Abstract In a power semiconductor device having a power circuit 1 and a control circuit 2 incorporated in a resin case 4, said circuits being mounted on different substrates 1a and 2a and interconnected internally, and power terminals 6 and control terminals 7 connected to the power and control circuits, respectively, being drawn out of the case, the power terminals 6, the control terminals 7 and lead pins 13 are preliminarily molded by an insert technique together with the case as the power terminals 6 and the control terminals 7 are arranged at the peripheral edge of the case 4 whereas the lead pins 13 for establishing interconnection between the power and control circuits are arranged on a pin block 12 provided at the middle stage within the case, and the substrate 1a for the power circuit is mounted on a heat dissipating metal base 11 combined with the bottom side of the case 4 and the substrate 2a for the control circuit on the pin block 12, with the power terminals, control terminals and the pin block being soldered together to assemble the power semiconductor device.
A power semiconductor device comprising: a package with a base and a resin case with power and control terminals integrally embedded therein; a power circuit substrate disposed on the base having power circuit means connected to the power terminals; a pin block made of resin disposed relative to a periphery of the resin case and over the power circuit substrate and having connectors extending therethrough; a control circuit substrate mounted over the pin block and having control circuit means connected to the control terminals and connected to the power circuit means through the pin block connectors; a sealing resin disposed within the resin case and about the power and control circuit substrates and the pin block; and a cover disposed on the resin case.
Claim 2
Dependent Claim
124 words
A power semiconductor device comprising: a package with a base and a resin case with power and control terminals integrally embedded therein; a power circuit substrate disposed on the base having power circuit means connected to the power terminals; a pin block made of resin disposed relative to a periphery of the resin case and over the power circuit substrate and having connectors extending therethrough; a control circuit substrate mounted over the pin block and having control circuit means connected to the control terminals and connected to the power circuit means through the pin block connectors; a sealing resin disposed within the resin case and about the power and control circuit substrates and the pin block; and a cover disposed on the resin case.
Claim 3
Dependent Claim
19 words
A power semiconductor device as claimed in claim 1, wherein said pin block is separate from said resin case.
Claim 4
Dependent Claim
20 words
A power semiconductor device as claimed in claim 1, wherein said pin block is in a form of a beam.