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US4581158A Expired / Lapsed US ⏱️ 0.0 years remaining

Conductive thermosetting compositions and process for using same

Assignee: WR Grace and Co Conn
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Filing: 1984-09-26
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Granted: 1986-04-08
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Expires: 2004-09-26
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Abstract

Abstract This invention is directed to a process and a novel composition for forming a conductive thermoset material which comprises admixing (a) particles of a polymeric material swellable at its plasticization temperature, (b) at least one liquid reactive plasticizer for (a) (c) optionally and preferably a curing agent for the reactive plasticizer, and (d) heat or electrically conductive particles, and thereafter heating the admixture for a time sufficient to flux and cure same to obtain a conductive thermoset material. Upon heating, above the plasticization temperature, the liquid reactive plasticizer plasticizes the polymer particles. This results in the swelling of the polymer particle, forcing the conductive filler to pack tightly and orderly, thereby increasing the conductivity of the plasticized conductive thermoset after curing.

Inventors

  • 👤 Shiow C. Lin

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 10:46
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0073; H05K9/0081; H05K9/0083; C; C08; C08G; C08G59/00; C08G59/18; C08K; C08K3/00; C08K3/02; C08K3/08

Claims Analysis

Total Claims: 22
Claim 1
Independent Claim 75 words
A conductive, thermosettable, reactive plastisol dispersion composition comprising an admixture of (a) particles of a non-crosslinked, polymeric material swellable at its plasticization temperature, (b) at least one liquid, reactive plasticizer for (a), and (c) particles of a heat or electrically conductive material, the weight ratio of (a):(b) being 0.0001:99.9999 to 70:30 with (c) being present in an amount in the range 1 to 80% by weight of the total conductive, thermosetable, reactive plastisol dispersion composition.
Claim 2
Dependent Claim 75 words
A conductive, thermosettable, reactive plastisol dispersion composition comprising an admixture of (a) particles of a non-crosslinked, polymeric material swellable at its plasticization temperature, (b) at least one liquid, reactive plasticizer for (a), and (c) particles of a heat or electrically conductive material, the weight ratio of (a):(b) being 0.0001:99.9999 to 70:30 with (c) being present in an amount in the range 1 to 80% by weight of the total conductive, thermosetable, reactive plastisol dispersion composition.
Claim 3
Dependent Claim 14 words
The composition of claim 1 containing in addition a thermal curing agent for (b).
Claim 4
Dependent Claim 13 words
The composition of claim 1 wherein the polymeric material is an epoxy resin.
Claim 5
Dependent Claim 14 words
The composition of claim 1 wherein the polymeric material is an isobutene-maleic anhydride copolymer.
Claim 6
Dependent Claim 14 words
The composition of claim 1 wherein the polymeric material is a styrene-maleic anhydride copolymer.
Claim 7
Dependent Claim 13 words
The composition of claim 2 wherein the polymeric material is an epoxy resin.
Claim 8
Dependent Claim 14 words
The composition of claim 2 wherein the polymeric material is an isobutene-maleic anhydride copolymer.
Claim 9
Dependent Claim 14 words
The composition of claim 2 wherein the polymer material is a styrene-maleic anhydride copolymer.
Claim 10
Independent Claim 101 words
The method of making a conductive thermoset article comprising the steps of admixing (a) particles of a non-crosslinked, polymeric material swellable at its plasticization temperature, (b) at least one liquid reactive plasticizer for (a), and (c) particles of a heat or electrically conductive material to form a conductive reactive plastisol composition, the weight ratio of (a):(b) being 0.0001:99.9999 to 70:30 with (c) being present in an amount in the range 1 to 80% by weight of the conductive, reactive plastisol composition and, thereafter, heating the composition for a time sufficient to plasticize and cure same to obtain a conductive thermoset article.
Claim 11
Independent Claim 101 words
The method of making a conductive thermoset article comprising the steps of admixing (a) particles of a non-crosslinked, polymeric material swellable at its plasticization temperature, (b) at least one liquid reactive plasticizer for (a), and (c) particles of a heat or electrically conductive material to form a conductive reactive plastisol composition, the weight ratio of (a):(b) being 0.0001:99.9999 to 70:30 with (c) being present in an amount in the range 1 to 80% by weight of the conductive, reactive plastisol composition and, thereafter, heating the composition for a time sufficient to plasticize and cure same to obtain a conductive thermoset article.
Claim 12
Dependent Claim 17 words
The method according to claim 9 wherein the admixture also contains a thermal curing agent for (b).
Claim 13
Dependent Claim 14 words
A method according to claim 9 wherein the polymeric material is an epoxy resin
Claim 14
Dependent Claim 15 words
A method according to claim 9 wherein the polymeric material is an isobutene-maleic anhydride copolymer.
Claim 15
Dependent Claim 15 words
A method according to claim 9 wherein the polymeric material is a styrene-maleic anhydride copolymer.
Claim 16
Dependent Claim 13 words
The composition of claim 10 wherein the polymeric material is an epoxy resin.
Claim 17
Dependent Claim 14 words
The composition of claim 10 wherein the polymeric material is an isobutene-maleic anhydride copolymer.
Claim 18
Dependent Claim 14 words
The composition of claim 10 wherein the polymeric material is a styrene-maleic anhydride copolymer.
Claim 19
Dependent Claim 12 words
The composition of claim 1 as a conductive coating on a substrate.
Claim 20
Dependent Claim 12 words
The composition of claim 2 as a conductive coating on a substrate.
Claim 21
Dependent Claim 12 words
The composition of claim 1 as a conductive adhesive between two substrates.
Claim 22
Dependent Claim 12 words
The composition of claim 2 as a conductive adhesive between two substrates.

References Cited (Backward Citations)

US30274A Cited
US3412043A Cited
US3609104A Cited
US3746662A Cited
US3968056A Cited
USRE30274E Cited
US4410457A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-04-07 1989-10-07 1990-04-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-04-07 1993-10-07 1994-04-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-04-07 1997-10-07 1998-04-08 $7700.00 Window Closed / Lapsed

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