US4833301A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-zone thermal process system utilizing nonfocused infrared panel emitters
Assignee: VS Holding Co
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Filing: 1987-03-25
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Granted: 1989-05-23
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Expires: 2007-03-25
Abstract
Abstract A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.
Inventors
- 👤 Edward J. Furtek
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 09:02
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/005; B23K1/0053; B23K1/008; B23K2101/00; B23K2101/36; B23K2101/42
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
216 words
A multi-zone thermal process apparatus utilizing infrared panel emitters for accomplishing reflow soldering of surface mounted devices to printed circuit boards, said apparatus comprising: an insulated housing; means for moving a printed circuit board with devices thereon through said housing; a first zone dispersed within said housing and having at least one infrared panel emitter with an infrared emitting surface spaced a predetermined distance from the printed circuit board; control means for tuning said emitter in said first zone to emit infrared radiation at a first predetermined peak wavelength; a second zone disposed within said housing and having at least one infrared panel emitter with an infrared emitting surface spaced a predetermined distance from the printed circuit board; second control means for tuning said emitter in said second zone to emit infrared radiation at a second predetermined peak wavelength, said second predetermined peak wavelength being greater than said first predetermined peak wavelength; a third zone disposed within said housing and having at least one infrared panel emitter with an infrared emitting surface spaced a predetermined distance from the printed circuit board; and third control means for tuning said emitter in said third zone to emit infrared radiation at a third predetermined peak wavelength, said third predetermined peak wavelength being less that said second predetermined peak wavelength.
Claim 2
Dependent Claim
216 words
A multi-zone thermal process apparatus utilizing infrared panel emitters for accomplishing reflow soldering of surface mounted devices to printed circuit boards, said apparatus comprising: an insulated housing; means for moving a printed circuit board with devices thereon through said housing; a first zone dispersed within said housing and having at least one infrared panel emitter with an infrared emitting surface spaced a predetermined distance from the printed circuit board; control means for tuning said emitter in said first zone to emit infrared radiation at a first predetermined peak wavelength; a second zone disposed within said housing and having at least one infrared panel emitter with an infrared emitting surface spaced a predetermined distance from the printed circuit board; second control means for tuning said emitter in said second zone to emit infrared radiation at a second predetermined peak wavelength, said second predetermined peak wavelength being greater than said first predetermined peak wavelength; a third zone disposed within said housing and having at least one infrared panel emitter with an infrared emitting surface spaced a predetermined distance from the printed circuit board; and third control means for tuning said emitter in said third zone to emit infrared radiation at a third predetermined peak wavelength, said third predetermined peak wavelength being less that said second predetermined peak wavelength.
Claim 3
Dependent Claim
23 words
Apparatus as recited in claim 1 wherein said predetermined distance is in the range of from about 0.125 inches to about 4 inches.
Claim 4
Dependent Claim
270 words
A multi-zone thermal process apparatus utilizing infrared panel emitters for accomplishing reflow soldering of surface mounted devices to printed circuit boards, said apparatus comprising: an insulated housing; means for moving at least one printed circuit board with devices thereon through said housing from a first end to a second end; a first zone disposed within said housing adjacent said first end and having one infrared panel emitter having an emitting surface for emitting infrared radiation at a first predetermined peak wavelength; a second zone disposed adjacent said first zone within said housing having means for cooling said board and said devices; a third zone disposed adjacent said second zone within said housing and having two confronting infrared panel emitters disposed on opposite sides of said moving means, each of said panel emitters having an emitting surface for emitting infrared radiation at a second predetermined peak wavelength; a fourth zone disposed adjacent said third zone within said housing and having two confronting infrared panel emitters disposed on opposite sides of said moving means, each of said panel emitters having an emitting surface for emitting infrared radiation at a third predetermined peak wavelength; a fifth zone disposed adjacent said fourth zone within said housing and having two confronting infrared panel emitters disposed on opposite sides of said moving means, each of said panel emitters having an emitting surface for emitting infrared radiation having a fourth predetermined peak wavelength; and a sixth zone disposed adjacent said fifth zone having second means for cooling said moving means and the board disposed thereon, said sixth zone being disposed adjacent said second end of said housing.
Claim 5
Dependent Claim
270 words
A multi-zone thermal process apparatus utilizing infrared panel emitters for accomplishing reflow soldering of surface mounted devices to printed circuit boards, said apparatus comprising: an insulated housing; means for moving at least one printed circuit board with devices thereon through said housing from a first end to a second end; a first zone disposed within said housing adjacent said first end and having one infrared panel emitter having an emitting surface for emitting infrared radiation at a first predetermined peak wavelength; a second zone disposed adjacent said first zone within said housing having means for cooling said board and said devices; a third zone disposed adjacent said second zone within said housing and having two confronting infrared panel emitters disposed on opposite sides of said moving means, each of said panel emitters having an emitting surface for emitting infrared radiation at a second predetermined peak wavelength; a fourth zone disposed adjacent said third zone within said housing and having two confronting infrared panel emitters disposed on opposite sides of said moving means, each of said panel emitters having an emitting surface for emitting infrared radiation at a third predetermined peak wavelength; a fifth zone disposed adjacent said fourth zone within said housing and having two confronting infrared panel emitters disposed on opposite sides of said moving means, each of said panel emitters having an emitting surface for emitting infrared radiation having a fourth predetermined peak wavelength; and a sixth zone disposed adjacent said fifth zone having second means for cooling said moving means and the board disposed thereon, said sixth zone being disposed adjacent said second end of said housing.
