Endcap chip with conductive, monolithic L-connect for multichip stack

Claim 2

A carrierless endcap chip a multichip stack, said stack including multiple integrated circuit chips laminated together such that at least one principal surface of each integrated circuit chip contacts a principal surface of an adjacent integrated circuit chip in the multichip stack, said endcap chip comprising: a substrate of semiconductor material having an upper surface, a lower surface and an edge surface, said edge surface extending in a plane substantially orthogonal to a plane containing said upper surface, and said lower surface contacting a principal surface of an adjacent integrated circuit chip of said stack; and a conductive, monolithic L-connect integral with the substrate and having a first leg extending at least partially over said upper surface of said substrate and a second leg extending at least partially over said edge surface of said substrate, said second leg having a substantially planar outer surface, wherein when said endcap chip is employed as an end chip within said multichip stack, said conductive, monolithic L-connect electrically interconnects metal on an end face of said multichip stack and metal on a side face of said multichip stack, said side face being parallel to said edge surface of said substrate, and said end face being defined by the upper surface of said substrate.

Claim 3

The endcap chip of claim 1, wherein said semiconductor material comprises silicon.

Claim 4

The endcap chip of claim 1, wherein said metal on said side face of said multichip stack comprises a first type of metal, and wherein said conductive, monolithic L-connect also comprises said first type of metal.

Claim 5

The endcap chip of claim 1, wherein said substrate has a thickness measured from said lower surface to said upper surface of less than 100 μm.

Claim 6

The endcap chip of claim 1, wherein said substrate has a rectangular configuration with four edges, said edge surface comprising a first edge of said four edges, and wherein said endcap chip further comprises at least one additional conductive, monolithic L-connect having a first leg extending at least partially over said upper surface of said substrate and a second leg extending at least partially over a second edge of said substrate, said second edge being different from said first edge.

Claim 7

The endcap chip of claim 5, wherein said first leg of said conductive, monolithic L-connect and said first leg of said at least one additional conductive, monolithic L-connect comprise different metal levels above said upper surface of said substrate.

Claim 8

The endcap chip of claim 1, wherein said endcap chip further comprises an active integrated circuit region supported by said substrate.

Claim 9

A multichip stack comprising: a plurality of integrated circuit chips laminated together such that at least one principal surface of each integrated circuit chip contacts a principal surface of an adjacent integrated circuit chip; an endcap chip comprised of semiconductor material and having a first principal surface, a second principal surface and an edge surface, said edge surface residing in a plane substantially orthogonal to said first principal surface and said second principal surface, said second principal surface of said endcap chip contacting a principal surface of an end integrated circuit chip of said plurality of integrated circuit chips, said endcap chip further including a conductive, monolithic L-connect integral with said endcap chip and having a first leg extending at least partially over said first principal surface and a second leg extending at least partially over said edge surface, said second leg having a substantially planar outer surface; a first metallization disposed on a side face formed by said plurality of integrated circuit chips and said endcap chip, and a second metallization disposed over an end face defined by said first principal surface of said endcap chip; and wherein said conductive, monolithic L-connect of said endcap chip electrically connects said first metallization on said side face and said second metallization on said end face of said multichip stack.

Claim 10

A multichip stack comprising: a plurality of integrated circuit chips laminated together such that at least one principal surface of each integrated circuit chip contacts a principal surface of an adjacent integrated circuit chip; an endcap chip comprised of semiconductor material and having a first principal surface, a second principal surface and an edge surface, said edge surface residing in a plane substantially orthogonal to said first principal surface and said second principal surface, said second principal surface of said endcap chip contacting a principal surface of an end integrated circuit chip of said plurality of integrated circuit chips, said endcap chip further including a conductive, monolithic L-connect integral with said endcap chip and having a first leg extending at least partially over said first principal surface and a second leg extending at least partially over said edge surface, said second leg having a substantially planar outer surface; a first metallization disposed on a side face formed by said plurality of integrated circuit chips and said endcap chip, and a second metallization disposed over an end face defined by said first principal surface of said endcap chip; and wherein said conductive, monolithic L-connect of said endcap chip electrically connects said first metallization on said side face and said second metallization on said end face of said multichip stack.

