US4934582A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for removing solder mounted electronic components
Assignee: Samsung Electronics Co Ltd
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Filing: 1989-09-20
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Granted: 1990-06-19
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Expires: 2009-09-20
Abstract
Abstract A method and apparatus are described for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering braid is shaped to cover each of the electronic component's outer lead bonds without contacting the component's base. The desoldering braid is heated and brought in contact with the bonds until the solder flows into the desoldering braid and any broken outer leads attach to the desoldering braid. Upon removal of the desoldering braid the electronic component can be lifted off the surface. The desoldered solder joints will contain a thin uniform coating of solder less than approximately 50 micro inches thick. This allows for removal and replacement of solder mounted electronic components with leads on center lines spaced less than 0.020 inches.
Inventors
- 👤 Michael J. Bertram
- 👤 Daniel M. Andrews
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:46
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/018; H; H05; H05K; H05K13/00; H05K13/04; H05K13/0486
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
130 words
A method for desoldering a solder mounted electronic component from a surface comprising: positioning a desoldering braid above the electronic component, wherein the desoldering braid contains an opening shaped so that the base of the electronic component fits inside the opening while the desoldering braid covers each of the solder joints that connect the outer leads of the electronic component to the surface, heating the desoldering braid to at least the melting point of the solder, contacting the desoldering braid with each of the solder joints in heat exchange relationship so that the solder is rendered molten and flows from the solder joints into the desoldering braid, and removing the solder-filled desoldering braid from the solder joints after the solder has flowed from the solder joints into the desoldering braid.
Claim 2
Independent Claim
130 words
A method for desoldering a solder mounted electronic component from a surface comprising: positioning a desoldering braid above the electronic component, wherein the desoldering braid contains an opening shaped so that the base of the electronic component fits inside the opening while the desoldering braid covers each of the solder joints that connect the outer leads of the electronic component to the surface, heating the desoldering braid to at least the melting point of the solder, contacting the desoldering braid with each of the solder joints in heat exchange relationship so that the solder is rendered molten and flows from the solder joints into the desoldering braid, and removing the solder-filled desoldering braid from the solder joints after the solder has flowed from the solder joints into the desoldering braid.
Claim 3
Dependent Claim
16 words
The method of claim 1 wherein the desoldering braid is a piece of woven copper material.
Claim 4
Dependent Claim
12 words
The method of claim 2 wherein the woven copper material contains flux.
Claim 5
Dependent Claim
12 words
The method of claim 1 wherein the solder joints are simultaneously desoldered.
Claim 6
Dependent Claim
21 words
The method of claim 1 wherein the electronic component has outer leads tape-automated-bonded by soldering to a high density interconnect substrate.
Claim 7
Dependent Claim
18 words
The method of claim 5 wherein the outer leads have center lines spaced less than approximately 0.020 inches.
Claim 8
Dependent Claim
39 words
The method of claim 1 wherein a heat source for the desoldering braid also provides pressure at the interface between the desoldering braid and the solder joints by contacting the desoldering braid on the side opposite the solder joints
Claim 9
Dependent Claim
25 words
The method of claim 7 wherein the shape of the heat source is similar to the interface between the desoldering braid and the solder joints.
Claim 10
Dependent Claim
20 words
The method of claim 1 wherein the desoldering braid fails to contact solder joints of other components on the surface.
Claim 11
Dependent Claim
42 words
The method of claim 1 wherein upon removal of the desoldering braid any outer leads that were connected to the solder joints and detached from the electronic component become fastened to the desoldering braid and are also removed from the solder joints.
Claim 12
Dependent Claim
15 words
The method of claim 1 further comprising removing the desoldered electronic component from the surface.
Claim 13
Dependent Claim
25 words
The method of claim 11 wherein after removing the desoldered component the solder joints are left with a thin and nearly uniform coating of solder.
Claim 14
Dependent Claim
22 words
The method of claim 12 wherein the thin and nearly uniform coating of solder is less than about 50 micro inches thick.
Claim 15
Dependent Claim
21 words
The method of claim 1 wherein the desoldering braid is a strip and is fed through in reel to reel form.
Claim 16
Independent Claim
137 words
An apparatus for desoldering a solder mounted electronic component from a surface comprising: a desoldering braid positioned above the electronic component, wherein the desoldering braid contains an opening shaped so that the base of the electronic component fits inside the opening while the desoldering braid covers each of the solder joints that connect the outer leads of the electronic component to the surface, means for heating the desoldering braid to at least the melting point of the solder, means for contacting the desoldering braid with each of the solder joints in heat exchange relationship so that the solder is rendered molten and will flow from the solder joints into the desoldering braid, and means for removing the solder-filled desoldering braid from the solder joints after the solder has flowed from the solder joints into the desoldering braid.
Claim 17
Independent Claim
137 words
An apparatus for desoldering a solder mounted electronic component from a surface comprising: a desoldering braid positioned above the electronic component, wherein the desoldering braid contains an opening shaped so that the base of the electronic component fits inside the opening while the desoldering braid covers each of the solder joints that connect the outer leads of the electronic component to the surface, means for heating the desoldering braid to at least the melting point of the solder, means for contacting the desoldering braid with each of the solder joints in heat exchange relationship so that the solder is rendered molten and will flow from the solder joints into the desoldering braid, and means for removing the solder-filled desoldering braid from the solder joints after the solder has flowed from the solder joints into the desoldering braid.
Claim 18
Dependent Claim
16 words
The apparatus of claim 15 wherein the desoldering braid is a piece of woven copper material.
Claim 19
Dependent Claim
12 words
The apparatus of claim 15 wherein the solder joints are simultaneously desoldered.
Claim 20
Dependent Claim
42 words
The apparatus of claim 15 wherein the means for heating the desoldering braid is a thermode that provides pressure at the interface between the desoldering braid and the solder joints by contacting the desoldering braid on the side opposite the solder joints.
Claim 21
Dependent Claim
27 words
The apparatus of claim 18 wherein the shape of the thermode is similar to the shape of the interface between the solder joints and the desoldering braid.
Claim 22
Dependent Claim
17 words
The apparatus of claim 15 further comprising means for removing the desoldered electronic component from the surface.
Claim 23
Dependent Claim
31 words
The apparatus of claim 20 wherein the means for removing the desoldered electronic component is a vacuum pipette brought in contact with the top of the base of the electronic component.
Claim 24
Dependent Claim
21 words
The apparatus of claim 15 wherein the desoldering braid is a strip and is fed through in reel to reel form.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-18 | 1993-12-18 | 1994-06-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-18 | 1997-12-18 | 1998-06-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-18 | 2001-12-18 | 2002-06-19 | $7700.00 | Window Closed / Lapsed |