EP0393657A2
Expired / Lapsed
EP
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Hybrid integrated circuit device
Assignee: Sanyo Electric Co Ltd
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Filing: 1990-04-19
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Granted: —
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Expires: 2010-04-19
Abstract
Abstract A hybrid integrated circuit device (10) is provided with: a microcomputer (26), a plurality of peripheral circuit elements (32), and a non-volatile memory (38) which is positioned adjacent to the microcomputer, all of which are interconnected by a plurality of specified conductive paths; a pair of integrated circuit substrates (24,25) on which is formed the conductive paths interconnected by desired connection means; and a casing (41) provided with the pair of integrated circuit substrate secured to the upper and lower surfaces thereof, forming a sealed space between these surfaces. The microcomputer and the peripheral circuit elements are positioned in the sealed space and only the non-volatile memory is positioned in an exposed space. The hybrid integrated circuit device of the present invention has a compact and simple form with a high degree of mounting density as well as superior handling capabilities and reliability.
Inventors
- 👤 Akira Kazami
- 👤 Osamu Nakamoto
- 👤 Hisashi Shimizu
- 👤 Katsumi Ohkawa
- 👤 Yasuhiro Koike
- 👤 Koji Nagahama
- 👤 Masao Kaneko
- 👤 Masakazu Ueno
- 👤 Yasuo Saitou
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 18:44
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0441; H10P72/0438; H10W; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K1/18; H05K1/189; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5524; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
105 words
(1) A hybrid integrated circuit device comprising: a pair of integrated circuit substrates which is provided with a microcomputer and its peripheral circuit elements interconnected by a specified conductive path, a non-volatile memory positioned adjacent to the microcomputer, and conductive paths formed on the pair of integrated circuit substrates and interconnected by desired connection means; and a casing provided with the pair of integrated circuit substrates secured to the upper and lower surfaces thereof, forming a sealed space between these surfaces, wherein the microcomputer and its peripheral circuit elements are positioned in the sealed space and the non-volatile memory is positioned in an exposed space.
Claim 2
Dependent Claim
40 words
(2) The hybrid integrated circuit device of Claim 1, wherein the integrated circuit substrate is a metal substrate for which the surface has been subjected to an insulating treatment, and the conductive path is formed by applying a copper foil.
Claim 3
Dependent Claim
19 words
(3) The hybrid integrated circuit device of Claim 1, wherein the microcomputer is die bonded onto the conductive path.
Claim 4
Dependent Claim
27 words
(4) The hybrid integrated circuit device of Claim 1, wherein chip parts comprising a chip resistor and a chip condenser are used as the peripheral circuit elements.
Claim 5
Dependent Claim
66 words
(5) The hybrid integrated circuit device of Claim 1, wherein an insertion hole for the non-volatile memory is formed in one of the pair of integrated circuit substrates; the casing is provided with a sealed structure except for the portion in which the insertion hole is formed; and a socket for the non-volatile memory is connected to the equivalent portion of the other integrated circuit substrate.
Claim 6
Dependent Claim
68 words
(6) The hybrid integrated circuit device of Claim 5, wherein: the insertion hole for the non-volatile memory formed in one of the pair of integrated circuit substrates is formed in essentially the same shape as the external form of the non-volatile memory; and the upper surface of the non-volatile memory and the upper surface of the integrated circuit substrate in which the insertion hole is formed essentially correspond.
Claim 7
Dependent Claim
36 words
(7) The hybrid integrated circuit device of Claim 5, wherein the upper surface of the non-volatile memory is covered with a light-shielding seal material which extends around the periphery of the insertion hole of the casing.
Claim 8
Dependent Claim
27 words
(8) The hybrid integrated circuit device of Claim 5, wherein the non-volatile memory is a dual-in-line type, an LCC type, or a PLCC type of non-volatile memory.
Claim 9
Dependent Claim
21 words
(9) The hybrid integrated circuit device of Claim 5, wherein the non-volatile memory is a single in-line type of non-volatile memory.
Claim 10
Dependent Claim
83 words
(10) The hybrid integrated circuit device of Claim 1, wherein a hole is formed in one of the pair of integrated circuit substrates; the casing is provided with a sealed structure except for the portion in which the insertion hole is formed; a non-volatile memory chip is secured to the equivalent portion of the other integrated circuit substrate; and the hole is covered with a resin which transmits ultraviolet light, and a resin layer or a seal material which shuts out ultraviolet light.
