Focused convection reflow soldering method and apparatus

Claim 2

A solder reflow apparatus for mass joining with solder electrical and electronic components positioned on a circuit board, and comprising in combination: (a) a preheating zone consisting of a combination of IR heating means and convective heating means for heating said board and components to just below the solder reflow temperature, said IR heating means and said convective heat means being arranged to provide temperature ramping and stabilization thereby avoiding overheating of individual components while equalizing the temperature differences among said board and individual components; and (b) a solder reflow zone comprising convective heating means for directing heated gas stream across said board and components to raise the temperature of said board and components sufficient to reflow solder preforms and/or solder paste or cream thereon.

Claim 3

A solder reflow apparatus according to claim 1, wherein said preheating zone is contained within a gas-containing enclosure, and including recirculating means for withdrawing hot gas from the enclosure heated by radiation from the components and recycling it into the enclosure as said convection stream.

Claim 4

A solder reflow apparatus according to claim 2, and additionally comprising: (a) heater means disposed in-line with said recirculating means for adding additional heat to said recycle gas stream before reintroducing it into the enclosure as said convection stream; and (b) temperature control means for sensing the temperature within said enclosure and for adjusting said heater means to heat said recycle gas stream to a predetermined temperature.

Claim 5

A solder reflow apparatus according to claim 2, and additionally comprising: (a) means operably connected to said recirculating means for introducing cooler outside gas to said recycle stream before reintroducing it into the enclosure; and, (b) temperature control means for sensing the temperature within said enclosure and for adjusting the mixture of said outside gas and said recycle stream to a predetermined temperature.

Claim 6

A solder reflow apparatus according to claim 1, and additionally comprising: adjustable nozzle means for directing a portion of said convection stream across and around selected components.

Claim 9

A method for mass reflow soldering according claim 6, wherein said preheating is preformed within a gas-containing enclosure, and including the step of withdrawing hot gas heated by radiation from the components from the enclosure and recycling at least a portion of the withdrawn gas said convection stream.

Claim 10

A method for mass reflow soldering according to claim 7, and additionally comprising the steps of sensing the temperature within said enclosure, and heating the recycle gas to a predetermined temperature.

Claim 11

A method of mass reflowing soldering according to claim 7, and additionally comprising the steps of sensing the temperature within said enclosure, and mixing outside gas with the recycle gas to a predetermined temperature.

Claim 12

A method of mass joining according to claim 6, and additionally comprising the step of directing a portion of the convection stream of gas across and around selected components.

Claim 13

Solder reflow apparatus for mass joining with solder electrical and electronic components positioned on a circuit board by heating the board and components sufficiently to reflow solder preforms and/or solder paste or cream thereon to electrically and mechanically join any components thereon to the board comprising: (a) A preheating station consisting of: (i) infrared heating means for directing infra-red energy onto the components and board; and (ii) convective heating means for directing relativley low velocity heated gas stream onto the components and board to aid in levelling component temperature to prevent large differences in temperature of different sized/colored components which could arise due to radiant heat transfer only, whereby to preheat the circuit board and components to a substantially uniform temperature just below the reflow temperature of the solder; and (b) A reflow station comprising means for directing a relatively high velocity focused heated gas stream from at least one gas knife to raise the temperature of the board and components to above the reflow temperature of the solder whereby the reflow of the solder is accomplished.

Claim 14

Solder reflow apparatus for mass joining with solder electrical and electronic components positioned on a circuit board by heating the board and components sufficiently to reflow solder preforms and/or solder paste or cream thereon to electrically and mechanically join any components thereon to the board comprising: (a) A preheating station consisting of: (i) infrared heating means for directing infra-red energy onto the components and board; and (ii) convective heating means for directing relativley low velocity heated gas stream onto the components and board to aid in levelling component temperature to prevent large differences in temperature of different sized/colored components which could arise due to radiant heat transfer only, whereby to preheat the circuit board and components to a substantially uniform temperature just below the reflow temperature of the solder; and (b) A reflow station comprising means for directing a relatively high velocity focused heated gas stream from at least one gas knife to raise the temperature of the board and components to above the reflow temperature of the solder whereby the reflow of the solder is accomplished.

Claim 15

A solder reflow apparatus according to claim 11, wherein said means for directing said relatively low velocity gas stream onto the components and solder comprises: (a) means for providing a source of hot gas; and, (b) means disposed for directing said hot gas stream as a broad convection stream across and around the components whereby cooler components are heated and hotter components are cooled thereby to stabilize the components at a substantially uniform temperature below the solder reflow temperature.

Claim 16

A solder reflow apparatus according to claim 12, contained within a common gas-containing enclosure; and, wherein said hot gas providing means includes means for withdrawing from the enclosure hot gas heated by radiation from the components and recycling at least a portion of the withdrawn hot gas into the enclosure as said convection stream.

Claim 17

A solder reflow apparatus according to claim 13, and additionally comprising: (a) heater means disposed in-line with said means for withdrawing for adding additional heat to said recycle hot gas stream; and, (b) temperature control means for sensing the temperature within said enclosure for employing said heater means to heat said withdrawn hot gas to a predetermined temperature.

Claim 18

A solder reflow apparatus according to claim 13, and additionally comprising: (a) outside gas introduction means operably connected to said means for withdrawing for adding cooler outside gas to said hot gas recycle stream; and (b) temperature control means for sensing the temperature within said enclosure and for mixing said outside gas with said withdrawn hot gas to achieve a predetermined temperature.