Claim 11

The multichip stack of claim 8, wherein at least some integrated circuit chips of said plurality of said integrated circuit chips have silicon substrates and said endcap chip has a silicon substrate.

Claim 12

The multichip stack of claim 9, wherein said endcap chip includes an active integrated circuit region.

Claim 13

The multichip stack of claim 8, wherein said first metallization disposed on said side face comprises a first type of metal and wherein said conductive, monolithic L-connect of said endcap chip also comprises said first type of metal.

Claim 14

The multichip stack of claim 8, wherein each chip of said plurality of integrated circuit chips and said endcap chip has a rectangular configuration with four edges, said edge surface of said endcap chip comprising a first edge of said four edges of said endcap chip, and wherein said endcap chip further comprises at least one additional conductive, integral monolithic L-connect having a first leg extending at least partially over said upper surface and a second leg with a substantially planar outer surface extending at least partially over a second edge, said second edge being different from said first edge, and wherein said multichip stack further comprises a third metallization disposed on a second side face such that said at least one additional conductive, monolithic L-connect electrically connects said third metallization on said second side face and said second metallization on said end face of said multichip stack.

Claim 15

The multichip stack of claim 12, wherein said first leg of said conductive, monolithic L-connect and said first leg of said at least one additional conductive, monolithic L-connect comprise different metal levels disposed above said first principal surface of said endcap chip.

Claim 16

The multichip stack of claim 8, wherein said first metallization directly physically attaches to said second leg of said conductive, monolithic L-connect.

Claim 17

The multichip stack of claim 14, wherein at least some integrated circuit chips of said plurality of integrated circuit chips include transfer wirings to said side face, and wherein said first metallization electrically couples to said transfer wirings via standard T-connects.

Claim 18

The multichip stack of claim 14, wherein at least some integrated circuit chips of said plurality of integrated circuit chips include transfer wirings to said side face, and wherein said first metallization directly physically attaches to said transfer wirings.

Claim 19

The multichip stack of claim 8, wherein each chip of said plurality of integrated circuit chips and said endcap chip is rectangular shaped and has a width defined within lithographic tolerances.

Claim 20

The multichip stack of claim 8, wherein each chip of said plurality of integrated circuit chips and said endcap chip has a thickness of less than 100 μm.

Claim 21

A carrierless chip of a multichip stack comprising: a substrate of semiconductor material having an upper surface, a lower surface and an edge surface, said edge surface extending in a plane substantially orthogonal to a plane containing said upper surface, and said lower surface contacting a principal surface of an adjacent integrated circuit chip of said stack; and a conductive, monolithic L-connect integral with the substrate and having a first leg extending at least partially over said upper surface of said substrate and a second leg extending at least partially over said edge surface of said substrate, said second leg having a substantially planar outer surface, wherein when said chip is employed within said multichip stack, said conductive, monolithic L-connect electrically connects to metal on a side face of said multichip stack, said side face being parallel to said edge surface of said substrate.

Claim 22

A carrierless chip of a multichip stack comprising: a substrate of semiconductor material having an upper surface, a lower surface and an edge surface, said edge surface extending in a plane substantially orthogonal to a plane containing said upper surface, and said lower surface contacting a principal surface of an adjacent integrated circuit chip of said stack; and a conductive, monolithic L-connect integral with the substrate and having a first leg extending at least partially over said upper surface of said substrate and a second leg extending at least partially over said edge surface of said substrate, said second leg having a substantially planar outer surface, wherein when said chip is employed within said multichip stack, said conductive, monolithic L-connect electrically connects to metal on a side face of said multichip stack, said side face being parallel to said edge surface of said substrate.

Claim 23

The chip of claim 19 wherein said metal on the side face of said multichip stack comprises a photolithographically defined thin film metal layer.