Patent US5607609A successfully refreshed from Google Patents.
US5607609A
Expired / Lapsed
US
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Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
Assignee: Fujitsu Ltd
•
Filing: 1994-10-24
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Granted: 1997-03-04
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Expires: 2014-10-24
Abstract
Abstract In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit board, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit board with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.
Inventors
- 👤 Seiki Sakuyama
- 👤 Hiroki Uchida
- 👤 Isao Watanabe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 11:00
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/005; B23K1/0053; B23K1/08; B23K35/00; B23K35/02; B23K35/0222; B23K35/0244; B23K35/025; B23K35/22; B23K35/36; B23K35/3612; H; H05; H05B; H05B3/00; H05B3/20; H05B3/22; H05B3/28; H05B3/283; H05B3/286; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3494; B23K2101/00; B23K2101/36; B23K2101/42; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49083
Claims Analysis
Total Claims: 59
Claim 1
Independent Claim
172 words
A soldering process comprising the steps of: a) providing in a furnace first and second heaters each adapted to emit infrared energy, the first heater comprising a first emitter most efficiently emitting in wavelengths greater than or equal to 2.5 μm, a heat conduction plate, a heating element disposed below the heat conduction plate for heating the heat conduction plate, a buffer layer formed on an upper surface of the heat conduction plate by flame-spraying, and an infrared radiation layer formed on an upper surface of the buffer layer by flame-spraying for receiving heat from the heat conduction plate through the buffer layer and emitting infrared radiation, the second heater including a second emitter most efficiently emitting in wavelengths less than 2.5 μm; b) setting a printed board, which has a solder paste and an electronic component thereon, in the furnace; c) heating the printed circuit board with the first heater; and d) heating the electronic component with the second heater, individually controlling temperatures of the printed circuit board and electronic component.
Claim 2
Dependent Claim
172 words
A soldering process comprising the steps of: a) providing in a furnace first and second heaters each adapted to emit infrared energy, the first heater comprising a first emitter most efficiently emitting in wavelengths greater than or equal to 2.5 μm, a heat conduction plate, a heating element disposed below the heat conduction plate for heating the heat conduction plate, a buffer layer formed on an upper surface of the heat conduction plate by flame-spraying, and an infrared radiation layer formed on an upper surface of the buffer layer by flame-spraying for receiving heat from the heat conduction plate through the buffer layer and emitting infrared radiation, the second heater including a second emitter most efficiently emitting in wavelengths less than 2.5 μm; b) setting a printed board, which has a solder paste and an electronic component thereon, in the furnace; c) heating the printed circuit board with the first heater; and d) heating the electronic component with the second heater, individually controlling temperatures of the printed circuit board and electronic component.
Claim 3
Dependent Claim
44 words
A soldering process as set forth in claim 1, wherein in said step a) the furnace further includes a third heater which is an infrared radiation heater presenting a radiation spectrum having a maximum peak in a wavelength range of 2.5 μm or longer.
Claim 4
Dependent Claim
37 words
A soldering process as set forth in claim 1, wherein in said step a) the first heater presents a radiation spectrum having a maximum peak in a wavelength range between about 5 μm and about 8 μm.
Claim 5
Dependent Claim
36 words
A soldering process as set forth in claim 1, wherein in said step a) the second heater presents a radiation spectrum having a maximum peak in a wavelength range about 1 μm and about 2 μm.
Claim 6
Dependent Claim
21 words
A soldering process as set forth in claim 1, wherein in said step a) the second heater comprises a halogen lamp.
Claim 7
Dependent Claim
35 words
A soldering process as set forth in claim 1, wherein said infrared radiation layer presents a radiation spectrum having a maximum peak in a wavelength range of between about 5 μm and about 8 μm.
Claim 8
Dependent Claim
19 words
A soldering process as set forth in claim 1, wherein said infrared radiation layer is formed of aluminum oxide.
Claim 9
Dependent Claim
24 words
A soldering process as set forth in claim 7, wherein said infrared radiation layer has a surface roughness of about 2 μm or less.
Claim 10
Dependent Claim
23 words
A soldering process as set forth in claim 1, wherein said heat conduction plate has a thermal conductivity of 50 w/m.k or greater.
Claim 11
Dependent Claim
32 words
A soldering process as set forth in claim 1, wherein said heat conduction plate is made of a material selected from the group consisting of aluminum, molybdenum, copper, graphite and aluminum nitride.
Claim 12
Dependent Claim
55 words
A soldering process as set forth in claim 1, wherein said first heater further comprises a buffer layer interposed between said heat conduction plate and said infrared radiation layer, said buffer layer having a coefficient of thermal expansion in a range between that of said heat conduction plate and that of said infrared radiation layer.
