Process for forming a pattern using a resist composition having a siloxane-bond structure

Claim 1

A process for forming a pattern, comprising the steps of: forming a smoothing layer on a substrate; applying a composition having sensitivity to light or radiation to said smoothing layer to form a resist film, wherein said composition consists essentially of a polymer having a siloxane-bond structure and having at least one end group or a side chain group, and a sensitizing agent, each of said end group and said side chain group is a functional group which causes condensation polymerization upon exposure to acid; and exposing a portion of said resist film to light or radiation, thereby causing said sensitizing agent to provide an acid which causes condensation polymerization at said end group or said side chain group of said polymer; and developing said resist film by the use of an alkali developer.

Claim 11

A method for preparing a photomask, comprising the steps of: applying a light non-transmissive pattern on a surface of a substrate; applying a composition over the surface of said substrate with said light non-transmissive pattern to form a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR6## wherein R 1 , R 2 , R 3 , and R 4 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 3 and R 4 is a lower alkoxyl group having 1 to 5 carbon atoms; and n1 is an integer of 1 or more; exposing a portion of said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; and developing said resist film by the use of a developer, resulting in a phase shifter.

Claim 12

A method for preparing a photomask, comprising the steps of: applying a light non-transmissive pattern on a surface of a substrate; applying a composition over the surface of said substrate with said light non-transmissive pattern to form a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR6## wherein R 1 , R 2 , R 3 , and R 4 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 3 and R 4 is a lower alkoxyl group having 1 to 5 carbon atoms; and n1 is an integer of 1 or more; exposing a portion of said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; and developing said resist film by the use of a developer, resulting in a phase shifter.

Claim 14

A method for preparing a photomask, comprising the steps of: applying a light non-transmissive pattern on a surface of a substrate; applying a composition over the surface of said substrate with said light non-transmissive pattern to form a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR7## wherein R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 7 , R 8 , R 9 , and R 10 is a lower alkoxyl group having 1 to 5 carbon atoms; and n2 is an integer of 1 or more; exposing a portion of said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; and developing said resist film by the use of a developer, resulting in a phase shifter.

Claim 15

A method for preparing a photomask, comprising the steps of: applying a light non-transmissive pattern on a surface of a substrate; applying a composition over the surface of said substrate with said light non-transmissive pattern to form a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR7## wherein R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 7 , R 8 , R 9 , and R 10 is a lower alkoxyl group having 1 to 5 carbon atoms; and n2 is an integer of 1 or more; exposing a portion of said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; and developing said resist film by the use of a developer, resulting in a phase shifter.

Claim 17

A method for preparing a photomask, comprising the steps of: applying a light non-transmissive pattern on a surface of a substrate; applying a composition over the surface of said substrate with said light non-transmissive pattern to form a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR8## wherein R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms; or a trialkylsilyl group; at least one group selected from the group consisting of R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 is a lower alkoxyl group having 1 to 5 carbon atoms; and n3 and m are independently integers of 1 or more; exposing a portion of said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; and developing said resist film by the use of a developer, resulting in a phase shifter.

Claim 18

A method for preparing a photomask, comprising the steps of: applying a light non-transmissive pattern on a surface of a substrate; applying a composition over the surface of said substrate with said light non-transmissive pattern to form a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR8## wherein R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms; or a trialkylsilyl group; at least one group selected from the group consisting of R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 is a lower alkoxyl group having 1 to 5 carbon atoms; and n3 and m are independently integers of 1 or more; exposing a portion of said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; and developing said resist film by the use of a developer, resulting in a phase shifter.

Claim 20

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bonding pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and having at least one end group or a side chain group, and a sensitizing agent, each of said end group and said side chain group is a functional group which causes condensation polymerization upon exposure to acid; exposing said resist film to light or radiation, thereby causing said sensitizing agent to produce an acid which causes condensation polymerization at said end group or said side chain group of said polymer; developing said resist film by the use of a developer; and connecting the individual bonding pads to wires.

