US5531020A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making subsurface electronic circuits
Assignee: PARLEX USA Inc
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Filing: 1993-08-27
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Granted: 1996-07-02
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Expires: 2013-08-27
Abstract
Abstract A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith is disclosed. First, three dimensional, essentially square channels interspersed with lands are formed within a dielectric material on a substrate. The channels are then filled in one pass with a curable polymeric material containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components are place to engage the conductive material. The curable material is then cured after placing the electronic component(s).
Inventors
- 👤 David Durand
- 👤 Roger A. Iannetta, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:03
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; C; C09; C09J; C09J163/00; H01R; H01R4/00; H01R4/04; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1258; H05K3/30; H05K3/32; H05K3/321; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; C08; C08L; C08L2666/00; C08L2666/54; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K1/18; H05K1/181; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0125; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0218; H05K2201/023; H05K2201/0242; H05K2201/0245; H05K2201/0263; H05K2201/0272; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/05; H05K2203/0562; H05K2203/0568; H05K2203/11; H05K2203/1105; H05K2203/14; H05K2203/1453; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/107; H05K3/22; H05K3/28; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/20; H10W72/251; H10W72/252; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49155
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
119 words
A method of making electronic circuits in a rigid dielectric substrate comprising steps of: (a) forming a channel within a dielectric substrate; (b) screening a curable conductive material into the channel to form an uncured circuit trace; (c) placing circuit components in engagement with the uncured circuit trace; and (d) curing the curable conductive material after placing the circuit components, thereby creating a circuit trace which electrically connects the circuit components; wherein the channel forming step includes steps of: i) applying a layer of photoimagable material on to the substrate, ii) exposing the photoimagable material with an image corresponding to the circuit trace, and iii) developing the photoimagable material, thereby leaving a channel in the layer of photoimagable material.
Claim 2
Independent Claim
119 words
A method of making electronic circuits in a rigid dielectric substrate comprising steps of: (a) forming a channel within a dielectric substrate; (b) screening a curable conductive material into the channel to form an uncured circuit trace; (c) placing circuit components in engagement with the uncured circuit trace; and (d) curing the curable conductive material after placing the circuit components, thereby creating a circuit trace which electrically connects the circuit components; wherein the channel forming step includes steps of: i) applying a layer of photoimagable material on to the substrate, ii) exposing the photoimagable material with an image corresponding to the circuit trace, and iii) developing the photoimagable material, thereby leaving a channel in the layer of photoimagable material.
Claim 3
Independent Claim
119 words
A method of making electronic circuits in a rigid dielectric substrate comprising steps of: (a) forming a channel within a dielectric substrate; (b) screening a curable conductive material into the channel to form an uncured circuit trace; (c) placing circuit components in engagement with the uncured circuit trace; and (d) curing the curable conductive material after placing the circuit components, thereby creating a circuit trace which electrically connects the circuit components; wherein the channel forming step includes steps of: i) forming a first portion of the circuit trace in a first layer of the substrate; ii) forming a channel in a second layer of the substrate, the channel overlapping a region of the first portion of the circuit trace.
Claim 4
Independent Claim
119 words
A method of making electronic circuits in a rigid dielectric substrate comprising steps of: (a) forming a channel within a dielectric substrate; (b) screening a curable conductive material into the channel to form an uncured circuit trace; (c) placing circuit components in engagement with the uncured circuit trace; and (d) curing the curable conductive material after placing the circuit components, thereby creating a circuit trace which electrically connects the circuit components; wherein the channel forming step includes steps of: i) forming a first portion of the circuit trace in a first layer of the substrate; ii) forming a channel in a second layer of the substrate, the channel overlapping a region of the first portion of the circuit trace.
Claim 5
Independent Claim
129 words
A method of making electronic circuits in a rigid dielectric substrate comprising steps of: (a) forming a channel within a dielectric substrate; (b) filling the channel with a curable conductive material to form an uncured circuit trace; (c) placing circuit components in engagement with the uncured circuit trace; and (d) curing the curable conductive material after placing the circuit components, thereby creating a circuit trace which electrically connects the circuit components; wherein the channel forming step includes a step of forming a removable layer on the substrate around the periphery of the channel, and the channel filling step comprises steps of: i) spreading the curable conductive material across the removable layer and into the channel, and ii) removing the removable layer while leaving curable conductive material in the channel.
Claim 6
Independent Claim
129 words
A method of making electronic circuits in a rigid dielectric substrate comprising steps of: (a) forming a channel within a dielectric substrate; (b) filling the channel with a curable conductive material to form an uncured circuit trace; (c) placing circuit components in engagement with the uncured circuit trace; and (d) curing the curable conductive material after placing the circuit components, thereby creating a circuit trace which electrically connects the circuit components; wherein the channel forming step includes a step of forming a removable layer on the substrate around the periphery of the channel, and the channel filling step comprises steps of: i) spreading the curable conductive material across the removable layer and into the channel, and ii) removing the removable layer while leaving curable conductive material in the channel.