Claim 19

A solder reflow apparatus according to claim 12, and additionally comprising: adjustable nozzle means for directing a portion of said convection stream of gas across and around preselected components.

Claim 20

A mass reflow soldering method for mass joining with solder electrical and electronic components populating the top side surface of a circuit board along with solder preforms and/or solder paste or cream thereon comprising the steps of: (a) Preheating said circuit board, solder and components by (i) directing radiant heat onto the board, solder and components to raise the temperature thereof towards a temperature approaching the solder reflow temperature; and (ii) directing a first, relatively low velocity heated gas stream across and around said board, components and solder whereby cooler components are heated and hotter components are cooled thereby to stabilize the components at a substantially uniform temperature slightly below the reflow temperature of solder; and (b) Reflowing said solder by directing a second, relatively high velocity heated gas stream as a narrow knife-edged stream against the components and board to additionally heat the top side surface of the board, solder and components to a temperature above the reflow temperature of solder, whereby to electrically and mechanically join any components thereon to the top side surface of the board.

Claim 21

A mass reflow soldering method for mass joining with solder electrical and electronic components populating the top side surface of a circuit board along with solder preforms and/or solder paste or cream thereon comprising the steps of: (a) Preheating said circuit board, solder and components by (i) directing radiant heat onto the board, solder and components to raise the temperature thereof towards a temperature approaching the solder reflow temperature; and (ii) directing a first, relatively low velocity heated gas stream across and around said board, components and solder whereby cooler components are heated and hotter components are cooled thereby to stabilize the components at a substantially uniform temperature slightly below the reflow temperature of solder; and (b) Reflowing said solder by directing a second, relatively high velocity heated gas stream as a narrow knife-edged stream against the components and board to additionally heat the top side surface of the board, solder and components to a temperature above the reflow temperature of solder, whereby to electrically and mechanically join any components thereon to the top side surface of the board.

Claim 22

A mass reflow soldering method according to claim 17, wherein said soldering is accomplished within a common gas-containing enclosure and said step (b) of heating to a common uniform temperature comprises the steps of: (a) withdrawing hot gas from the enclosure heated by radiation from the components; (b) recycling the hot gas into the enclosure as said first, relatively low velocity heated gas stream and directing it onto the top side surface of the board, solder and components.

Claim 23

A mass soldering method according to claim 18, and additionally comprising the step of: directing a portion of said recycle gas stream across and around particular components of high thermal differential.

Claim 24

A mass soldering method according to claim 18 and additionally comprising the steps of: (a) sensing the temperature within said enclosure; and (b) heating the recycle gas stream to a predetermined temperature prior to reintroducing the gas stream into the enclosure.

Claim 25

A mass soldering method according to claim 18, and additionally comprising the steps of: (a) sensing the temperature within said enclosure; and (b) mixing outside gas with the recycle gas stream to achieve a predetermined temperature prior to reintroducing the recycle gas stream into the enclosure.

Claim 26

Solder reflow apparatus for mass joining with solder electrical and electronic components positioned on a circuit board and populating the top side surface of the board by heating the top side surface of the board sufficiently with infra-red energy and hot gas to reflow solder preforms and/or solder paste or cream thereon to electrically and mechanically join any components thereon to the top side surface of the board, wherein said apparatus includes an entrance, an exit, and means for transporting a circuit board to be soldered between said entrance and said exit and comprising in combination: (a) a preheating zone consisting of a combination of IR heating means and convection heating means for heating said board and components to a first, substantially uniform temperature just below the reflow temperature of said solder preforms, paste or cream, said IR heating means and said convective heating means being arranged to provide temperature ramping and stabilization thereby avoiding overheating and underheating of individual components while equalizing the temperature differences among said board and said individual components; and (b) a solder reflow zone comprising at least one knife-edged hot gas nozzle for directing a heated gas stream onto said board and components so as to heat said board and components to above the reflow temperature of said solder.

Claim 27

Solder reflow apparatus for mass joining with solder electrical and electronic components positioned on a circuit board and populating the top side surface of the board by heating the top side surface of the board sufficiently with infra-red energy and hot gas to reflow solder preforms and/or solder paste or cream thereon to electrically and mechanically join any components thereon to the top side surface of the board, wherein said apparatus includes an entrance, an exit, and means for transporting a circuit board to be soldered between said entrance and said exit and comprising in combination: (a) a preheating zone consisting of a combination of IR heating means and convection heating means for heating said board and components to a first, substantially uniform temperature just below the reflow temperature of said solder preforms, paste or cream, said IR heating means and said convective heating means being arranged to provide temperature ramping and stabilization thereby avoiding overheating and underheating of individual components while equalizing the temperature differences among said board and said individual components; and (b) a solder reflow zone comprising at least one knife-edged hot gas nozzle for directing a heated gas stream onto said board and components so as to heat said board and components to above the reflow temperature of said solder.

Claim 28

A solder reflow apparatus according to claim 22, wherein said means for transporting comprises a substantially horizontal conveyor means, and said at least one knife-edged gas nozzle is substantially vertically downwardly directed at said travel path.

Claim 29

A solder reflow apparatus according to claim 23, wherein said solder reflow zone comprises three gas nozzles.