Patent US5530295A successfully refreshed from Google Patents.
US5530295A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Drop-in heat sink
Assignee: Intel Corp
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Filing: 1995-05-26
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Granted: 1996-06-25
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Expires: 2015-05-26
Abstract
Abstract A heat sink incorporated into an electronic package. The package contains an integrated circuit enclosed by a dielectric housing. Coupled to the circuit is a lead frame which has a plurality of leads that extend from the outer edges of the housing. The heat sink has a bottom surface pressed against the lead frame and an opposite top surface that is exposed to the ambient. The heat sink also has a pair of oblique steps which engage the housing and insure that the sink does not become detached from the package.
Inventors
- 👤 Behrooz Mehr
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:17
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49169; Y10T29/49171; Y10T29/4935
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
112 words
An electronic package, comprising: a housing; an integrated circuit within said housing; a lead frame coupled to said integrated circuit; a heat sink embedded within said housing, said heat sink having a top surface, a first outwardly tapered surface that extends to a first edge, a first step surface that extends inward from said first edge essentially parallel with said top surface, a second outwardly tapered surface that extends from said first step surface to a second edge, a second step surface that extends inward from said second edge essentially parallel with said top surface, and a third outwardly tapered surface that extends from said second step surface to a third edge.
Claim 2
Dependent Claim
112 words
An electronic package, comprising: a housing; an integrated circuit within said housing; a lead frame coupled to said integrated circuit; a heat sink embedded within said housing, said heat sink having a top surface, a first outwardly tapered surface that extends to a first edge, a first step surface that extends inward from said first edge essentially parallel with said top surface, a second outwardly tapered surface that extends from said first step surface to a second edge, a second step surface that extends inward from said second edge essentially parallel with said top surface, and a third outwardly tapered surface that extends from said second step surface to a third edge.
Claim 3
Dependent Claim
18 words
The heat sink as recited in claim 1, wherein said heat sink is attached to said lead frame.
Claim 4
Dependent Claim
19 words
The package as recited in claim 1, further comprising a heat fin that is attached to said heat sink.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-25 | 1999-12-25 | 2000-06-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-25 | 2003-12-25 | 2004-06-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-25 | 2007-12-25 | 2008-06-25 | $7700.00 | Window Closed / Lapsed |