Patent US5362534A successfully refreshed from Google Patents.
US5362534A
Expired / Lapsed
US
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Multiple layer printed circuit boards and method of manufacture
Assignee: Isola USA Corp
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Filing: 1993-08-23
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Granted: 1994-11-08
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Expires: 2013-08-23
Abstract
Abstract A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer. A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.
Inventors
- 👤 Darryl J. McKenney
- 👤 Robert D. Cyr
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:09
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; B; B32; B32B; B32B3/00; B05; B05D; B05D5/00; B05D5/12; B32B27/00; B32B27/14; H05K3/4626; H05K3/4644; H05K3/4652; H05K3/4655; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0195; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0358; H05K3/4688; H05K3/4691; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49163; Y10T428/00; Y10T428/14; Y10T428/1438; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31511; Y10T428/31515; Y10T428/31522
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
88 words
A printed circuit board comprises: a coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil wherein said cured adhesive layer corresponds to a dielectric distance control layer; and a semi-cured adhesive layer disposed over the cured adhesive layer; and a substrate having a first surface with a strip conductor disposed thereon and having a second opposing surface, wherein the first surface of said substrate is disposed against the semi-cured adhesive layer of said conductive foil layer.
Claim 2
Dependent Claim
88 words
A printed circuit board comprises: a coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil wherein said cured adhesive layer corresponds to a dielectric distance control layer; and a semi-cured adhesive layer disposed over the cured adhesive layer; and a substrate having a first surface with a strip conductor disposed thereon and having a second opposing surface, wherein the first surface of said substrate is disposed against the semi-cured adhesive layer of said conductive foil layer.
Claim 3
Dependent Claim
21 words
The printed circuit board of claim 1 wherein said cured and semi-cured adhesive layers are provided having substantially equal dielectric constants.
Claim 4
Dependent Claim
23 words
The printed circuit board of claim 2 wherein said cured and semi-cured adhesive layers are provided having substantially equal coefficients of thermal expansion.
Claim 5
Dependent Claim
69 words
The printed circuit board of claim 2 wherein: the first surface of said substrate corresponds to an inner layer of said printed circuit board; and said coated conductive foil layer is a first one of a plurality of like coated conductive foil layers wherein a semi-cured adhesive level of a second one of said plurality of coated conductive foil layers is disposed against the second surface of said substrate.
Claim 6
Dependent Claim
43 words
The printed circuit board of claim 4 wherein the second surface of said substrate has a conductor disposed thereon and wherein the semi-cured adhesive layer of said second coated conductive foil layer flows around the conductor on the second surface of said substrate.
Claim 7
Dependent Claim
30 words
The printed circuit board of claim 5 wherein a plurality of such printed circuit boards may be stacked and simultaneously drilled after bonding together said plurality said printed circuit boards.
Claim 8
Dependent Claim
163 words
A flexible printed circuit board comprising: a first coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil wherein said cured adhesive layer corresponds to a dielectric distance control layer; and a semi-cured adhesive layer disposed over the cured adhesive layer; a substrate having a first surface with a strip conductor disposed thereon and a second opposing surface, wherein the first surface of said substrate is disposed against the semi-cured adhesive layer of said conductive foil layer; and a second coated conductive foil layer disposed against the second surface of said substrate said second coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil wherein said cured adhesive layer corresponds to a dielectric distance control layer: and a semi-cured adhesive layer disposed over the cured adhesive layer wherein said semi-cured adhesive layer is disposed against the second surface of said substrate.
Claim 9
Dependent Claim
163 words
A flexible printed circuit board comprising: a first coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil wherein said cured adhesive layer corresponds to a dielectric distance control layer; and a semi-cured adhesive layer disposed over the cured adhesive layer; a substrate having a first surface with a strip conductor disposed thereon and a second opposing surface, wherein the first surface of said substrate is disposed against the semi-cured adhesive layer of said conductive foil layer; and a second coated conductive foil layer disposed against the second surface of said substrate said second coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil wherein said cured adhesive layer corresponds to a dielectric distance control layer: and a semi-cured adhesive layer disposed over the cured adhesive layer wherein said semi-cured adhesive layer is disposed against the second surface of said substrate.
Claim 10
Dependent Claim
22 words
The flexible printed circuit board of claim 7 wherein said cured and semi-cured adhesive layers are provided having substantially equal dielectric constants.
Claim 11
Dependent Claim
24 words
The flexible printed circuit board of claim 8 wherein said cured and semi-cured adhesive layers are provided having substantially equal coefficients of thermal expansion.
Claim 12
Dependent Claim
16 words
The flexible printed circuit board of claim 9 wherein said substrate is provided from an epoxy.
Claim 13
Dependent Claim
46 words
The flexible printed circuit board of claim 10 wherein said substrate is provided having a conductor disposed on the second surface and wherein the semi-cured adhesive layer of the Second coated conductive foil layer flows around the conductor disposed on the second surface of said substrate.
Claim 14
Dependent Claim
139 words
A rigid-flex printed circuit board comprising a first coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil; and a semi-cured adhesive layer disposed over the cured adhesive layer; a substrate having a first Surface with a strip conductor disposed thereon and a second opposing surface, wherein the first surface of said substrate is disposed against the semi-cured adhesive layer of said conductive foil layer; and a second coated conductive foil layer disposed against the second surface of said substrate said second coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil; and a semi-cured adhesive layer disposed over the cured adhesive layer wherein the semi-cured adhesive layer is disposed against the second surface of said substrate.
Claim 15
Dependent Claim
139 words
A rigid-flex printed circuit board comprising a first coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil; and a semi-cured adhesive layer disposed over the cured adhesive layer; a substrate having a first Surface with a strip conductor disposed thereon and a second opposing surface, wherein the first surface of said substrate is disposed against the semi-cured adhesive layer of said conductive foil layer; and a second coated conductive foil layer disposed against the second surface of said substrate said second coated conductive foil layer including: a conductive foil; a cured adhesive layer disposed on a first surface of said conductive foil; and a semi-cured adhesive layer disposed over the cured adhesive layer wherein the semi-cured adhesive layer is disposed against the second surface of said substrate.
Claim 16
Dependent Claim
39 words
The rigid-flex printed circuit board of claim 12 wherein said substrate is provided having a conductor disposed on the second surface thereof and wherein the semi-cured adhesive layer of the second coated conductive foil layer flows around the conductor.
Claim 17
Dependent Claim
24 words
The rigid-flex printed circuit board of claim 13 wherein said first and second coated conductive layers and said substrate are provided from nonwoven materials.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-07 | 1998-05-09 | 1998-11-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-07 | 2002-05-09 | 2002-11-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-07 | 2006-05-09 | 2006-11-08 | $7700.00 | Window Closed / Lapsed |