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US5520992A Expired / Lapsed US ⏱️ 0.0 years remaining

Electrodes for high dielectric constant materials

Assignee: Texas Instruments Inc
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Filing: 1993-06-22
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Granted: 1996-05-28
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Expires: 2013-06-22
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Abstract

Abstract Novel methods of forming capacitors containing high dielectric materials are disclosed. Capacitors are made by forming a layer of conductive metal nitride (e.g. ruthenium nitride, 28), then forming a layer of a high dielectric constant material (e.g. barium strontium titanate, 30) on the metal nitride layer, then forming a layer of a non-metal containing electrically conductive compound (e.g. ruthenium oxide, 32) on the layer of high dielectric constant material. Typically, the high dielectric constant material is a transition metal oxide, a titanate, a titanate doped with one or more rare earth elements, a titanate doped with one or more alkaline earth metals, or combinations thereof. Preferably, the conductive compound is ruthenium nitride, ruthenium dioxide, tin nitride, tin oxide, titanium nitride, titanium monoxide, or combinations thereof. The conductive compound may be doped to increase its electrical conductivity.

Inventors

  • 👤 Monte A. Douglas
  • 👤 Scott R. Summerfelt

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 02:04
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/005; H01G4/008; H03; H03K; H03K19/00; H03K19/02; H03K19/08; H03K19/094; H03K19/0944; H03K19/0948; H03K19/0008; H03K19/0016; H03K19/003; H03K19/00323; H10; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/692; H10D1/696; H10D84/00; H10D84/80; H10D84/82; H10D84/83; H10D84/85; H10D1/682; H10D1/694; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 64 words
A structure comprising: a semiconductor structure; a first layer formed on said semiconductor substrate and comprising a conductive nitride of a first metal; a second layer in contact with said first layer and comprising a conductive oxide of said first metal; a third layer in contact with said second layer and comprising a dielectric material; and an electrical connection formed on said third layer.
Claim 2
Dependent Claim 64 words
A structure comprising: a semiconductor structure; a first layer formed on said semiconductor substrate and comprising a conductive nitride of a first metal; a second layer in contact with said first layer and comprising a conductive oxide of said first metal; a third layer in contact with said second layer and comprising a dielectric material; and an electrical connection formed on said third layer.
Claim 3
Dependent Claim 21 words
The structure of claim 1, wherein said first metal is selected from the group consisting of ruthenium, tin, zinc and titanium.
Claim 4
Dependent Claim 16 words
The structure of claim 1, wherein said first layer is in contact with said semiconductor substrate.
Claim 5
Dependent Claim 58 words
The structure of claim 1, wherein said dielectric material is selected from the group consisting of barium strontium titanate, lead zirconate titanate, lead titanate, potassium niobate, potassium tantalate, lead niobate, lead magnesium niobate, magnesium niobate, bismuth titanate, tantalum pentoxide, niobium pentoxide, titanium dioxide, yttrium trioxide, strontium titanate, titanium trioxide, lanthanum-doped (Ba,Sr,Pb)(Ti,Zr)O 3 , and niobium-doped (Ba,Sr,Pb)(Ti,Zr)O 3 .
Claim 6
Dependent Claim 36 words
The structure of claim 1, wherein said conductive oxide is doped to form a doped metal oxide whereby the electrical conductivity of said doped metal oxide is greater than the electrical conductivity of said conductive oxide.
Claim 7
Dependent Claim 15 words
The structure of claim 5, wherein said doped metal oxide is indium doped tin oxide.
Claim 8
Dependent Claim 36 words
The structure of claim 1, wherein said conductive nitride is doped to form a doped metal nitride whereby the electrical conductivity of said doped metal nitride is greater than the electrical conductivity of said conductive nitride.
Claim 9
Dependent Claim 20 words
The structure of claim 7, wherein said doped metal nitride is indium doped tin nitride or aluminum doped zinc nitride.
Claim 10
Dependent Claim 47 words
The structure of claim 1, wherein said electrical connection comprises: a fourth layer in contact with said third layer and comprising a conductive oxide of a second metal; and a fifth layer in contact with said fourth layer and comprising a conductive nitride of said second metal.
Claim 11
Dependent Claim 17 words
The structure of claim 9, wherein said first metal and said second metal are the same metal.
Claim 12
Dependent Claim 25 words
The structure of claim 9, wherein said first metal and said second metal are selected from the group consisting of ruthenium, tin, zinc and titanium.
Claim 13
Dependent Claim 16 words
The structure of claim 9, wherein said first layer is in contact with said semiconductor substrate.
Claim 14
Dependent Claim 58 words
The structure of claim 9, wherein said dielectric material is selected from the group consisting of barium strontium titanate, lead zirconate titanate, lead titanate, potassium niobate, potassium tantalate, lead niobate, lead magnesium niobate, magnesium niobate, bismuth titanate, tantalum pentoxide, niobium pentoxide, titanium dioxide, yttrium trioxide, strontium titanate, titanium trioxide, lanthanum-doped (Ba,Sr,Pb)(Ti,Zr)O 3 , and niobium-doped (Ba,Sr,Pb)(Ti,Zr)O 3 .

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-05-28 1999-11-27 2000-05-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-05-28 2003-11-27 2004-05-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-05-28 2007-11-27 2008-05-28 $7700.00 Window Closed / Lapsed

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