EP0542149A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Process for producing solder areas on printed circuit board and solder paste foil for performing such process
Assignee: DuPont de Nemours International SARL
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Filing: 1992-11-06
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Granted: —
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Expires: 2012-11-06
Abstract
Abstract A solder paste film (4) is provided in order to produce solder areas (8) upon electrically conductive regions (2) of a printed-circuit board (1). The film is applied onto a printed-circuit board over the entire area and is subsequently structured. Once the solder paste (6) has been applied, the structured solder paste film (5) is removed. The solder paste film is advantageously structured in an identical manner to the solder resist film (3) located underneath. The solder paste (6) is expediently fused to form solder deposits (7), before removal of the structured solder paste film (5). <IMAGE>
Inventors
- 👤 Werner Dipl.-Phys. Maiwald
- 👤 Michael Weinhold
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 01:41
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K3/3465; H05K3/3485; H05K2203/00; H05K2203/01; H05K2203/0191; H05K2203/02; H05K2203/0278; H05K2203/04; H05K2203/043; H05K2203/05; H05K2203/0562; H05K2203/0568; H05K2203/0577
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