing a mixture of reactive monomers and/or prepolymers comprising a major amount by weight of a dicyanato diphenyl fluoroalkane and a minor amount by weight of an aromatic diepoxide having an epoxide equivalent weight between about 240 and 255.
Claim 2
Dependent Claim
90 words
Resin composition which is heat-curable at temperatures between about 190° and 270° C., has a dielectric constant between about 2.8 and 3.1, a glass transition temperature between about 215° and 270° C., flame retardance and substantial heat stability evidenced by a degradation temperature between about 400° and 430° C., said composition containing a mixture of reactive monomers and/or prepolymers comprising a major amount by weight of a dicyanato diphenyl fluoroalkane and a minor amount by weight of an aromatic diepoxide having an epoxide equivalent weight between about 240 and 255.
Claim 3
Dependent Claim
16 words
A composition according to claim 1 in which said fluoroalkane comprises a dicyanato diphenyl hexafluoro isopropane.
Claim 4
Dependent Claim
17 words
A composition according to claim 2 in which said fluoroalkane comprises the 4,4' dicyanato hexafluoro bisphenol A.
Claim 5
Dependent Claim
17 words
A composition according to claim 1 in which said aromatic diepoxide comprises a linear bis(hydroxyphenyl)-p-dialkyl benzene diepoxide.
Claim 6
Dependent Claim
19 words
A composition according to claim 4 in which said aromatic diepoxide comprises a diglycidyl-bis-phenol-p-dialkyl benzene or an oligomer thereof.
Claim 7
Dependent Claim
16 words
A composition according to claim 5 in which said aromatic diepoxide comprises diglycidyl α, α'-bis(4-hydroxyphenyl)-p-diiospropyl benzene.
Claim 8
Dependent Claim
36 words
A composition according to claim 1 in which said mixture comprises from about 75% to 95% by weight of said fluoroalkane monomer or prepolymer and from about 5% to 25% by weight of said aromatic diepoxide.
Claim 9
Dependent Claim
91 words
A composition according to claim 7 in which said mixture comprises from about 80% to 90% by weight of said fluoroalkane monomer and from about 10% to 20% by weight of said aromatic diepoxide whereby said composition is curable at a temperature between about 190° and 270° C. to produce cured prepregs or laminates having a dielectric constant less than 4.0, a glass transition temperature between about 215° and 260° C., and a degradation temperature between about 410° and 425° C. and a flame retardancy rating of UL94 V-0 to V-1.
Claim 10
Dependent Claim
16 words
A composition according to claim 8 in which said fluoroalkane comprises a dicyanato diphenyl hexafluoro isopropane.
Claim 11
Dependent Claim
19 words
A composition according to claim 8 in which said aromatic diepoxide comprises a diglycidyl-bis-phenol-p-dialkyl benzene or an oligomer thereof.
Claim 12
Dependent Claim
95 words
A prepreg which is heat-curable at temperatures between about 190° and 270° C. to have a dielectric constant less than 4.0, a glass transition temperature between about 215° and 260° C. flame retardance and substantial heat stability evidenced by a degradation temperature between about 400° and 430° C., said prepreg comprising a reinforcing fabric impregnated with a composition containing a mixture of reactive prepolymers comprising a major amount by weight of a dicyanato diphenyl fluoroalkane and a minor amount by weight of an aromatic diepoxide having an epoxide equivalent weight between about 240 and 255.
Claim 13
Dependent Claim
95 words
A prepreg which is heat-curable at temperatures between about 190° and 270° C. to have a dielectric constant less than 4.0, a glass transition temperature between about 215° and 260° C. flame retardance and substantial heat stability evidenced by a degradation temperature between about 400° and 430° C., said prepreg comprising a reinforcing fabric impregnated with a composition containing a mixture of reactive prepolymers comprising a major amount by weight of a dicyanato diphenyl fluoroalkane and a minor amount by weight of an aromatic diepoxide having an epoxide equivalent weight between about 240 and 255.
Claim 14
Dependent Claim
20 words
A prepeg according to claim 11 in which said fluoroalkane comprises a dicyanato diphenyl hexafluoro isopropane or an oligomer thereof.
Claim 15
Dependent Claim
16 words
A prepreg according to claim 12 in which said fluoroalkane comprises the 4,4-dicyanato hexafluoro bisphenol A.
Claim 16
Dependent Claim
17 words
A prepreg according to claim 11 in which said aromatic diepoxide comprises a linear bis(hydroxyphenyl)-p-dialkyl benzene diepoxide.
Claim 17
Dependent Claim
19 words
A prepreg according to claim 14 in which said aromatic diepoxide comprises a diglycidyl-bis-phenol-p-dialkyl benzene or an oligomer thereof.
Claim 18
Dependent Claim
15 words
A prepreg according to claim 15 in which said aromatic diepoxide comprises diglycidyl-α, α'-bis-(4-hydroxyphenyl)-p-diiospropyl benzene.
