Package for surface-mounting parts

Abstract

Abstract PURPOSE:To make a high density mounting possible, by making at least a second conductor pin, which connects electrically a package for surface mounting parts to another substrate and the like, longer than other first conductor pins. CONSTITUTION:A connection part 7 to mount surface parts 5 is formed on a surface side, and first conductor pins 2 and a second conductor pin 9 having electrical continuity to the connection part 7 are formed on a rear side. Connection to another substrate 3 and the like is performed via the second conductor pin 9. At least the second conductor pin 9, which connects electrically a package 1 for surface-mounting parts to another substrate 3 and the like, is made longer than the first conductor pins 2. Thereby, prior arts of simple constitution can be sufficiently applied and developed, and meanwhile an electronic circuit capable of high density mounting can be obtained.

Inventors

• 👤 Kazumasa Adachi
• 👤 足立　和正
• 👤 Shinji Takahashi
• 👤 伸治 高橋
• 👤 Kimitaka Hirabayashi
• 👤 平林　公隆

Bibliographic Details