EP0098028A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Hermetically sealable package for hybrid solid-state electronic devices and the like
Assignee: National Aeronautics and Space Administration
•
Filing: 1983-03-22
•
Granted: —
•
Expires: 2003-03-22
Abstract
Abstract A small component package employing a ring frame 11 of a mouldable polyamide-imide thermoplastic directly moulded onto a heat conducting base plate 10 with integral moulded anchoring pins of the thermoplastic material engaging corresponding bores 21 and 22 through the base plate. The other edge of the ring frame 11 is metallized as is the interface area 13 with a cover plate 12 of the same thermoplastic material for a soldered seal. Multiple solid electrical leads 17, 18, 19, 20 are moulded into the ring frame 11 during the base plate-to-ring moulding operation to provide an inexpensive, sealed package which is also light in weight. Threaded inserts 14 facilitate a firm connection to an external heat sink surface along surface 10a of base plate 10.
Inventors
- 👤 Wilson Noble Miller
- 👤 Ormal Edward Gray
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 06:03
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W90/00; H10W76/12; H10W76/13; H10W76/134
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
144 words
A sealed solid-state electronic package comprising: a heat conductive base plate (10) for mounting at least one electronic component in thermal contact along a first surface of said base plate, said base plate having a second surface (10a) adapted to lie mounted in thermal contact with a surface of an external heat sink; a ring frame (11) for insulating, mouldable material moulded into contact with said base plate first surface about a first edge surface of said ring frame, said ring frame having at least one electrical lead (17) moulded through a side (15) thereof; and a cover plate (12) of sheet plastic material sealed to a second edge surface (13) of said ring frame, said second ring frame edge surface and the congruent area of said cover plate being metallized, said metallized ring frame edge and metallized cover plate area being soldered together.
Claim 2
Dependent Claim
144 words
A sealed solid-state electronic package comprising: a heat conductive base plate (10) for mounting at least one electronic component in thermal contact along a first surface of said base plate, said base plate having a second surface (10a) adapted to lie mounted in thermal contact with a surface of an external heat sink; a ring frame (11) for insulating, mouldable material moulded into contact with said base plate first surface about a first edge surface of said ring frame, said ring frame having at least one electrical lead (17) moulded through a side (15) thereof; and a cover plate (12) of sheet plastic material sealed to a second edge surface (13) of said ring frame, said second ring frame edge surface and the congruent area of said cover plate being metallized, said metallized ring frame edge and metallized cover plate area being soldered together.
Claim 3
Dependent Claim
19 words
A package according to claim 1 in which said plastic ring frame is fabricated from amorphous polymer polyamide-imide material.
Claim 4
Dependent Claim
16 words
A package of claim 2 in which said base plate is made of copper or aluminum.
Claim 5
Dependent Claim
60 words
A package according to claims 2 or 3 in which said base plate comprises a plurality of bores (21) therethrough opposite said first edge surface of said ring frame, said ring frame including pins of said mouldable thermoplastic integral with said ring frame extending into said bores as a part thereof to secure said ring frame against said base plate.
Claim 6
Dependent Claim
28 words
A package according to claims 2, 3 or 4 in which said polyamide-imide material of said ring frame is fabricated with approximately 30% glass fiber and 1% PTFE.
Claim 7
Dependent Claim
52 words
A package according to claim 4 in which at least some of said bores include an expanded diameter section (22) adjacent to said base plate second surface, said pins thereby having a correspondingly enlarged end adjacent said base plate second surface for securing said ring from against said base plate first surface.
Claim 8
Dependent Claim
67 words
A package according to claims 1 through 6, in which said electrical leads are L-shaped conductors, a first leg of said L-shape extending within the wall thickness of said ring frame from external points of connection to a point within said ring frame wall at which said leads are bent to form the second leg of said L-shape extending into the interior volume within said ring frame.
Claim 9
Dependent Claim
44 words
A package according to claim 7 in which the side wall of said ring frame has increased thickness extending laterally outward beyond said cover plate surrounding said electrical leads, whereby said electrical lead first legs pass laterally outward with respect to said cover plate.
Claim 10
Dependent Claim
25 words
A package according to claims 1 or 8, in which said metallized portions of said ring frame and cover plate are areas of plated-on copper.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.