Semiconductor device

Abstract

Abstract PURPOSE:To strengthen adhesion between a molding resin and metal plate for improvement in insulation by a method wherein a groove is provided on the metal plate along the periphery of a ceramic board. CONSTITUTION:On a metal plate 6 mounted with a semiconductor element 5 with the intermediary of a ceramic board 7, a groove 11 is provided along the periphery of the ceramic board 7. A molding resin 8 injected into a casing 1 flows into the groove 11 provided on the metal plate 6, augmenting adhesion between the molding resin 8 and metal plate 6. In this design, repeated expansion and shrinkage under fluctuating temperatures are not the cause for a gap between the molding resin 8 and ceramic board 7 and metal plate 6. There will be no discharge between the semiconductor element 5 and metal plate 6, which means an enhanced insulating effect.

Inventors

• 👤 Akihiro Nagatomo
• 👤 長友　昭宏

Bibliographic Details