US5367195A
Expired / Lapsed
US
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Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
Assignee: International Business Machines Corp
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Filing: 1993-01-08
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Granted: 1994-11-22
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Expires: 2013-01-08
Abstract
Abstract This invention relates generally to structure and method for preventing metal diffusion between a noble metal layer and an adjoining non-noble metal layer, and more specifically to new structures and methods for providing a superbarrier structure between copper and an adjoining noble metal layer. This is achieved by sequentially deposited a layer of non-noble metal, a layer of titanium, a layer of molybdenum, and a layer of noble or relatively less noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.
Inventors
- 👤 Giulio DiGiacomo
- 👤 Jung-Ihl Kim
- 👤 Chandrasekhar Narayan
- 👤 Sampath Purushothaman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; H10; H10W; H10W90/00; H10W90/701; H10W20/00; H10W20/40; H10W20/45; H10W20/48; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W72/00; H10W72/01; H10W72/019; H05K3/38; H05K3/388; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07536; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
138 words
A multilayered interconnecting metallurgical structure to prevent diffusion between at least one non-noble metal layer and at least one noble or relatively less noble metal layer for an electronic component comprising, a structure over a substrate, wherein said structure comprises sequentially formed layers of at least one electrically conductive metal adhesion layer, at least one non-noble metal layer, a titanium layer, a molybdenum layer and at least one noble or relatively less noble metal layer and wherein at least a portion of said at least one electrically conductive metal adhesion layer is in direct electrical contact with at least one via in said substrate and wherein the combination of said titanium layer and said molybdenum layer prevents diffusion between said at least one non-noble metal layer and said at least one noble or relatively less noble metal layer.
Claim 2
Dependent Claim
138 words
A multilayered interconnecting metallurgical structure to prevent diffusion between at least one non-noble metal layer and at least one noble or relatively less noble metal layer for an electronic component comprising, a structure over a substrate, wherein said structure comprises sequentially formed layers of at least one electrically conductive metal adhesion layer, at least one non-noble metal layer, a titanium layer, a molybdenum layer and at least one noble or relatively less noble metal layer and wherein at least a portion of said at least one electrically conductive metal adhesion layer is in direct electrical contact with at least one via in said substrate and wherein the combination of said titanium layer and said molybdenum layer prevents diffusion between said at least one non-noble metal layer and said at least one noble or relatively less noble metal layer.
Claim 3
Dependent Claim
43 words
The structure of claim 1, wherein said non-noble metal layer is on a base metallurgy and wherein said base metallurgy is selected from the group consisting of aluminum, chromium, cobalt, copper, hafnium, molybdenum nickel, niobium, tantalum, titanium, zirconium, noble metals and mixtures thereof.
Claim 4
Dependent Claim
24 words
The structure of claim 1, wherein said non-noble metal layer is selected from the group consisting of aluminum, cobalt, copper, nickel and mixtures thereof.
Claim 5
Dependent Claim
30 words
The structure of claim 1, wherein said noble or relatively less noble metal layer is selected from the group consisting of gold, platinum, palladium, rhodium, silver, tin and mixtures thereof.
Claim 6
Dependent Claim
12 words
The structure of claim 1, wherein said substrate is a semiconductor chip.
Claim 7
Dependent Claim
32 words
The structure of claim 1, wherein said substrate is selected from a group consisting of ceramic substrates, silicon substrates, glass-ceramic substrates, alumina substrates, aluminum nitride substrates, silicon nitride substrates or mullite substrates.
Claim 8
Dependent Claim
26 words
The structure of claim 1, wherein at least a portion of said noble or relatively less noble metal layer is in contact with a solder material.
Claim 9
Dependent Claim
14 words
The structure of claim 7, wherein a pin is secured to said solder material.
Claim 10
Dependent Claim
15 words
The structure of claim 7, wherein a solder ball is secured to said solder material.
Claim 11
Dependent Claim
28 words
The structure of claim 1, wherein at least a portion of a wire is secured to at least a portion of said noble or relatively less noble metal.
Claim 12
Dependent Claim
24 words
The structure of claim 1, wherein at least a portion of a connector is in contact with at least a portion of said structure.
Claim 13
Dependent Claim
126 words
The structure of claim 1, wherein said electrically conductive metal adhesion layer has a thickness from about 0.02 to about 0.10 micron, and preferably between about 0.02 to about 0.03 micron, said non-noble metal layer has a thickness from about 1.00 to about 8.00 micron, and preferably between about 2.00 to about 6.00 micron, said titanium layer has a thickness from about 0.20 to about 2.00 micron, and preferably between about 0.50 to about 1.50 micron, said molybdenum layer has a thickness from about 0.20 to about 2.00 micron, and preferably between about 0.50 to about 1.50 micron, and said noble or relatively less noble metal layer has a thickness from about 0.5 to about 5.00 micron, and preferably between about 1.00 to about 5.00 micron.
Claim 14
Dependent Claim
31 words
The structure of claim 1, wherein said electrically conductive metal adhesion layer has a thickness from about 0.02 to about 0.10 micron, and preferably between about 0.02 to about 0.03 micron.
Claim 15
Dependent Claim
29 words
The structure of claim 1, wherein said non-noble metal layer has a thickness from about 1.00 to about 8.00 micron, and preferably between about 2.00 to about 6.00 micron.
Claim 16
Dependent Claim
30 words
The structure of claim 1, wherein said electrically conductive metal adhesion layer is selected from a group consisting of chromium, tantalum, titanium, tungsten, hafnium, molybdenum, vanadium, zirconium and mixtures thereof.
Claim 17
Dependent Claim
28 words
The structure of claim 1, wherein said titanium layer has a thickness from about 0.02 to about 2.00 micron, and preferably between about 0.50 to about 1.50 micron.
Claim 18
Dependent Claim
28 words
The structure of claim 1, wherein said molybdenum layer has a thickness from about 0.02 to about 2.00 micron, and preferably between about 0.50 to about 1.50 micron.
Claim 19
Dependent Claim
33 words
The structure of claim 1, wherein said noble or relatively less noble metal layer has a thickness from about 0.5 to about 5.00 micron and preferably between about 1.00 to about 5.00 micron.
Claim 20
Dependent Claim
52 words
The structure of claim 1, wherein said titanium layer has a thickness from about 0.02 to about 2.00 micron, and preferably between about 0.50 to about 1.50 micron, and wherein said molybdenum layer has a thickness from about 0.20 to about 2.00 micron, and preferably between about 0.50 to about 1.50 micron.
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