Claim 21

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bonding pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and having at least one end group or a side chain group, and a sensitizing agent, each of said end group and said side chain group is a functional group which causes condensation polymerization upon exposure to acid; exposing said resist film to light or radiation, thereby causing said sensitizing agent to produce an acid which causes condensation polymerization at said end group or said side chain group of said polymer; developing said resist film by the use of a developer; and connecting the individual bonding pads to wires.

Claim 22

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bondings pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and having at least one end group or a side chain group, a sensitizing agent, and a dye having high solubility in a polar solvent, each of said end group and said side chain group is a functional group which causes condensation polymerization upon exposure to acid; exposing said resist film to light or radiation, thereby causing said sensitizing agent to produce an acid which causes condensation polymerization at said end group or said side chain group of said polymer; developing said resist film by the use of a developer; and connecting the individual bonding pads to wires.

Claim 23

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bondings pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and having at least one end group or a side chain group, a sensitizing agent, and a dye having high solubility in a polar solvent, each of said end group and said side chain group is a functional group which causes condensation polymerization upon exposure to acid; exposing said resist film to light or radiation, thereby causing said sensitizing agent to produce an acid which causes condensation polymerization at said end group or said side chain group of said polymer; developing said resist film by the use of a developer; and connecting the individual bonding pads to wires.

Claim 24

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bonding pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and a sensitizing agent, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR9## wherein R 1 , R 2 , R 3 , R 4 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 3 and R 4 is a lower alkoxyl group having 1 to 5 carbon atoms; and n1 is an integer of 1 or more; exposing said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; developing said resist film by the use a developer; and connecting the individual bonding pads to wires.

Claim 25

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bonding pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and a sensitizing agent, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR9## wherein R 1 , R 2 , R 3 , R 4 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 3 and R 4 is a lower alkoxyl group having 1 to 5 carbon atoms; and n1 is an integer of 1 or more; exposing said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; developing said resist film by the use a developer; and connecting the individual bonding pads to wires.

Claim 26

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bonding pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and a sensitizing agent, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR10## wherein R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 7 , R 8 , R 9 , and R 10 is a lower alkoxyl group having 1 to 5 carbon atoms; and n2 is an integer of 1 or more; exposing said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; developing said resist film by the use a developer; and connecting the individual bonding pads to wires.

Claim 27

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bonding pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and a sensitizing agent, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR10## wherein R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 7 , R 8 , R 9 , and R 10 is a lower alkoxyl group having 1 to 5 carbon atoms; and n2 is an integer of 1 or more; exposing said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; developing said resist film by the use a developer; and connecting the individual bonding pads to wires.

Claim 28

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bonding pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and a sensitizing agent, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR11## wherein R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 is a lower alkoxyl group having 1 to 5 carbon atoms; and n3 and m are independently integers of 1 or more; exposing said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; developing said resist film by the use of a developer; and connecting the individual bonding pads to wires.

Claim 29

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a surface of a substrate; forming a plurality of bonding pads on part of the substrate; forming a protective film to cover the surface of the substrate; subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bonding pads; applying a composition to the protective film including the bonding pads, resulting in a resist film, wherein said composition has sensitivity to light or radiation, and consists essentially of a polymer having a siloxane-bond structure and a sensitizing agent, said polymer having a structure selected from the group of structures represented by the following general formula: ##STR11## wherein R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 are independently a hydrogen atom, a hydroxyl group, a lower alkyl group having 1 to 5 carbon atoms, a lower alkoxyl group having 1 to 5 carbon atoms, or a trialkylsilyl group; at least one group selected from the group consisting of R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 is a lower alkoxyl group having 1 to 5 carbon atoms; and n3 and m are independently integers of 1 or more; exposing said resist film to light or radiation, thereby causing said polymer to undergo a polymerization reaction; developing said resist film by the use of a developer; and connecting the individual bonding pads to wires.