US5586715A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making solder balls by contained paste deposition
Assignee: Agilent Technologies Inc
•
Filing: 1996-03-19
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Granted: 1996-12-24
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Expires: 2016-03-19
Abstract
Abstract A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
Inventors
- 👤 Matthew K. Schwiebert
- 👤 Donald T. Campbell
- 👤 Matthew Heydinger
- 👤 Robert E. Kraft
- 👤 Hubert A. Vander Plas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 06:04
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/3465; H05K3/3485; H10W72/00; H10W72/20; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/094; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10431; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2201/20; H05K2201/2036; H05K2203/00; H05K2203/04; H05K2203/043; H05K2203/05; H05K2203/0562; H05K2203/0568; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K3/10; H05K3/12; H05K3/1216; H05K3/346; H10W72/01; H10W72/011; H10W72/0112; H10W72/012; H10W72/01204; H10W72/01221; H10W72/01223; H10W72/01225; H10W72/01251; H10W72/01255; H10W72/071; H10W72/072; H10W72/07251; H10W72/07253; H10W72/073; H10W72/07321; H10W72/07327; H10W72/231; H10W72/237; H10W72/241; H10W72/251; H10W72/351; H10W72/352; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/756; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
96 words
A method for producing solder balls comprising the steps of: selecting a mask having a plurality of openings; selecting a solder paste; selecting a substrate non-wettable by the solder paste selected; positioning the mask on the substrate thereby forming a substrate-mask assembly; applying solder paste to the mask side of the substrate-mask assembly so that the mask openings load with solder paste; heating the substrate-mask assembly at a temperature sufficient to reflow the solder paste into a solder ball; removing the mask after formation of the solder ball; and removing the solder ball from the substrate.
Claim 2
Independent Claim
96 words
A method for producing solder balls comprising the steps of: selecting a mask having a plurality of openings; selecting a solder paste; selecting a substrate non-wettable by the solder paste selected; positioning the mask on the substrate thereby forming a substrate-mask assembly; applying solder paste to the mask side of the substrate-mask assembly so that the mask openings load with solder paste; heating the substrate-mask assembly at a temperature sufficient to reflow the solder paste into a solder ball; removing the mask after formation of the solder ball; and removing the solder ball from the substrate.
Claim 3
Dependent Claim
11 words
A method as in claim 1 wherein the mask is metal.
Claim 4
Dependent Claim
17 words
A method as in claim 2 wherein the metal mask is composed of 75-100 micron thick alloy.
Claim 5
Dependent Claim
20 words
A method as in claim 1 wherein the solder balls have pitches in the range of 150 to 350 microns.
Claim 6
Dependent Claim
17 words
A method as in claim 1 wherein the solder paste contains metal powder in a flux vehicle.
Claim 7
Dependent Claim
32 words
A method as in claim 1 wherein the solder paste contains an alloy of at least one metal that can be made into a powder and a flux vehicle for said powder.
Claim 8
Dependent Claim
17 words
A method as in claim 1 wherein the solder paste contains an 63 Sn 37 Pb alloy.
Claim 9
Dependent Claim
11 words
A method as in claim 1 wherein the apertures are cylindrical.
Claim 10
Dependent Claim
25 words
A method as in claim 1 wherein the apertures are cylindrical and the solder bumps have pitches in the range of 150 to 350 microns.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-24 | 2000-06-24 | 2000-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-24 | 2004-06-24 | 2004-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-24 | 2008-06-24 | 2008-12-24 | $7700.00 | Window Closed / Lapsed |