US5399239A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating conductive structures on substrates
Assignee: General Dynamics Information Systems Inc
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Filing: 1992-12-18
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Granted: 1995-03-21
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Expires: 2012-12-18
Abstract
Abstract The present invention is an integrated heat sink module and a method of fabricating conductive structures on a substrate. The method of the present invention includes cleaning a substrate material to remove any impurities present on the substrate surface. The method further includes placing a protective layer resilient to chemicals used in conductive structure formation, on a first surface. The first surface is opposite a second surface on which conductive structures are formed. The method includes forming conductive structures on the second surface of the substrate. The protective layer is then removed from the first surface of the substrate.
Inventors
- 👤 Deepak K. Pai
- 👤 Lowell D. Lund
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 06:44
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/44; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/13; H05K2203/1377; H05K2203/1388; H05K3/46; H05K3/4644; H05K3/467
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
74 words
A method for fabricating thin-film conductive structures on composite substrates, the method comprising: providing a composite substrate having first and second surfaces, the first surface being different from the second surface; depositing a polyimide layer, resistant to chemicals used in thin-film conductive structure formation, on the first surface of the substrate; forming thin-film conductive structures on the second surface of the substrate; and removing the polyimide layer from the first surface of the substrate.
Claim 2
Independent Claim
74 words
A method for fabricating thin-film conductive structures on composite substrates, the method comprising: providing a composite substrate having first and second surfaces, the first surface being different from the second surface; depositing a polyimide layer, resistant to chemicals used in thin-film conductive structure formation, on the first surface of the substrate; forming thin-film conductive structures on the second surface of the substrate; and removing the polyimide layer from the first surface of the substrate.
Claim 3
Dependent Claim
26 words
The method for fabricating conductive structures on substrates of claim 1 further comprising cleaning the substrate material to remove any impurities present on the substrate surfaces.
Claim 4
Dependent Claim
27 words
The method for fabricating conductive structures on substrates of claim 2 wherein cleaning comprises placing potassium hydroxide on the substrate and rinsing the substrate with deionized water.
Claim 5
Dependent Claim
25 words
The method for fabricating conductive structures on substrates of claim 2 wherein cleaning includes placing hydrogen sulfide on the substrate and rinsing with deionized water.
Claim 6
Dependent Claim
29 words
The method for fabricating conductive structures on substrates of claim 1 further comprising placing a masking layer on the second surface of the substrate to define the conductive structures.
Claim 7
Dependent Claim
19 words
The method for fabricating conductive structures on substrates of claim 5 wherein the masking layer is a polyimide layer.
Claim 8
Dependent Claim
20 words
The method for fabricating conductive structures on substrates of claim 1 wherein the conductive structure is a thin film circuit.
Claim 9
Dependent Claim
29 words
The method for fabricating conductive structures on substrates of claim 1 wherein the conductive structure has at least one layer of copper and at least one layer of polyimide.
Claim 10
Dependent Claim
25 words
The method for fabricating conductive structures on substrates of claim 1 wherein removing the protective layer comprises lapping the first surface to remove the polyimide.
Claim 11
Dependent Claim
39 words
The method for fabricating conductive structures on substrates of claim 1 wherein the substrate is a material having a thermal conductivity greater that 180 watts per meter per degree Kelvin and a modulus of elasticity greater than 200 gigapascal.
Claim 12
Dependent Claim
19 words
The method for fabricating conductive structures on substrates of claim 1 wherein the substrate is a metal based composite.
Claim 13
Dependent Claim
19 words
The method for fabricating conductive structures on substrates of claim 1 wherein the substrate is a non-metal based composite.
Claim 14
Dependent Claim
21 words
The method for fabricating conductive structures on substrates of claim 1 wherein the substrate is an aluminum and carbon based composite.
Claim 15
Independent Claim
106 words
A method for fabricating thin-film conductive structures on composite substrates, the method comprising: providing a composite substrate having first and second surfaces, the first surface being different from the second surface; placing a titanium layer on the first surface; placing a copper layer on the titanium layer; placing a nickel layer on the copper layer, the titanium layer, copper layer and nickel layer forming a protective layer resistant to chemicals used in thin-film conductive structure formation on the first surface of the substrate; forming thin-film conductive structures on the second surface of the substrate; and removing the protective layer from the first surface of the substrate.
Claim 16
Independent Claim
106 words
A method for fabricating thin-film conductive structures on composite substrates, the method comprising: providing a composite substrate having first and second surfaces, the first surface being different from the second surface; placing a titanium layer on the first surface; placing a copper layer on the titanium layer; placing a nickel layer on the copper layer, the titanium layer, copper layer and nickel layer forming a protective layer resistant to chemicals used in thin-film conductive structure formation on the first surface of the substrate; forming thin-film conductive structures on the second surface of the substrate; and removing the protective layer from the first surface of the substrate.
Claim 17
Dependent Claim
26 words
The method for fabricating conductive structures on substrates of claim 14 further comprising cleaning the substrate material to remove any impurities present on the substrate surfaces.
Claim 18
Dependent Claim
27 words
The method for fabricating conductive structures on substrates of claim 15 wherein cleaning comprises placing potassium hydroxide on the substrate and rinsing the substrate with deionized water.
Claim 19
Dependent Claim
25 words
The method for fabricating conductive structures on substrates of claim 15 wherein cleaning includes placing hydrogen sulfide on the substrate and rinsing with deionized water.
Claim 20
Dependent Claim
29 words
The method for fabricating conductive structures on substrates of claim 14 further comprising placing a masking layer on the second surface of the substrate to define the conductive structures.
Claim 21
Dependent Claim
19 words
The method for fabricating conductive structures on substrates of claim 18 wherein the masking layer is a polyimide layer.
Claim 22
Dependent Claim
54 words
The method for fabricating conductive structures on substrates of claim 14 wherein removing the protective layer comprises: immersing the protective layer in hydrochloric acid to remove the nickel layer; immersing the protective layer in ammonium persulfate to remove the copper layer; and immersing the protective layer in hydrofluoric acid to remove the titanium layer.
Claim 23
Dependent Claim
20 words
The method for fabricating conductive structures on substrates of claim 14 wherein the conductive structure is a thin film circuit.
Claim 24
Dependent Claim
29 words
The method for fabricating conductive structures on substrates of claim 14 wherein the conductive structure has at least one layer of copper and at least one layer of polyimide.
Claim 25
Dependent Claim
39 words
The method for fabricating conductive structures on substrates of claim 14 wherein the substrate is a material having a thermal conductivity greater that 180 watts per meter per degree Kelvin and a modulus of elasticity greater than 200 gigapascal.
Claim 26
Dependent Claim
19 words
The method for fabricating conductive structures on substrates of claim 14 wherein the substrate is a metal based composite.
Claim 27
Dependent Claim
19 words
The method for fabricating conductive structures on substrates of claim 14 wherein the substrate is a non-metal based composite.
Claim 28
Dependent Claim
21 words
The method for fabricating conductive structures on substrates of claim 14 wherein the substrate is an aluminum and carbon based composite.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-20 | 1998-09-19 | 1999-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-20 | 2002-09-19 | 2003-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-20 | 2006-09-19 | 2007-03-21 | $7700.00 | Window Closed / Lapsed |