Claim 7
Independent Claim
133 words
A method of making electronic circuits in a rigid dielectric substrate comprising steps of: (a) forming a channel within a dielectric substrate; (b) screening a curable conductive material into the channel to form an uncured circuit trace; (c) placing circuit components in engagement with the uncured circuit trace; and (d) curing the curable conductive material after placing the circuit components, thereby creating a circuit trace which electrically connects the circuit components; wherein the channel forming step includes a step of forming a removable layer on the substrate around the periphery of the channel, and the channel filling step comprises steps of: i) spreading the curable conductive material across the removable layer and into the channel, and ii) washing away the removable layer with a solvent while leaving curable conductive material in the channel.
Claim 8
Independent Claim
133 words
A method of making electronic circuits in a rigid dielectric substrate comprising steps of: (a) forming a channel within a dielectric substrate; (b) screening a curable conductive material into the channel to form an uncured circuit trace; (c) placing circuit components in engagement with the uncured circuit trace; and (d) curing the curable conductive material after placing the circuit components, thereby creating a circuit trace which electrically connects the circuit components; wherein the channel forming step includes a step of forming a removable layer on the substrate around the periphery of the channel, and the channel filling step comprises steps of: i) spreading the curable conductive material across the removable layer and into the channel, and ii) washing away the removable layer with a solvent while leaving curable conductive material in the channel.
Claim 9
Dependent Claim
21 words
The method of claim 4 wherein the washing step includes a step of spraying solvent onto the substrate with a nozzle.
Claim 10
Independent Claim
110 words
A method of making electronic circuits in rigid dielectric substrates comprising steps of: (a) applying a layer of photoimagable material on to a substrate, (b) exposing the photoimagable material with an image corresponding to a circuit trace, (c) developing the photoimagable material, thereby leaving a channel in the layer of photoimagable material; (d) screening curable conductive material into the channel through a screen having a pattern matching the channel to form an uncured circuit trace; (e) placing circuit components in engagement with the uncured circuit trace; and (f) curing the curable conductive material after placing the circuit components, thereby creating a cured circuit trace which electrically connects the circuit components.
Claim 11
Independent Claim
110 words
A method of making electronic circuits in rigid dielectric substrates comprising steps of: (a) applying a layer of photoimagable material on to a substrate, (b) exposing the photoimagable material with an image corresponding to a circuit trace, (c) developing the photoimagable material, thereby leaving a channel in the layer of photoimagable material; (d) screening curable conductive material into the channel through a screen having a pattern matching the channel to form an uncured circuit trace; (e) placing circuit components in engagement with the uncured circuit trace; and (f) curing the curable conductive material after placing the circuit components, thereby creating a cured circuit trace which electrically connects the circuit components.
Claim 12
Dependent Claim
47 words
The method of claim 4, wherein steps (a) to (f) are performed after first forming a first conductive trace in the substrate, and steps (a) to (f) form a second conductive trace above and in electrical contact with the first conductive trace, thereby forming a multi-layer circuit.
Claim 13
Dependent Claim
22 words
The method of claim 6 wherein the curing step includes a step of curing at a temperature below about 180 degrees C.
Claim 14
Dependent Claim
27 words
The method of claim 6 wherein the curing step includes a step of curing at a temperature between about 130 degrees C. and about 180 degrees C.
Claim 15
Dependent Claim
19 words
The method of claim 6 wherein the component placement step includes a step of placing a surface mount device.
Claim 16
Dependent Claim
18 words
The method of claim 6 wherein the component placement step includes a step of placing a flip chip.
References Cited (Backward Citations)
US3152938A
Cited
DE2231614A1
Cited
GB1457805A
Cited
US4402135A
Cited
US4756929A
Cited
US4528259A
Cited
US4645733A
Cited
US4775611A
Cited
US4581098A
Cited
EP0195611A2
Cited
US5048179A
Cited
EP0250006A1
Cited
US4694572A
Cited
US4912020A
Cited
US4998500A
Cited
US4882839A
Cited
US5024372A
Cited
US4985293A
Cited
US4982892A
Cited
US5180523A
Cited
US5183593A
Cited
US5034091A
Cited
US5044306A
Cited
EP0542149A2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-02 | 2000-01-01 | 2000-07-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-02 | 2004-01-01 | 2004-07-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-02 | 2008-01-01 | 2008-07-02 | $7700.00 | Window Closed / Lapsed |