Claim 13
Dependent Claim
37 words
A soldering process as set forth in claim 1, wherein said furnace further comprises a conveyor for transporting the printed circuit board therethrough, said conveyor having support members for supporting said printed circuit board in point contact.
Claim 14
Dependent Claim
19 words
A soldering process as set forth in claim 1, wherein said solder paste is blended with a black pigment.
Claim 15
Dependent Claim
24 words
A soldering process as set forth in claim 13, wherein said black pigment comprises at least either one of carbon black and iron oxide.
Claim 16
Dependent Claim
37 words
A soldering process as set forth in claim 13, wherein said black pigment is added to the solder paste in an amount of about 1 wt % to about 5 wt % relative to the solder paste.
Claim 17
Dependent Claim
192 words
A soldering process comprising the steps of: a) providing in a furnace first and second heaters each adapted to emit infrared energy, the first heater comprising a first emitter most efficiently emitting in wavelengths greater than or equal to 2.5 μm, a heat conduction plate, a heating element disposed below the heat conduction plate for heating the heat conduction plate, a buffer layer formed on an upper surface of the heat conduction plate by flame-spraying, and an infrared radiation layer formed on an upper surface of the buffer layer by flame-spraying for receiving heat from the heat conduction plate through the buffer layer and emitting infrared radiation, the second heater including a second emitter most efficiently emitting in wavelengths less than 2.5 μm; b) setting a printed board, which has a solder paste and an electronic component thereon, in the furnace, said solder paste being blended with a powdered infrared radiation material the same as that of the infrared radiation layer; c) heating the printed circuit board with the first heater; and d) heating the electronic component with the second heater, individually controlling temperatures of the printed circuit board and electronic component.
Claim 18
Dependent Claim
192 words
A soldering process comprising the steps of: a) providing in a furnace first and second heaters each adapted to emit infrared energy, the first heater comprising a first emitter most efficiently emitting in wavelengths greater than or equal to 2.5 μm, a heat conduction plate, a heating element disposed below the heat conduction plate for heating the heat conduction plate, a buffer layer formed on an upper surface of the heat conduction plate by flame-spraying, and an infrared radiation layer formed on an upper surface of the buffer layer by flame-spraying for receiving heat from the heat conduction plate through the buffer layer and emitting infrared radiation, the second heater including a second emitter most efficiently emitting in wavelengths less than 2.5 μm; b) setting a printed board, which has a solder paste and an electronic component thereon, in the furnace, said solder paste being blended with a powdered infrared radiation material the same as that of the infrared radiation layer; c) heating the printed circuit board with the first heater; and d) heating the electronic component with the second heater, individually controlling temperatures of the printed circuit board and electronic component.
Claim 19
Dependent Claim
28 words
A soldering process as set forth in claim 16, wherein said powdered infrared radiation material has an average particle diameter of about 5 μm to about 50 μm.
Claim 20
Dependent Claim
39 words
A soldering process as set forth in claim 16, wherein said powdered infrared radiation material is added to the solder paste in an amount of about 1 wt % to about 50 wt % relative to the solder paste.
Claim 21
Dependent Claim
37 words
A soldering process as set forth in claim 16, wherein said powdered infrared radiation material is selected from the group consisting of zircon, aluminum oxide, titanium oxide, chromium oxide, silicon oxide, nickel oxide, and a blend thereof.
Claim 22
Dependent Claim
188 words
A soldering apparatus, comprising: a furnace; a first heater adapted to emit infrared radiation and disposed in said furnace, said first heater comprising: a first emitter most efficiently emitting in wavelengths greater than or equal to 2.5 μm. a heat conduction plate, a heating element disposed below said heat conduction plate for heating said heat conduction plate, a buffer layer formed on an upper surface of said heat conduction plate by flame-spraying, and an infrared radiation layer formed on an upper surface of said buffer layer by flame-spraying for receiving heat from said conduction plate through said buffer layer and emitting infrared radiation; a second heater adapted to emit infrared radiation and disposed in said furnace, said second heater comprising a second emitter most efficiently emitting in wavelengths less than 2.5 μm; support means for supporting in said furnace a printed circuit board on an upper surface on which a solder paste is applied and an electronic component is mounted; and controlling means for controlling a temperature of the printed circuit board by said first heater and controlling a temperature of the electronic component by said second heater.
