US5057456A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a tab semiconductor package by securing a thin insulating frame to inner leads of the package
Assignee: Bull SAS
•
Filing: 1989-08-22
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Granted: 1991-10-15
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Expires: 2009-08-22
Abstract
Abstract On the TAB package (10) including a TAB spider (13) glued to a preformed substrate (15) and provided with leads (12) the ILB ends of which rest on an insulating frame (20), this frame is an element directly mounted on the leads, which is independent of the substrate and has a thickness substantially less than that of the substrate.
Inventors
- 👤 Gerard Dehaine
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:26
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W70/01; H10W70/04; H10W70/047; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
115 words
A method of manufacturing a TAB package, comprising: preforming an insulating substrate having an open window therein, fixing a conductive metal foil to the preformed insulating substrate via an adhesive layer, applying directly to the metal foil in at least a central region of the window a layer of photosensitive insulating material of a thickness less than the thickness of said substrate, photoengraving said layer to form an insulating frame means, and engraving the metal foil to form a TAB lead frame comprising leads having inner ends secured to said insulating frame means inside the window of the substrate and said inner ends being adapted to be connected to respective pads of an integrated circuit.
Claim 2
Independent Claim
115 words
A method of manufacturing a TAB package, comprising: preforming an insulating substrate having an open window therein, fixing a conductive metal foil to the preformed insulating substrate via an adhesive layer, applying directly to the metal foil in at least a central region of the window a layer of photosensitive insulating material of a thickness less than the thickness of said substrate, photoengraving said layer to form an insulating frame means, and engraving the metal foil to form a TAB lead frame comprising leads having inner ends secured to said insulating frame means inside the window of the substrate and said inner ends being adapted to be connected to respective pads of an integrated circuit.
Claim 3
Dependent Claim
36 words
The method as defined by claim 1, wherein said photoengraving step further comprises forming means in said insulating frame means for permitting the connection of the inner ends to the respective pads of the integrated circuit.
Claim 4
Dependent Claim
43 words
The method as defined by claim 1, further comprising forming means in said insulating frame means for permitting the connection of the inner ends to the respective pads of the integrated circuit, and wherein said forming step is conducted after said photoengraving step.
Claim 5
Dependent Claim
28 words
The method as defined by claim 2, wherein said means in said insulating frame means are through holes corresponding to respective inner ends of the TAB lead frame.
Claim 6
Dependent Claim
28 words
The method as defined by claim 3, wherein said means in said insulating frame means are through holes corresponding to respective inner ends of the TAB lead frame.
Claim 7
Dependent Claim
23 words
The method as defined by claim 1, wherein the steps of applying and photoengraving said layer are made subsequently to said engraving step.
Claim 8
Dependent Claim
13 words
The method as defined by claim 1, wherein said photosensitive material is photopolyimide.
Claim 9
Dependent Claim
16 words
The method as defined by claim 1, wherein said photosensitive material is a solder resist material.
Claim 10
Dependent Claim
22 words
The method as defined by claim 1, wherein said photosensitive material is applied by deposition in liquid form to the metal foil.
Claim 11
Independent Claim
106 words
A method of manufacturing a TAB package, comprising: preforming an insulating substrate having an open window therein, fixing a conductive metal foil to the preformed insulating substrate via an adhesive layer, engraving the conductive metal foil to form a TAB lead frame comprising leads each having inside the window of the substrate an inner end adapted for connection to a respective pad of an integrated circuit, and securing to said inner ends insulating frame means of a thickness less than the thickness of said insulating substrate, and having hole means for permitting the connection of the inner ends to the respective pads of the integrated circuit.
Claim 12
Independent Claim
106 words
A method of manufacturing a TAB package, comprising: preforming an insulating substrate having an open window therein, fixing a conductive metal foil to the preformed insulating substrate via an adhesive layer, engraving the conductive metal foil to form a TAB lead frame comprising leads each having inside the window of the substrate an inner end adapted for connection to a respective pad of an integrated circuit, and securing to said inner ends insulating frame means of a thickness less than the thickness of said insulating substrate, and having hole means for permitting the connection of the inner ends to the respective pads of the integrated circuit.
Claim 13
Dependent Claim
32 words
The method as defined by claim 10, wherein the securing step is conducted before said engraving step at a place corresponding to a location where said inner ends are to be formed.
Claim 14
Dependent Claim
30 words
The method as defined by claim 10, wherein said hole means in said insulating frame means are through holes corresponding to the respective inner ends of the TAB lead frame.
Claim 15
Dependent Claim
15 words
The method as defined by claim 10, wherein said securing step comprises a gluing step.
Claim 16
Dependent Claim
24 words
The method as defined by claim 10, wherein said securing step comprises a direct connection of the inner ends to the insulating frame means.
Claim 17
Independent Claim
86 words
A method of manufacturing a TAB package, comprising: preforming an insulating substrate having an open window therein, fixing a conductive metal foil to the preformed insulating substrate via an adhesive layer, engraving the conductive metal foil to form a TAB lead frame comprising leads each having inside the window of the substrate an inner end adapted for connection to a respective pad of an integrated circuit, and securing to said inner ends insulating frame means of a thickness less than the thickness of said insulating substrate.
Claim 18
Independent Claim
86 words
A method of manufacturing a TAB package, comprising: preforming an insulating substrate having an open window therein, fixing a conductive metal foil to the preformed insulating substrate via an adhesive layer, engraving the conductive metal foil to form a TAB lead frame comprising leads each having inside the window of the substrate an inner end adapted for connection to a respective pad of an integrated circuit, and securing to said inner ends insulating frame means of a thickness less than the thickness of said insulating substrate.
Claim 19
Dependent Claim
30 words
The method as defined by claim 15, further comprising piercing said insulating frame means to permit the connection of said inner ends to said respective pads of the integrated circuit.
Claim 20
Dependent Claim
27 words
The method as defined by claim 16, wherein the piercing step comprises forming through holes under each of the respective inner ends of the TAB lead frame.
Claim 21
Dependent Claim
32 words
The method as defined by claim 15, wherein the securing step is conducted before said engraving step, at a place corresponding to a location where said inner ends are to be formed.
Claim 22
Dependent Claim
15 words
The method as defined by claim 15, wherein said securing step comprises a gluing step.
Claim 23
Dependent Claim
24 words
The method as defined by claim 15, wherein said securing step comprises a direct connection of the inner ends to the insulating frame means.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-14 | 1995-04-15 | 1995-10-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-14 | 1999-04-15 | 1999-10-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-14 | 2003-04-15 | 2003-10-15 | $7700.00 | Window Closed / Lapsed |