Patent US5390079A successfully refreshed from Google Patents.
US5390079A
Expired / Lapsed
US
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Tape carrier package
Assignee: Hitachi Ltd
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Filing: 1992-09-09
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Granted: 1995-02-14
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Expires: 2012-09-09
Abstract
Abstract A tape carrier package has a base film and leads formed on one side of the base film. The base film defines a device hole therein, while the leads have outer portions to be bonded to a substrate and inner lead portions extending into the device hole. The tape carrier package can be mounted on a substrate by applying a high-frequency electromagnetic field to a portion of each lead which is to be bonded to the substrate, whereby solder applied to the lead or substrate in advance is heated and melted to bond the package to the substrate.
Inventors
- 👤 Kokichi Aomori
- 👤 Michiharu Honda
- 👤 Toshihiro Okabe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:41
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; B; B23; B23K; B23K1/00; B23K1/002; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W70/099; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10424; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K2201/10689; H05K2203/00; H05K2203/01; H05K2203/0195; H05K2203/10; H05K2203/101; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
72 words
A tape carrier package comprising: a base film defining a device hole therein; leads formed on a first side of said base film, said leads having outer lead portions to be bonded to a substrate and inner lead portions extending into said device hole; and a support member arranged on a second side of the portion of said base film that is between said inner lead portions and said outer lead portions.
Claim 2
Dependent Claim
72 words
A tape carrier package comprising: a base film defining a device hole therein; leads formed on a first side of said base film, said leads having outer lead portions to be bonded to a substrate and inner lead portions extending into said device hole; and a support member arranged on a second side of the portion of said base film that is between said inner lead portions and said outer lead portions.
Claim 3
Dependent Claim
13 words
The package of claim 1 wherein said support member surrounds said device hole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-02-13 | 1998-08-15 | 1999-02-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-02-13 | 2002-08-15 | 2003-02-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-02-13 | 2006-08-15 | 2007-02-14 | $7700.00 | Window Closed / Lapsed |