Claim 23
Dependent Claim
188 words
A soldering apparatus, comprising: a furnace; a first heater adapted to emit infrared radiation and disposed in said furnace, said first heater comprising: a first emitter most efficiently emitting in wavelengths greater than or equal to 2.5 μm. a heat conduction plate, a heating element disposed below said heat conduction plate for heating said heat conduction plate, a buffer layer formed on an upper surface of said heat conduction plate by flame-spraying, and an infrared radiation layer formed on an upper surface of said buffer layer by flame-spraying for receiving heat from said conduction plate through said buffer layer and emitting infrared radiation; a second heater adapted to emit infrared radiation and disposed in said furnace, said second heater comprising a second emitter most efficiently emitting in wavelengths less than 2.5 μm; support means for supporting in said furnace a printed circuit board on an upper surface on which a solder paste is applied and an electronic component is mounted; and controlling means for controlling a temperature of the printed circuit board by said first heater and controlling a temperature of the electronic component by said second heater.
Claim 24
Dependent Claim
38 words
A soldering apparatus as set forth in claim 20, further comprising a third heater, which is an infrared radiation heater presenting a radiation spectrum having a maximum peak in a wavelength range of about 2.5 μm or longer.
Claim 25
Dependent Claim
33 words
A soldering apparatus as set forth in claim 20, wherein said first heater presents a radiation spectrum having a maximum peak in a wavelength range between about 5 μm and about 8 μm.
Claim 26
Dependent Claim
33 words
A soldering apparatus as set forth in claim 20, wherein said second heater presents a radiation spectrum having a maximum peak in a wavelength range between about 1 μm and about 2 μm.
Claim 27
Dependent Claim
17 words
A soldering apparatus as set forth in claim 20, wherein said second heater comprises a halogen lamp.
Claim 28
Dependent Claim
34 words
A soldering apparatus as set forth in claim 20, wherein said infrared radiation layer presents a radiation spectrum having a maximum peak in a wavelength range between about 5 μm and about 8 μm.
Claim 29
Dependent Claim
18 words
A soldering apparatus as set forth in claim 20, wherein said infrared radiation layer is formed of alumina.
Claim 30
Dependent Claim
24 words
A soldering apparatus as set forth in claim 26, wherein said infrared radiation layer has a surface roughness of about 2 μm or less.
Claim 31
Dependent Claim
23 words
A soldering apparatus as set forth in claim 20, wherein said heat conduction plate has a thermal conductivity of 50 w/m.k or greater.
Claim 32
Dependent Claim
32 words
A soldering apparatus as set forth in claim 20, wherein said heat conduction plate is made of a material selected from the group consisting of aluminum, molybdenum, copper, graphite and aluminum nitride.
Claim 33
Dependent Claim
55 words
A soldering apparatus as set forth in claim 20, wherein said first heater further comprises a buffer layer interposed between said heat conduction plate and said infrared radiation layer, said buffer layer having a coefficient of thermal expansion in a range between that of said heat conduction plate and that of said infrared radiation layer.
Claim 34
Dependent Claim
29 words
A soldering apparatus as set forth in claim 20, wherein said support means is a conveyor which has support members for supporting said printed circuit board in point contact.
Claim 35
Dependent Claim
80 words
An infrared heater, comprising: a heat conduction plate; a resistance heating element disposed below said heat conduction plate for heating said heat conduction plate; a buffer layer formed on an upper surface of said heat conduction plate by flame spraying; and an infrared radiation layer, formed on an upper surface of said buffer layer by flame-spraying, for receiving heat from said heat conduction plate through said buffer layer and emitting infrared radiation, said infrared radiation layer being formed of alumina.
Claim 36
Dependent Claim
80 words
An infrared heater, comprising: a heat conduction plate; a resistance heating element disposed below said heat conduction plate for heating said heat conduction plate; a buffer layer formed on an upper surface of said heat conduction plate by flame spraying; and an infrared radiation layer, formed on an upper surface of said buffer layer by flame-spraying, for receiving heat from said heat conduction plate through said buffer layer and emitting infrared radiation, said infrared radiation layer being formed of alumina.
Claim 37
Dependent Claim
24 words
An infrared heater as set forth in claim 32, wherein said infrared radiation layer has a surface roughness of about 2 μm or less.
Claim 38
Dependent Claim
34 words
An infrared heater as set forth in claim 32, wherein said infrared radiation layer presents a radiation spectrum having a maximum peak in a wavelength range between about 5 μm and about 8 μm.
Claim 39
Dependent Claim
23 words
An infrared heater as set forth in claim 32, wherein said heat conduction plate has a thermal conductivity of 50 w/m.k or greater.
Claim 40
Dependent Claim
32 words
An infrared heater as set forth in claim 32, wherein said heat conduction plate is made of a material selected from the group consisting of aluminum, molybdenum, copper, graphite and aluminum nitride.
