Abstract Woven hybrid glass cloths which may be utilized as chip carrier substrates and as inner layers in multi-layer laminate circuit boards which will be stable due to a desired co-efficient of thermal expansion may be prepared by weaving fiberglass with a second material which possesses a co-efficient of thermal expansion of less than 5.0×10 -6 inch/inch/°C. The mixture of fiberglass in this material may be used as a warp and a fill yarn. The thus woven cloth will possess a dimensional stability suitable for use in preparing multi-layer materials and for use in direct mounting ceramic chip carriers to this chip carrier substrate. Examples of materials which possess a co-efficient of thermal expansion of less than the desired number will include nylon filaments, ceramics, boron nitrite filaments, etc.
A hybrid glass cloth woven from yarn comprising a warp yarn of fiberglass and a fill yarn of a boron nitride.
Claim 2
Dependent Claim
21 words
A hybrid glass cloth woven from yarn comprising a warp yarn of fiberglass and a fill yarn of a boron nitride.
Claim 3
Dependent Claim
36 words
The hybrid glass cloth as set forth in claim 1 in which the warp yarn of said cloth is a mixture of fiberglass and a boron nitride and the fill yarn is a boron nitride filament.
Claim 4
Dependent Claim
30 words
The hybrid glass cloth as set forth in claim 1 in which the thickness of said woven cloth is in a range of from about 0.0015 to about 0.20 inch.
Claim 5
Dependent Claim
24 words
The hybrid glass cloth as set forth in claim 1 in which the yarn size of said fiberglass is greater than about 50 denier.