Claim 6
Dependent Claim
34 words
The apparatus of claim 3 further comprising means for controlling the peak wavelength emitted by the emitting surfaces for each of the panel emitters and each of said first, third, fourth and fifth zones.
Claim 7
Dependent Claim
42 words
The apparatus of claim 3 wherein the board and devices thereon are spaced from the emitting surfaces of each of said panel emitters in each of said zones a distance in the range of from about 0.125 inches to about 4 inches.
Claim 8
Dependent Claim
42 words
The apparatus of claim 3 further comprising rods for supporting said moving means, said rods being disposed approximately 0.125 inches above a lower one of the emitting surfaces of the infrared panel emitters in each of said third, fourth and fifth zones.
Claim 9
Dependent Claim
14 words
The apparatus of claim 3 wherein said first peak wavelength is approximately 3.5 microns.
Claim 10
Dependent Claim
31 words
The apparatus of claim 7 wherein said second peak wavelength is approximately 3.8 microns, said third peak wavelength is approximately 4 microns, and said fourth peak wavelength is approximately 3.9 microns.
Claim 11
Dependent Claim
193 words
A multi-zone thermal process apparatus using infrared panel emitters, said apparatus comprising: an insulated housing having a plurality of zones along its length; at least one infrared panel emitter disposed in each of said zones, each of said panel emitters having an emitting surface for emitting infrared radiation; means for moving a product load successively through each of said zones, said moving means being spaced a predetermined distance from each of said emitting surfaces; and means for selectively tuning each of said panel emitters in each of said zones to cause each of said panel emitters to selectively emit infrared radiation of a predetermined peak wavelength, said tuning means comprising: a primary emitter disposed in each of said panel emitters, each primary emitter comprising a metal foil having a pattern formed therein, said pattern covering about 60 percent to about 90 percent of the total foil area; a thermalcouple disposed closely adjacent each of said primary emitters; and means for controlling the temperature of each of said primary emitters independently of one another to independently control the peak wavelength of the infrared radiation emitted from said emitting of each of said panel emitters.
Claim 12
Dependent Claim
193 words
A multi-zone thermal process apparatus using infrared panel emitters, said apparatus comprising: an insulated housing having a plurality of zones along its length; at least one infrared panel emitter disposed in each of said zones, each of said panel emitters having an emitting surface for emitting infrared radiation; means for moving a product load successively through each of said zones, said moving means being spaced a predetermined distance from each of said emitting surfaces; and means for selectively tuning each of said panel emitters in each of said zones to cause each of said panel emitters to selectively emit infrared radiation of a predetermined peak wavelength, said tuning means comprising: a primary emitter disposed in each of said panel emitters, each primary emitter comprising a metal foil having a pattern formed therein, said pattern covering about 60 percent to about 90 percent of the total foil area; a thermalcouple disposed closely adjacent each of said primary emitters; and means for controlling the temperature of each of said primary emitters independently of one another to independently control the peak wavelength of the infrared radiation emitted from said emitting of each of said panel emitters.
Claim 13
Dependent Claim
32 words
The apparatus of claim 9 wherein said predetermined distance between the product load and each of said emitting surfaces is in the range of from about 0.125 inches to about 4 inches.
References Cited (Backward Citations)
US11303A
Cited
US1841537A
Cited
US1937319A
Cited
US2146427A
Cited
US2504146A
Cited
US2284078A
Cited
US2513993A
Cited
US2629162A
Cited
US2674809A
Cited
US2939807A
Cited
US3031739A
Cited
US3060300A
Cited
US3146340A
Cited
US3160736A
Cited
US3214565A
Cited
US3471682A
Cited
US3697728A
Cited
US3596351A
Cited
US3564207A
Cited
US3694627A
Cited
US3756489A
Cited
US3809859A
Cited
US3805024A
Cited
US4005979A
Cited
US3956612A
Cited
US4017967A
Cited
GB1581127A
Cited
US4245613A
Cited
US4247979A
Cited
JPS55125011A
Cited
US4310745A
Cited
US4366177A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-22 | 1992-11-21 | 1993-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-22 | 1996-11-21 | 1997-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-22 | 2000-11-21 | 2001-05-23 | $7700.00 | Window Closed / Lapsed |