Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
64 words
A structure comprising: a semiconductor structure; a first layer formed on said semiconductor substrate and comprising a conductive nitride of a first metal; a second layer in contact with said first layer and comprising a conductive oxide of said first metal; a third layer in contact with said second layer and comprising a dielectric material; and an electrical connection formed on said third layer.
Claim 2
Dependent Claim
64 words
A structure comprising: a semiconductor structure; a first layer formed on said semiconductor substrate and comprising a conductive nitride of a first metal; a second layer in contact with said first layer and comprising a conductive oxide of said first metal; a third layer in contact with said second layer and comprising a dielectric material; and an electrical connection formed on said third layer.
Claim 3
Dependent Claim
21 words
The structure of claim 1, wherein said first metal is selected from the group consisting of ruthenium, tin, zinc and titanium.
Claim 4
Dependent Claim
16 words
The structure of claim 1, wherein said first layer is in contact with said semiconductor substrate.
Claim 5
Dependent Claim
58 words
The structure of claim 1, wherein said dielectric material is selected from the group consisting of barium strontium titanate, lead zirconate titanate, lead titanate, potassium niobate, potassium tantalate, lead niobate, lead magnesium niobate, magnesium niobate, bismuth titanate, tantalum pentoxide, niobium pentoxide, titanium dioxide, yttrium trioxide, strontium titanate, titanium trioxide, lanthanum-doped (Ba,Sr,Pb)(Ti,Zr)O 3 , and niobium-doped (Ba,Sr,Pb)(Ti,Zr)O 3 .
Claim 6
Dependent Claim
36 words
The structure of claim 1, wherein said conductive oxide is doped to form a doped metal oxide whereby the electrical conductivity of said doped metal oxide is greater than the electrical conductivity of said conductive oxide.
Claim 7
Dependent Claim
15 words
The structure of claim 5, wherein said doped metal oxide is indium doped tin oxide.
Claim 8
Dependent Claim
36 words
The structure of claim 1, wherein said conductive nitride is doped to form a doped metal nitride whereby the electrical conductivity of said doped metal nitride is greater than the electrical conductivity of said conductive nitride.
Claim 9
Dependent Claim
20 words
The structure of claim 7, wherein said doped metal nitride is indium doped tin nitride or aluminum doped zinc nitride.
Claim 10
Dependent Claim
47 words
The structure of claim 1, wherein said electrical connection comprises: a fourth layer in contact with said third layer and comprising a conductive oxide of a second metal; and a fifth layer in contact with said fourth layer and comprising a conductive nitride of said second metal.
Claim 11
Dependent Claim
17 words
The structure of claim 9, wherein said first metal and said second metal are the same metal.
Claim 12
Dependent Claim
25 words
The structure of claim 9, wherein said first metal and said second metal are selected from the group consisting of ruthenium, tin, zinc and titanium.
Claim 13
Dependent Claim
16 words
The structure of claim 9, wherein said first layer is in contact with said semiconductor substrate.
Claim 14
Dependent Claim
58 words
The structure of claim 9, wherein said dielectric material is selected from the group consisting of barium strontium titanate, lead zirconate titanate, lead titanate, potassium niobate, potassium tantalate, lead niobate, lead magnesium niobate, magnesium niobate, bismuth titanate, tantalum pentoxide, niobium pentoxide, titanium dioxide, yttrium trioxide, strontium titanate, titanium trioxide, lanthanum-doped (Ba,Sr,Pb)(Ti,Zr)O 3 , and niobium-doped (Ba,Sr,Pb)(Ti,Zr)O 3 .