Claim 41
Dependent Claim
114 words
A soldering process comprising the steps of: a) providing an infrared heater including an infrared radiation member made of an infrared radiation material which emits infrared radiation when heated and a heater member for heating the infrared radiation member; b) blending a powder of the infrared radiation material with a solder paste including a solder powder and a flux; c) applying the solder paste containing the powder of the infrared radiation material onto a printed circuit board; d) mounting an electronic component on the printed circuit board; and e) heating the printed circuit board having the electronic component mounted thereon by the infrared heater to solder the electronic component to the printed circuit board.
Claim 42
Dependent Claim
114 words
A soldering process comprising the steps of: a) providing an infrared heater including an infrared radiation member made of an infrared radiation material which emits infrared radiation when heated and a heater member for heating the infrared radiation member; b) blending a powder of the infrared radiation material with a solder paste including a solder powder and a flux; c) applying the solder paste containing the powder of the infrared radiation material onto a printed circuit board; d) mounting an electronic component on the printed circuit board; and e) heating the printed circuit board having the electronic component mounted thereon by the infrared heater to solder the electronic component to the printed circuit board.
Claim 43
Dependent Claim
28 words
A soldering process as set forth in claim 37, wherein the infrared radiation material powder has an average particle diameter of about 5 μm to about 50 μm.
Claim 44
Dependent Claim
39 words
A soldering process as set forth in claim 37, wherein the infrared radiation material powder is added to the solder paste in an amount of about 1 wt % to about 50 wt % relative to the solder paste.
Claim 45
Dependent Claim
36 words
A soldering process as set forth in claim 37, wherein the infrared radiation material is selected from the group consisting of zircon, aluminum oxide, titanium oxide, chromium oxide, silicon oxide, nickel oxide, and a blend thereof.
Claim 46
Dependent Claim
32 words
An assembly comprising a printed circuit board and an electronic component, said electronic component being soldered to said printed circuit board in accordance with a soldering process as recited in claim 1.
Claim 47
Dependent Claim
32 words
An assembly comprising a printed circuit board and an electronic component, said electronic component being soldered to said printed circuit board by means of a soldering apparatus as recited in claim 20.
Claim 48
Dependent Claim
30 words
An assembly comprising a printed circuit board and an electronic component, said electronic component being soldered to said printed circuit board using an infrared heater as recited in claim 32.
Claim 49
Dependent Claim
32 words
An assembly comprising a printed circuit board and an electronic component, said electronic component being soldered to the printed circuit board in accordance with a soldering process as recited in claim 37.
Claim 50
Dependent Claim
30 words
An assembly comprising a printed circuit board and an electronic component, said electronic component being soldered to the printed circuit board using a solder paste as recited in claim 37.
Claim 51
Dependent Claim
18 words
A soldering process as set forth in claim 1, wherein the first and second emitters differ in material.
Claim 52
Dependent Claim
18 words
A soldering apparatus as set forth in claim 20, wherein said first and second emitters differ in material.
Claim 53
Dependent Claim
34 words
A solder paste for soldering by an infrared heater including an infrared radiation member made of an infrared radiation material, comprising: a solder paste, a flux, and a powder of the infrared radiation material.
Claim 54
Dependent Claim
34 words
A solder paste for soldering by an infrared heater including an infrared radiation member made of an infrared radiation material, comprising: a solder paste, a flux, and a powder of the infrared radiation material.
Claim 55
Dependent Claim
28 words
A solder paste as set forth in claim 48, wherein said infrared radiation material powder has an average particle diameter of about 5 μm to about 50 μm.
Claim 56
Dependent Claim
39 words
A solder paste as set forth in claim 48, wherein said infrared radiation material powder is added to said solder paste in an amount of about 1 wt % to about 50 wt % relative to said solder paste.
Claim 57
Dependent Claim
36 words
A solder paste as set forth in claim 48, wherein said infrared radiation material is selected from the group consisting of zircon, aluminum oxide, titanium oxide, chromium oxide, silicon oxide, nickel oxide, and a blend thereof.
Claim 58
Dependent Claim
43 words
A soldering process as set forth in claim 1, wherein in step a) the furnace further includes a third heater which is an infrared radiation heater presenting a radiation spectrum having a maximum peak in a wavelength range of less than 2.5 μm.
Claim 59
Dependent Claim
37 words
A soldering apparatus as set forth in claim 20, further comprising a third heater, which is an infrared radiation heater presenting a radiation spectrum having a maximum peak in a wavelength range of less than 2.5 μm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2000-03-03 | 2000-09-02 | 2001-03-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-03 | 2004-09-02 | 2005-03-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-03 | 2008-09-02 | 2009-03-04 | $7700.00 | Window Closed / Lapsed |