US4756795A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Raw card fabrication process with nickel overplate
Assignee: International Business Machines Corp
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Filing: 1986-10-31
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Granted: 1988-07-12
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Expires: 2006-10-31
Abstract
Abstract A process for making printed circuit cards is disclosed wherein a copper clad, insulating substrate having a layer of copper from which circuitry lines and patterns will be fabricated, is coated with a thin layer of nickel prior to forming any circuit patterns.
Inventors
- 👤 Peter Bakos
- 👤 Lawrence M. Baldauf
- 👤 Duane T. Napp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 15:01
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; H05K3/243; H05K3/40; H05K3/42; H05K3/425; H05K3/427; H05K1/00; H05K1/02; H05K1/11; H05K1/117; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/02; H05K3/06; H05K3/061; H05K3/064; H05K3/38; H05K3/382; H05K3/384; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/12; Y10T428/12389; Y10T428/12396; Y10T428/24; Y10T428/24273; Y10T428/24322
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
108 words
An improved process for making circuitry patterns adapted for subsequent attachment of electronic components on printed circuit boards comprising: providing a copper clad insulator substrate having a pattern of holes milled therethrough, and subsequently copper plated; applying a layer of low stress nickel to a thickness in the range from about 10 to about 25 micro inches over the surface of and through the through-holes in the copper clad substrate by electroplating nickel from a nickel sulfamate salt solution having a concentration in a range from about 250-500 grm/liter; developing a predetermined circuit pattern on the nickel layer; and removing nickel overlaid copper not comprising the predetermined pattern.
Claim 2
Dependent Claim
108 words
An improved process for making circuitry patterns adapted for subsequent attachment of electronic components on printed circuit boards comprising: providing a copper clad insulator substrate having a pattern of holes milled therethrough, and subsequently copper plated; applying a layer of low stress nickel to a thickness in the range from about 10 to about 25 micro inches over the surface of and through the through-holes in the copper clad substrate by electroplating nickel from a nickel sulfamate salt solution having a concentration in a range from about 250-500 grm/liter; developing a predetermined circuit pattern on the nickel layer; and removing nickel overlaid copper not comprising the predetermined pattern.
Claim 3
Dependent Claim
33 words
The process of claim 1 wherein the applying step additionally includes plating at a current density of 20 amps per square foot for a period of from about 5 to about 12 minutes.
Claim 4
Dependent Claim
61 words
An improved circuit board structure including: at least one surface covered with an electrically conductive material in which circuit patterns will be formed; and a layer of electroplated nickel on said one surface, said nickel having a thickness in the range of from about 10 to about 25 micro inches coextensive with surfaces of circuit patterns in the electrically conductive material.
Claim 5
Dependent Claim
61 words
An improved circuit board structure including: at least one surface covered with an electrically conductive material in which circuit patterns will be formed; and a layer of electroplated nickel on said one surface, said nickel having a thickness in the range of from about 10 to about 25 micro inches coextensive with surfaces of circuit patterns in the electrically conductive material.
Claim 6
Dependent Claim
14 words
The circuit board structure of claim 3 wherein the electrically conductive material is copper.
Claim 7
Independent Claim
113 words
A method of making a printed circuit board comprising the sequential steps of: coating with copper all surfaces of a laminated substrate having a pattern of through holes; electroplating the copper coated surfaces of the substrate with a thin layer of nickel from a low stress nickel sulfamate bath to a thickness of from about 10 to about 25 micro inches; providing a pattern of connector tabs on one planar surface of the substrate; providing electrically conductive material on the connector tabs; photolithographically providing a predetermined circuit pattern in the nickel plated copper layer; and removing nickel and copper not included in the predetermined circuit pattern for providing circuitry for electronic component attachment.
Claim 8
Independent Claim
113 words
A method of making a printed circuit board comprising the sequential steps of: coating with copper all surfaces of a laminated substrate having a pattern of through holes; electroplating the copper coated surfaces of the substrate with a thin layer of nickel from a low stress nickel sulfamate bath to a thickness of from about 10 to about 25 micro inches; providing a pattern of connector tabs on one planar surface of the substrate; providing electrically conductive material on the connector tabs; photolithographically providing a predetermined circuit pattern in the nickel plated copper layer; and removing nickel and copper not included in the predetermined circuit pattern for providing circuitry for electronic component attachment.
Claim 9
Dependent Claim
23 words
The method of claim 5 wherein photolithographically providing a predetermined circuit pattern includes protecting the connector tabs from destruction during subsequent process steps.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-07-12 | 1992-01-11 | 1992-07-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-07-12 | 1996-01-11 | 1996-07-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-07-12 | 2000-01-11 | 2000-07-12 | $7700.00 | Window Closed / Lapsed |