Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
81 words
In an integrated circuit ("IC") chip, a circuit structure comprising: a capacitor having a first plate and a second plate; a first electrical contact at least partially disposed beneath and electrically contacting said first plate of said capacitor; and a second electrical contact at least partially disposed beneath and electrically contacting said second plate of said capacitor, wherein said first electrical contact and said second electrical contact facilitate electrical access to said first plate and said second plate of said capacitor.
Claim 2
Dependent Claim
81 words
In an integrated circuit ("IC") chip, a circuit structure comprising: a capacitor having a first plate and a second plate; a first electrical contact at least partially disposed beneath and electrically contacting said first plate of said capacitor; and a second electrical contact at least partially disposed beneath and electrically contacting said second plate of said capacitor, wherein said first electrical contact and said second electrical contact facilitate electrical access to said first plate and said second plate of said capacitor.
Claim 3
Dependent Claim
13 words
The circuit structure of claim 1, wherein said capacitor comprises a chimney capacitor.
Claim 4
Dependent Claim
83 words
The circuit structure of claim 2, wherein said first plate comprises multiple portions, said first plate comprising an outer circumferential portion of said multiple portions and said second plate comprises an inner circumferential portion of said chimney capacitor such that said first electrical contact is at least partially disposed beneath and electrically contacts said outer circumferential portion of said first plate and said second electrical contact is at least partially disposed beneath and electrically contacts said inner circumferential portion of said chimney capacitor.
Claim 5
Dependent Claim
19 words
The circuit structure of claim 3, wherein said first electrical contact comprises part of a general purpose conductive layer.
Claim 6
Dependent Claim
30 words
The circuit structure of claim 4, wherein the outer circumferential portion of said first plate of said chimney capacitor resides above and does not extend laterally beyond said conductive layer.
Claim 7
Dependent Claim
31 words
The circuit structure of claim 5, wherein the conductive layer has a circular opening therein and wherein said chimney capacitor is disposed partially within the circular opening of the conductive layer.
Claim 8
Dependent Claim
30 words
The circuit structure of claim 6, wherein portions of the chimney capacitor within the outer circumferential portion of the first plate extend into the circular opening of the conductive layer.
Claim 9
Dependent Claim
54 words
The circuit structure of claim 4, wherein said circuit structure comprises a memory cell, said circuit structure further comprising a bitline that is electrically connected to said chimney capacitor through a transistor, said bitline having a portion disposed beneath said conductive layer in a region beneath said outer circumferential portion of said chimney capacitor.
Claim 10
Dependent Claim
30 words
The circuit structure of claim 8, further comprising a wordline that is electrically connected to the chimney capacitor through said transistor, said wordline having a portion disposed beneath said bitline.
Claim 11
Dependent Claim
22 words
The circuit structure of claim 9, wherein said wordline passes beneath said chimney capacitor for functioning in conjunction with multiple memory cells.
Claim 12
Dependent Claim
92 words
The circuit structure of claim 4, wherein said first plate further comprises a secondary circumferential portion of said chimney capacitor disposed between said outer circumferential portion of said first plate of said chimney capacitor and said inner circumferential portion of said chimney capacitor, a portion of said secondary circumferential portion being separated from said outer circumferential portion by a dielectric layer, said dielectric layer being disposed between said conductive layer and said secondary circumferential portion such that said conductive layer is physically separated from said secondary circumferential portion of said chimney capacitor.