Patent US5765166A successfully refreshed from Google Patents.
Patent US5382829A successfully refreshed from Google Patents.
US5382829A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaged microwave semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1993-03-17
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Granted: 1995-01-17
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Expires: 2013-03-17
Abstract
Abstract A semiconductor device including an insulating film substrate having a surface, a high frequency semiconductor chip disposed on the surface, and circuit elements disposed on the surface and connected to the semiconductor chip wherein the insulating film substrate is bent into a U-shape, laminated, and encapsulated with a resin. The package of the device is miniaturized.
Inventors
- 👤 Akira Inoue
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:06
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W42/00; H10W42/20; H10W44/00; H10W44/20; H10W44/501; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/67; H10W70/688; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2203/00; H05K2203/13; H05K2203/1305; H05K2203/1327; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
103 words
A packaged semiconductor device comprising: a folded flexible insulating film substrate having a front surface and a rear surface and including a fold so that a first part of said rear surface faces a second part of said rear surface; a high frequency semiconductor chip disposed on said front surface; circuit elements disposed on said front surface and connected to said semiconductor chip; an insulating adhesive layer disposed between and bonding the first and second parts of said rear surface; and a resin encapsulating said folded flexible insulating film substrate, said high frequency semiconductor chip, said circuit elements, and said insulating adhesive layer.
Claim 2
Dependent Claim
103 words
A packaged semiconductor device comprising: a folded flexible insulating film substrate having a front surface and a rear surface and including a fold so that a first part of said rear surface faces a second part of said rear surface; a high frequency semiconductor chip disposed on said front surface; circuit elements disposed on said front surface and connected to said semiconductor chip; an insulating adhesive layer disposed between and bonding the first and second parts of said rear surface; and a resin encapsulating said folded flexible insulating film substrate, said high frequency semiconductor chip, said circuit elements, and said insulating adhesive layer.
Claim 3
Dependent Claim
23 words
The packaged semiconductor device of claim 1 comprising an electromagnetic shielding layer disposed between the first and second parts of said rear surface.
Claim 4
Dependent Claim
122 words
A packaged semiconductor device comprising: a folded flexible insulating film substrate having a front surface and a rear surface and including multiple folds of alternating directions so that said folded flexible insulating film substrate has a serpentine cross-section and respective parts of said front surface face each other and respective parts of said rear surface face each other; a high frequency semiconductor chip disposed on said front surface; circuit elements disposed on said front surface and connected to said high frequency semiconductor chip; an insulating adhesive layer disposed between and bonding facing parts of said front and rear surfaces; and a resin encapsulating said folded flexible insulating film substrate, said high frequency semiconductor chip, said circuit elements, and said insulating adhesive layer.
Claim 5
Dependent Claim
122 words
A packaged semiconductor device comprising: a folded flexible insulating film substrate having a front surface and a rear surface and including multiple folds of alternating directions so that said folded flexible insulating film substrate has a serpentine cross-section and respective parts of said front surface face each other and respective parts of said rear surface face each other; a high frequency semiconductor chip disposed on said front surface; circuit elements disposed on said front surface and connected to said high frequency semiconductor chip; an insulating adhesive layer disposed between and bonding facing parts of said front and rear surfaces; and a resin encapsulating said folded flexible insulating film substrate, said high frequency semiconductor chip, said circuit elements, and said insulating adhesive layer.
Claim 6
Dependent Claim
29 words
The packaged semiconductor device of claim 3 wherein said high frequency semiconductor chip and said circuit elements are disposed on different folds of said folded flexible insulating film substrate.
Claim 7
Dependent Claim
24 words
The packaged semiconductor device of claim 3 comprising an electromagnetic shielding layer disposed on the rear surface of said folding flexible insulating film substrate.
Claim 8
Dependent Claim
94 words
A packaged semiconductor device comprising: a flexible rolled insulating film substrate having a front surface and a rear surface and rolled so that the flexible rolled insulating film substrate has a spiral cross-section; a high frequency semiconductor chip disposed on said front surface; circuit elements disposed on said front surface and connected to said high frequency semiconductor chip; an insulating adhesive layer disposed between and bonding said front and rear surfaces; and a resin encapsulating said flexible rolled insulating film substrate, said high frequency semiconductor chip, said circuit elements, and said insulating adhesive layer.
Claim 9
Dependent Claim
94 words
A packaged semiconductor device comprising: a flexible rolled insulating film substrate having a front surface and a rear surface and rolled so that the flexible rolled insulating film substrate has a spiral cross-section; a high frequency semiconductor chip disposed on said front surface; circuit elements disposed on said front surface and connected to said high frequency semiconductor chip; an insulating adhesive layer disposed between and bonding said front and rear surfaces; and a resin encapsulating said flexible rolled insulating film substrate, said high frequency semiconductor chip, said circuit elements, and said insulating adhesive layer.
Claim 10
Dependent Claim
23 words
The packaged semiconductor device of claim 6 comprising an electromagnetic shielding layer covering the rear surface of said flexible rolled insulating film substrate.
Claim 11
Dependent Claim
38 words
The packaged semiconductor device of claim 1 wherein said resin has a dielectric constant and including a second material covering said high frequency semiconductor chip and having a dielectric constant lower than the dielectric constant of said resin.
Claim 12
Dependent Claim
38 words
The packaged semiconductor device of claim 3 wherein said resin has a dielectric constant and including a second material covering said high frequency semiconductor chip and having a dielectric constant lower than the dielectric constant of said resin.
Claim 13
Dependent Claim
38 words
The packaged semiconductor device of claim 6 wherein said resin has a dielectric constant and including a second material covering said high frequency semiconductor chip and having a dielectric constant lower than the dielectric constant of said resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-16 | 1998-07-18 | 1999-01-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-16 | 2002-07-18 | 2003-01-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-16 | 2006-07-18 | 2007-01-17 | $7700.00 | Window Closed / Lapsed |