Claim 19
Dependent Claim
33 words
A prepreg according to claim 11 in which said mixture comprises from about 75% to 95% by weight of said fluoroalkane and from about 5% to 25% by weight of said aromatic diepoxide.
Claim 20
Dependent Claim
80 words
A. prepreg according to claim 17 in which said mixture comprises from about 80% to 90% by weight of said fluoroalkane and from about 10% to 20% by weight of said aromatic diepoxide whereby said composition is curable at a temperature between about 190° and 270° C. to produce cured prepregs or laminates having a dielectric constant less than 4.0, a glass transition temperature between about 215° and 260° C. and a degradation temperature between about 400° and 425° C.
Claim 21
Dependent Claim
16 words
A prepreg according to claim 18 in which said fluoroalkane comprises a dicyanato diphenyl hexafluoro isopropane.
Claim 22
Dependent Claim
18 words
A prepreg according to claim 18 in which said aromatic diepoxide comprises diglycidyl-bis-phenol-p-dialkyl benzene or an oligomer thereof.
Claim 23
Dependent Claim
34 words
A circuit board comprising a laminate of at least one prepreg according to claim 11 and at least one layer of a conductive metal bonded thereto to form a composite structure suitable for circuitization.
Claim 24
Dependent Claim
83 words
A circuit board according to claim 21 comprising a laminate of at least one prepreg comprising a reinforcing fabric impregnated with a composition containing a mixture of from about 75% to 95% by weight of a dicyanato diphenyl hexafluoro isopropane and from about 5% to 25% by weight of a linear triphenyl alkane diepoxide having an epoxide equivalent weight between about 240 and 255, and at least one layer of a conductive metal bonded thereto to form a composite structure suitable for circuitization.
Claim 25
Dependent Claim
30 words
A circuit board according to claim 22 comprising from about 80% to 90% by weight of said fluorinated isopropane and from about 10% to 20% by weight of said diepoxide.
Claim 26
Independent Claim
89 words
A method for producing a resin composition which is heat-curable at temperatures between about 190° and 270° C., has a dielectric constant between about 2.8 and 3.1, a glass transition temperature between about 215° and 260° C, flame retardance and substantial heat stability evidenced by a degradation temperature between about 400° and 430° C., comprising reacting a major amount by weight of a dicyanato diphenyl fluoroalkane monomer or prepolymer and a minor amount by weight of an aromatic diepoxide having an epoxide equivalent weight between about 240 and 255.
Claim 27
Independent Claim
89 words
A method for producing a resin composition which is heat-curable at temperatures between about 190° and 270° C., has a dielectric constant between about 2.8 and 3.1, a glass transition temperature between about 215° and 260° C, flame retardance and substantial heat stability evidenced by a degradation temperature between about 400° and 430° C., comprising reacting a major amount by weight of a dicyanato diphenyl fluoroalkane monomer or prepolymer and a minor amount by weight of an aromatic diepoxide having an epoxide equivalent weight between about 240 and 255.
Claim 28
Dependent Claim
15 words
Method according to claim 24 in which said fluoroalkane comprises a dicyanato diphenyl hexafluoro isopropane.
Claim 29
Dependent Claim
16 words
Method according to claim 25 in which said fluoroalkane comprises the 4,4 dicyanato hexafluoro bisphenol A.
Claim 30
Dependent Claim
16 words
Method according to claim 24 in which said aromatic diepoxide comprises a linear bis(hydroxyphenyl)-p-dialkyl benzene diepoxide.
Claim 31
Dependent Claim
19 words
A composition according to claim 27 in which said aromatic diepoxide comprises a diglycidyl-bis-phenol-p-dialkyl benzene or an oligomer thereof.
Claim 32
Dependent Claim
15 words
Method according to claim 28 in which said aromatic diepoxide comprises diglycidyl α, α'-bis(4-hydroxyphenyl)-p-diiospropyl benzene.
Claim 33
Dependent Claim
35 words
Method according to claim 24 in which said mixture comprises from about 75% to 95% by weight of said fluoroalkane monomer or prepolymer and from about 5% to 25% by weight of said aromatic diepoxide.
Claim 34
Dependent Claim
94 words
Method according to claim 30 in which said mixture comprises from about 80% to 90% by weight of said fluoroalkane monomer and from about 10% to 20% by weight of said aromatic diepoxide, impregnating said composition into a reinforcing fabric and curing at a temperature between about 230° and 250° C. to produce cured prepregs or laminates having a dielectric constant less than 4.0, a glass transition temperature between about 215° and 260° C., and a degradation temperature between about 410° and 425° C. and a flame retardancy rating of UL94 V-0 to V-1.
References Cited (Backward Citations)
US3463762A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-05-13 | 1994-11-12 | 1995-05-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-05-13 | 1998-11-12 | 1999-05-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-05-13 | 2002-11-12 | 2003-05-14 | $7700.00 | Window Closed / Lapsed |