US4985293A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Polymer blend for molded circuit boards and other selectively conductive molded devices
Assignee: EIDP Inc
•
Filing: 1989-08-14
•
Granted: 1991-01-15
•
Expires: 2009-08-14
Abstract
Abstract The use of an amorphous polymer blended with a semicrystalline polymer to render the latter susceptible to adhesion promotion for good peel strength after electroless copper plating, while maintaining the advantages of the semicrystalline polymer including high temperature characteristics, ease of molding, and low cost is disclosed. The invention provides an injection-moldable material with the advantages of a semicrystalline thermoplastic but that can be made to accept electroless metal deposits for fabrication of electronic devices. The material is a blend including a high-temperature semicrystalline thermoplasstic polymer with an amorphous polymer that is easily etched and that is preferably compatible with the semicrystalline polymer. A preferred exemplary blend comprises poly(cyclohexylenedimethylene terephthalate) with polyethersulfone and/or polyarylate.
Inventors
- 👤 Gerald T. Keep
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:24
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; C; C08; C08J; C08J7/00; C08J7/02; C08J7/12; C08L; C08L101/00; C08L101/02; C08L101/10; C08L65/00; C08L67/00; C08L67/02; C08L67/03; C08L71/00; C08L81/00; C08J2367/00; C08J2367/02; C08J2381/00; C08J2381/06; C08K; C08K7/00; C08K7/02; C08K7/04; C08K7/14; C08L81/06; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
32 words
A selectively conductive molded article, comprising a blend containing about 1 to about 99 wt% of an amorphous thermoplastic polymer and about 99 to about 1 wt% of a semicrystalline thermoplastic polymer.
Claim 2
Dependent Claim
32 words
A selectively conductive molded article, comprising a blend containing about 1 to about 99 wt% of an amorphous thermoplastic polymer and about 99 to about 1 wt% of a semicrystalline thermoplastic polymer.
Claim 3
Dependent Claim
58 words
The selectively conductive molded article of claim 1, wherein: said amorphous thermoplastic polymer is at least one member selected from the group consisting of polyethersulfone, polysulfone, polyarylsulfone, polyphenylsulfone, polyetherimide, polyimide, and polyarylate; and said semicrystalline thermoplastic polymer is at least one member selected from the group consisting of polyesters, polypropylenes, crystalline polyamides, and poly(phenylene sulfides), poly(ether ether ketones).
Claim 4
Dependent Claim
21 words
The selectively conductive molded article of claim 1, wherein the semicrystalline thermoplastic polymer comprises poly(cyclohexylene dimethylene terephthalate), poly(ethylene terephthalate) or poly(butyleneterephthalate).
Claim 5
Dependent Claim
16 words
The selectively conductive molded article of claim 1, wherein the semicrystalline polymer is poly(cyclohexylene dimethylene terephthalate).
Claim 6
Dependent Claim
29 words
The selectively conductive molded article of claim 1, wherein said amorphous thermoplastic component is polyethersulfone present in an amount of from 5 to 85% by weight of the blend.
Claim 7
Dependent Claim
28 words
The selectively conductive molded article of claim 1, wherein said amorphous thermoplastic component is polyarylate present in an amount of from 1 to 25 wt% of the blend.
Claim 8
Independent Claim
95 words
A method of producing a selectively conductive molded article comprising: (i) molding together, under conditions that minimize crystallinity a blend of 1 to 99 wt% of an amorphous thermoplastic polymer and 99 to 1 wt% of a semicrystalline thermoplastic polymer to obtain a molded article; (ii) swelling the surface of said molded article with a solvent under conditions which minimize solvent crystallization to render the polymer susceptible to etching; (iii) etching said molded article to obtain an etched product; and (iv) annealing said etched product to obtain a desired crystallinity and HDT in said product.
Claim 9
Independent Claim
95 words
A method of producing a selectively conductive molded article comprising: (i) molding together, under conditions that minimize crystallinity a blend of 1 to 99 wt% of an amorphous thermoplastic polymer and 99 to 1 wt% of a semicrystalline thermoplastic polymer to obtain a molded article; (ii) swelling the surface of said molded article with a solvent under conditions which minimize solvent crystallization to render the polymer susceptible to etching; (iii) etching said molded article to obtain an etched product; and (iv) annealing said etched product to obtain a desired crystallinity and HDT in said product.