Claim 11
Dependent Claim
131 words
(11) A hybrid integrated circuit device comprising: a pair of integrated circuit substrates which is provided with a microcomputer and its peripheral circuit elements interconnected by a specified conductive path, a non-volatile memory positioned adjacent to the microcomputer, and conductive paths formed on the pair of integrated circuit substrate and interconnected by desired connection means; and a casing which is provided with the pair of integrated circuit substrates secured to the upper and lower surfaces thereof, forming a sealed space between these surfaces, and provided with an open space on part of the integrated circuit substrate; wherein the microcomputer and its peripheral circuit elements are positioned in the sealed space and the non-volatile memory is positioned in the open space formed by the casing on part of the integrated circuit substrate.
Claim 12
Dependent Claim
24 words
(12) The hybrid integrated circuit device of Claim 11, wherein the non-volatile memory is a dual-in-line or a single in-line type of non-volatile memory.
Claim 13
Dependent Claim
123 words
(13) A hybrid integrated circuit device comprising: a pair of integrated circuit substrates which is provided with a microcomputer and its peripheral circuit elements interconnected by a specified conductive path, a non-volatile memory positioned adjacent to the microcomputer, and conductive paths formed on the pair of integrated circuit substrates and interconnected by desired connection means; and a casing provided with the pair of integrated circuit substrates secured to the upper and lower surfaces thereof, forming a sealed space between these surfaces; wherein: the microcomputer and its peripheral circuit elements are positioned in the sealed space and the non-volatile memory is positioned in an exposed space on the surface opposite to the surface on which the microcomputer and its peripheral circuit elements are positioned.
Claim 14
Dependent Claim
45 words
(14) The hybrid integrated circuit device of Claim 13, wherein the non-volatile memory is a dual-in-line type, an LCC type, or a PLCC type of non-volatile memory, and the socket for the non-volatile memory is hermetically sealed in the hole in the integrated circuit substrate.
Claim 15
Dependent Claim
34 words
(15) The hybrid integrated circuit device of Claim 14, wherein the socket is a two-piece socket and a conductive path is formed between the two pieces of the socket in the integrated circuit substrate.
Claim 16
Dependent Claim
44 words
(16) The hybrid integrated circuit device of Claim 15, wherein the non-volatile memory is a single in-line type of non-volatile memory, and an ultraviolet light transmitting section of the non-volatile memory is positioned facing the casing for shielding the non-volatile memory from external light.
Claim 17
Dependent Claim
35 words
(17) The hybrid integrated circuit device of Claim 13, wherein the non-volatile memory is a non-volatile memory chip and secured to a header mounting body hermetically sealed in the hole in the integrated circuit substrate.
Claim 18
Dependent Claim
53 words
(18) The hybrid integrated circuit device of Claim 17, wherein the header mounting body is provided with an auxiliary frame; the non-volatile memory chip is mounted within the auxiliary frame; and the upper surface of the non-volatile memory chip is sealed by an ultraviolet-light transmitting resin and a non-ultraviolet light transmitting resin layer.
Claim 19
Dependent Claim
134 words
(19) A hybrid integrated circuit device comprising: a pair of integrated circuit substrates which is provided with a microcomputer and its peripheral circuit elements interconnected by a specified conductive path, a non-volatile memory positioned adjacent to the microcomputer, and conductive paths formed on the pair of integrated circuit substrates and interconnected by desired connection means; and a casing provided with the pair of integrated circuit substrates secured to the upper and lower surfaces thereof, forming a sealed space between these surfaces, wherein at least one section of one of the pair of integrated circuit substrates projects to a greater extent than the other integrated circuit substrate; the non-volatile memory is mounted on the projecting section of the integrated circuit substrate; and the microcomputer and its peripheral circuit elements are positioned in the sealed space.
Claim 20
Dependent Claim
34 words
(20) The hybrid integrated circuit device of Claim 19, wherein the non-volatile memory is a dual-in-line type of non-volatile memory, and a light-shielding seal material is provided over the surface of the non-volatile memory.
Claim 21
Dependent Claim
40 words
(21) The hybrid integrated circuit device of Claim 19, wherein the non-volatile memory is a single in-line type of non-volatile memory and the ultraviolet light transmitting section is positioned facing the casing for shielding the non-volatile memory from external light.
Claim 22
Dependent Claim
36 words
(22) The hybrid integrated circuit device of Claim 19, wherein the non-volatile memory is a non-volatile memory chip and an electrode of the non-volatile memory chip is connected by wire bonding to a specified conductive path.
Claim 23
Dependent Claim
32 words
(23) The hybrid integrated circuit device of Claim 22, wherein an ultraviolet-light transmitting resin layer and a non-ultraviolet light transmitting resin layer are formed on the upper surface of the non-volatile memory.
References Cited (Backward Citations)
No citation records indexed.
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