US5028984A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Epoxy composition and use thereof
Assignee: International Business Machines Corp
•
Filing: 1988-11-04
•
Granted: 1991-07-02
•
Expires: 2008-11-04
Abstract
Abstract A curable composition containing an epoxide component and zinc oxide and use thereof.
Inventors
- 👤 Joseph G. Ameen
- 👤 Joseph Funari
- 👤 Bahgat G. Sammakia
- 👤 David W. Sissenstein, Jr.
- 👤 Samuel L. Smey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 16:53
CPC Classifications
C; C08; C08L; C08L63/00; C08K; C08K3/00; C08K3/18; C08K3/20; C08K3/22; H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H10W76/00; H10W76/60; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W76/63; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
115 words
A curable composition containing: a) an epoxide component that includes an epoxy polymer and hardening component; and b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 35% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol, and about 0.85% to about 1% by weight of a tertiary amine.
Claim 2
Dependent Claim
115 words
A curable composition containing: a) an epoxide component that includes an epoxy polymer and hardening component; and b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 35% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol, and about 0.85% to about 1% by weight of a tertiary amine.
Claim 3
Dependent Claim
16 words
The composition of claim 1 wherein said epoxy polymer is a diglycidyl ether of bisphenol A-epichlorohydrin.
Claim 4
Dependent Claim
16 words
The composition of claim 1 wherein said anhydride is nadic methyl anhydride or a phthalic anhydride.
Claim 5
Dependent Claim
14 words
The composition of claim 1 wherein said anhydride is hexahydrophthalic anhydride or tetrahydrophthalic anhydride.
Claim 6
Dependent Claim
152 words
An integrated circuit module containing a flexible substrate and having attached to one major surface thereof at least one integrated circuit chip wherein said at least one integrated circuit chip is connected to a heat sink by a cured composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.
Claim 7
Dependent Claim
152 words
An integrated circuit module containing a flexible substrate and having attached to one major surface thereof at least one integrated circuit chip wherein said at least one integrated circuit chip is connected to a heat sink by a cured composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.
Claim 8
Dependent Claim
11 words
The module of claim 5 wherein said substrate is a polyimide.
Claim 9
Dependent Claim
31 words
The module of claim 5 wherein said heat sink is selected from the group consisting of aluminum, anodized aluminum, nickel plated copper, bright tin plated copper, benzotriazole treated copper, and copper/Invar/copper.
Claim 10
Dependent Claim
11 words
The module of claim 5 wherein said heat sink is aluminum.
Claim 11
Dependent Claim
22 words
The module of claim 5 wherein said epoxy polymer is a diglycidyl ether of bisphenol A-epichlorohydrin and said hardener in an anhydride.
Claim 12
Dependent Claim
156 words
An integrated circuit module which comprises an integrated circuit carrier having a/an integrated circuit chip(s) bonded thereto, a cap covering said integrated circuit chip(s) for protection against exposure to the surrounding atmosphere, and wherein said carrier is bonded to said cap by a curved composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component contains about 45% to about 65% by weight of epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.
Claim 13
Dependent Claim
156 words
An integrated circuit module which comprises an integrated circuit carrier having a/an integrated circuit chip(s) bonded thereto, a cap covering said integrated circuit chip(s) for protection against exposure to the surrounding atmosphere, and wherein said carrier is bonded to said cap by a curved composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component contains about 45% to about 65% by weight of epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.
Claim 14
Dependent Claim
12 words
The module of claim 10 wherein said carrier is a ceramic substrate.
Claim 15
Dependent Claim
10 words
The module of claim 10 wherein said cap is aluminum.
Claim 16
Dependent Claim
22 words
The module of claim 10 wherein said epoxy polymer is a diglycidyl ether of bisphenol A-epichlorohydrin and said hardener in an anhydride.
Claim 17
Dependent Claim
17 words
The module of claim 5 wherein said anhydride anhydride is nadic methyl anhydride or a phthalic anhydride.
Claim 18
Dependent Claim
14 words
The module of claim 5 wherein said anhydride is hexahydrophthalic anhydride or tetrahydrophthalic anhydride.
Claim 19
Dependent Claim
16 words
The module of claim 10 wherein said anhydride is nadic methyl anhydride or a phthalic anhydride.
Claim 20
Dependent Claim
14 words
The module of claim 10 wherein said anhydride is hexahydrophthalic anhydride or tetrahydrophthalic anhydride.
Claim 21
Dependent Claim
32 words
The composition of claim 1 wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns.
Claim 22
Dependent Claim
32 words
The module of claim 5 wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns.
Claim 23
Dependent Claim
32 words
The module of claim 10 wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns.
Claim 24
Dependent Claim
135 words
A curable composition containing: a) an epoxide component that includes an epoxy polymer and hardening component; and b) zinc oxide wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns; wherein the relative amount of said zinc oxide to said epoxide component is about 1:4 to about 2:1; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 35% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol, and about 0.85% to about 1% by weight of a tertiary amine.
Claim 25
Dependent Claim
135 words
A curable composition containing: a) an epoxide component that includes an epoxy polymer and hardening component; and b) zinc oxide wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns; wherein the relative amount of said zinc oxide to said epoxide component is about 1:4 to about 2:1; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 35% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol, and about 0.85% to about 1% by weight of a tertiary amine.
Claim 26
Dependent Claim
172 words
An integrated circuit module containing a flexible substrate and having attached to one major surface thereof at least one integrated circuit chip wherein said at least one integrated circuit chip is connected to a heat sink by a cured composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and b) zinc oxide wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns; wherein the relative amount of said zinc oxide to said epoxide component is about 1:4 to about 2:1; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.
Claim 27
Dependent Claim
172 words
An integrated circuit module containing a flexible substrate and having attached to one major surface thereof at least one integrated circuit chip wherein said at least one integrated circuit chip is connected to a heat sink by a cured composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and b) zinc oxide wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns; wherein the relative amount of said zinc oxide to said epoxide component is about 1:4 to about 2:1; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.
Claim 28
Dependent Claim
177 words
An integrated circuit module which comprises an integrated circuit carrier having a/an integrated circuit chip(s) bonded thereto, a cap covering said integrated circuit chip(s) for protection against exposure to the surrounding atmosphere, and wherein said carrier is bonded to said cap by a cured composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and b) zinc oxide wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns; wherein the relative amount of said zinc oxide to said epoxide component is about 1:4 to about 2:1; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.
Claim 29
Dependent Claim
177 words
An integrated circuit module which comprises an integrated circuit carrier having a/an integrated circuit chip(s) bonded thereto, a cap covering said integrated circuit chip(s) for protection against exposure to the surrounding atmosphere, and wherein said carrier is bonded to said cap by a cured composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and b) zinc oxide wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns; wherein the relative amount of said zinc oxide to said epoxide component is about 1:4 to about 2:1; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-01 | 1994-12-31 | 1995-07-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-01 | 1998-12-31 | 1999-07-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-01 | 2002-12-31 | 2003-07-02 | $7700.00 | Window Closed / Lapsed |