Claim 10
Dependent Claim
25 words
The method of claim 7, comprising using, as said solvent, dimthylformamide, methylethylketone, 1,3-dichloroisopropanol, ethylacetate, butylacetate, toluene, γ-butyro lactone, orthodichlorobenzene, cyclohexanone, or a mixture of these.
Claim 11
Dependent Claim
53 words
The method of claim 8, wherein said amorphous thermoplastic component is at least one member selected from the group consisting of polyether sulfone, polysulfone, polyetherimide, polyether etherketone, and polyarylate, and wherein said semicrystalline thermoplastic component is at least one member selected from the group consisting of polyesters, polypropylenes, crystalline polyamides, and poly(phenylene sulfides).
Claim 12
Dependent Claim
19 words
The method of claim 8, wherein the semicrystalline thermoplastic component comprises poly(cyclohexane dimethylene terephthalate), poly(ethylene terephthalate) or poly(butylene terephthalate).
Claim 13
Dependent Claim
27 words
The method of claim 8, wherein said amorphous thermoplastic is a copolymer of bisphenol A with either isophthalic acid or a mixture isophthalic acid and terephthalic acid.
Claim 14
Dependent Claim
26 words
The method of claim 8, wherein said amorphous thermoplastic component is polyethersulfone present in an amount of from 5 to 85% by weight of the blend.
Claim 15
Dependent Claim
25 words
The method of claim 8, wherein said amorphous thermoplastic component is polyarylate present in an amount of from 1 to 25wt % of the blend.
Claim 16
Dependent Claim
13 words
The article of claim 1 in the form of a circuit board substrate.
Claim 17
Dependent Claim
13 words
The article of claim 2 in the form of a circuit board substrate.
Claim 18
Dependent Claim
13 words
The article of claim 3 in the form of a circuit board substrate.
Claim 19
Dependent Claim
49 words
A composition of matter having a heat deflection temperature of at least about 230° C. and which is especially suitable for producing selectively conductive molded articles comprising about 15-95% of the polymeric matrix by weight of poly(cyclohexylene dimethylene terephthalate) and about 85-5% of the polymeric matrix by weight polyethersulfone.
Claim 20
Dependent Claim
49 words
A composition of matter having a heat deflection temperature of at least about 230° C. and which is especially suitable for producing selectively conductive molded articles comprising about 15-95% of the polymeric matrix by weight of poly(cyclohexylene dimethylene terephthalate) and about 85-5% of the polymeric matrix by weight polyethersulfone.
Claim 21
Dependent Claim
48 words
A composition of matter having a heat deflection temperature of at least about 230° C. and which is especially suitable for producing selectively conductive molded articles comprising about 75-99% of the polymeric matrix by weight poly(cyclohexylene dimethylene terephthalate) and about 25-1% of the polymeric matrix by weight polyarylate.
Claim 22
Dependent Claim
48 words
A composition of matter having a heat deflection temperature of at least about 230° C. and which is especially suitable for producing selectively conductive molded articles comprising about 75-99% of the polymeric matrix by weight poly(cyclohexylene dimethylene terephthalate) and about 25-1% of the polymeric matrix by weight polyarylate.
References Cited (Backward Citations)
US3971870A
Cited
JPS5484474A
Cited
US4520067A
Cited
US4554182A
Cited
US4457951A
Cited
JPS59196380A
Cited
US4592929A
Cited
US4610895A
Cited
US4853286A
Cited
US4594311A
Cited
US4601783A
Cited
US4756968A
Cited
EP0252739B1
Cited
JPH01104682A
Cited
JPH03108090A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-14 | 1994-07-16 | 1995-01-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-14 | 1998-07-16 | 1999-01-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-14 | 2002-07-16 | 2003-01-15 | $7700.00 | Window Closed / Lapsed |