US4961987A
Expired / Lapsed
US
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Aluminum nitride sintered body with high thermal conductivity and process for producing same
Assignee: Niterra Co Ltd
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Filing: 1989-09-11
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Granted: 1990-10-09
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Expires: 2009-09-11
Abstract
Abstract AlN-base sintered body with a high thermal conductivity is produced by: preparing a compact of a material comprising 100 parts by weight of aluminum nitride and 0.1-10 parts by weight, calculated on metal element, of at least one component selected from the group consisting of elements of Group 4a, 5a and 6a of the Periodic Table, and compounds thereof; and sintering said compact at a temperature ranging from 1500° to 2000° C. under a non-oxidizing atmosphere having a source of boron and/or carbon supply. The compounds include oxides, borides, nitrides and carbides. The elements include W, Mo, Ta and Ti. Oxides are converted to other compounds through sintering. This AlN-base sintered body has good wettability with metal for metallization and enables simultaneous sintering with metallization layer. Multilayer laminated circuit boards or substrates thereof can be produced.
Inventors
- 👤 Akiyasu Okuno
- 👤 Masakazu Watanabe
- 👤 Kazuhiko Ikoma
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:43
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/259; C; C04; C04B; C04B35/00; C04B35/515; C04B35/58; C04B35/581; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
119 words
A multilayer circuit board comprising at least two layers of an insulating substrate, said insulating substrate comprising an aluminum nitride-base sintered body with high thermal conductivity, excellent wettability to metal and a specific resistivity of at least 10 9 ohm-cm which consists essentially of 100 parts by weight of aluminum nitride and 0.1-10 parts by weight of at least one component selected from the group consisting of metal borides of elements of Groups 4a (Ti, Zr, Hf), 5a (V, Nb, Ta) and 6a (Cr, Mo, W) of the International Periodic Table, and metal nitrides of elements of said Groups 4a and 5a of the International Periodic Table, based on the weight of metal of said at least one component.
Claim 2
Dependent Claim
119 words
A multilayer circuit board comprising at least two layers of an insulating substrate, said insulating substrate comprising an aluminum nitride-base sintered body with high thermal conductivity, excellent wettability to metal and a specific resistivity of at least 10 9 ohm-cm which consists essentially of 100 parts by weight of aluminum nitride and 0.1-10 parts by weight of at least one component selected from the group consisting of metal borides of elements of Groups 4a (Ti, Zr, Hf), 5a (V, Nb, Ta) and 6a (Cr, Mo, W) of the International Periodic Table, and metal nitrides of elements of said Groups 4a and 5a of the International Periodic Table, based on the weight of metal of said at least one component.
Claim 3
Dependent Claim
159 words
A multilayer circuit board comprising at least two layers of an insulating substrate, said insulating substrate comprising an aluminum nitride-base sintered body with high thermal conductivity, excellent wettability to metal and a specific resistivity of at least 10 9 ohm-cm which consists essentially of 100 parts by weight of aluminum nitride and 0.1-10 parts by weight of at least two components selected from the group consisting of metal borides, metal nitrides and metal carbides, the borides and carbides being of elements of Groups 4a (Ti, Zr, Hf), 5a (V, Nb, Ta) and 6a (Cr, Mo, W) of the International Periodic Table, and the nitrides being of elements of said Groups 4a and 5a of the International Periodic Table, based on the weight of metal of said at least two components, wherein at least one of said components is at least one of said borides and nitrides and at least one of said components is any one of said carbides.
Claim 4
Dependent Claim
159 words
A multilayer circuit board comprising at least two layers of an insulating substrate, said insulating substrate comprising an aluminum nitride-base sintered body with high thermal conductivity, excellent wettability to metal and a specific resistivity of at least 10 9 ohm-cm which consists essentially of 100 parts by weight of aluminum nitride and 0.1-10 parts by weight of at least two components selected from the group consisting of metal borides, metal nitrides and metal carbides, the borides and carbides being of elements of Groups 4a (Ti, Zr, Hf), 5a (V, Nb, Ta) and 6a (Cr, Mo, W) of the International Periodic Table, and the nitrides being of elements of said Groups 4a and 5a of the International Periodic Table, based on the weight of metal of said at least two components, wherein at least one of said components is at least one of said borides and nitrides and at least one of said components is any one of said carbides.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-10-08 | 1994-04-09 | 1994-10-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-10-08 | 1998-04-09 | 1998-10-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-10-08 | 2002-04-09 | 2002-10-09 | $7700.00 | Window Closed / Lapsed |