EP0331814A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Lead frame for semiconductor device
Assignee: Siemens AG
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Filing: 1988-12-20
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Granted: —
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Expires: 2008-12-20
Abstract
Abstract A lead frame and method for processing the lead frames from a continuous strip of lead frames (11). A first insulation support member (30) and a second insulative support member (32) are first molded to the lead frame. After the support members are formed, the positioning member for supporting the leads within the lead frame is stamped from the lead frame. After an integrated circuit (IC) is connected to the leads, the IC can be tested within the lead frame since the leads are electrically isolated from the lead frame and each other. Finally the IC can be encapsulated and the leads severed from the lead frame assembly.
Inventors
- 👤 Marvin Lumbard
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 07:09
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H10W70/40; H10W70/421; H10W70/438; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
130 words
A method for processing the lead frames of a lead frame strip, wherein the lead frames provide the leads for an integrated circuit, comprising: providing a lead frame strip defining at least one lead frame, wherein the lead frame defines a support section and a plurality of leads attached to a positioning member, the positioning member being attached to the support section; attaching the integrated circuit to the leads; providing a first insulative member for connecting the leads to the support section; providing a second insulative member for interconnecting the leads; and removing the positioning member such that the insulative material, support section and leads cooperate so that the leads are supported by the support section while being electrically insulated from the support section and electrically insulated from each other.
Claim 2
Independent Claim
130 words
A method for processing the lead frames of a lead frame strip, wherein the lead frames provide the leads for an integrated circuit, comprising: providing a lead frame strip defining at least one lead frame, wherein the lead frame defines a support section and a plurality of leads attached to a positioning member, the positioning member being attached to the support section; attaching the integrated circuit to the leads; providing a first insulative member for connecting the leads to the support section; providing a second insulative member for interconnecting the leads; and removing the positioning member such that the insulative material, support section and leads cooperate so that the leads are supported by the support section while being electrically insulated from the support section and electrically insulated from each other.
Claim 3
Dependent Claim
14 words
The method of claim 1 further comprising tne step of testing the integrated circuit.
Claim 4
Dependent Claim
19 words
The method of claim 2 further comprising encapsulating the integrated circuit and severing the leads from the lead frame.
Claim 5
Dependent Claim
22 words
The method of claim 2 wherein the first insulative member is molded such that it forms a molded substantially U-shaped plastic member.
Claim 6
Dependent Claim
22 words
The method of claim 4 wherein the second insulative member is molded such that it forms a molded substantially rectangular plastic member.
Claim 7
Dependent Claim
22 words
The method of claim 2 wherein the first insulative member is molded such that it forms a molded substantially rectangular plastic member.
Claim 8
Dependent Claim
22 words
The method of claim 6 wherein the second insulative member is molded such that it forms a molded substantially rectangular plastic member.
Claim 9
Independent Claim
156 words
A method for processing the lead frames of a lead frame strip, wherein the lead frames provide the leads for an integrated circuit, comprising: providing a lead frame strip defining at least one lead frame, wherein the lead frame defines a support section and a plurality of leads attached to a positioning member, the positioning member being attached to the support section; providing a first plastic member for connecting the leads to the support section; providing a second plastic member for intercomectlng the leads; removing the positioning member such that the insulative material, support section and leads cooperate so that the leads are supported by the support section while being electrically insulated from the support section and electrically insulated from each other; attaching the integrated circuit to the leads; testing the integrated circuit; encapsulating the integrated circuit after the integrated circuit is tested; and severing the leads from the lead frame after encapsulating the integrated circuit.
Claim 10
Independent Claim
156 words
A method for processing the lead frames of a lead frame strip, wherein the lead frames provide the leads for an integrated circuit, comprising: providing a lead frame strip defining at least one lead frame, wherein the lead frame defines a support section and a plurality of leads attached to a positioning member, the positioning member being attached to the support section; providing a first plastic member for connecting the leads to the support section; providing a second plastic member for intercomectlng the leads; removing the positioning member such that the insulative material, support section and leads cooperate so that the leads are supported by the support section while being electrically insulated from the support section and electrically insulated from each other; attaching the integrated circuit to the leads; testing the integrated circuit; encapsulating the integrated circuit after the integrated circuit is tested; and severing the leads from the lead frame after encapsulating the integrated circuit.
Claim 11
Dependent Claim
21 words
The method of claim 8 wherein the first plastic member is molded such that it forms a molded substantially U-shaped member.
Claim 12
Dependent Claim
21 words
The method of claim 9 wherein the second plastic member is molded such that it forms a molded substantially rectangular member.
Claim 13
Dependent Claim
21 words
The method of claim 12 wherein the first plastic member is molded such that it forms a molded substantially rectangular member.
Claim 14
Dependent Claim
21 words
The process of claim 11 wherein the second plastic member is molded such that it forms a molded substantially rectangular member.
Claim 15
Dependent Claim
70 words
A lead frame assembly for supporting a circuit during testing comprising: a circuit a plurality of leads for connection to the circuit; a support section; a first insulative member for supporting the leads relative to the support section, wherein the leads are electrically isolated from the support section; and a second insulative member for supporting the leads relative to each other, wherein the leads are electrically isolated from each other.
Claim 16
Dependent Claim
70 words
A lead frame assembly for supporting a circuit during testing comprising: a circuit a plurality of leads for connection to the circuit; a support section; a first insulative member for supporting the leads relative to the support section, wherein the leads are electrically isolated from the support section; and a second insulative member for supporting the leads relative to each other, wherein the leads are electrically isolated from each other.
Claim 17
Dependent Claim
41 words
The lead frame assembly of claim 13 further comprising support tabs for interacting with the first insulative members, wherein the support section defines positioning holes, the first insulative member is substantially U-shaped, and the second insulative member is substantially rectangular shaped.
Claim 18
Dependent Claim
41 words
The lead frame assembly of claim 13, wherein the support section defines support holes for interacting with the first insulative member and positioning holes, the first insulative member is substantially rectangular shaped, and the second insulative member is substantially rectangular shaped.
References Cited (Backward Citations)
No citation records indexed.
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